JIN HWA KIM
Pilots at Lone Oak St, Beaverton, OR

License number

Oregon A5287954

Issued Date

Jan 2016

Expiration Date

Jan 2017

Professional information

System For Utilizing Object Oriented Approach In A Portable Pen-Based Data Acquisition System By Passing Digitized Data By Data Type To Hierarchically Arranged Program Objects

US Patent:

5630168, May 13, 1997

Filed:

Oct 27, 1992

Appl. No.:

7/966996

Inventors:

Christopher Rosebrugh - Lake Oswego OR
Jin H. Kim - Beaverton OR

Assignee:

PI Systems Corporation - Portland OR

International Classification:

G06F 1740, G06K 922

US Classification:

395825

Abstract:

An object oriented database data acquisition device having a housing with at least one substantially planar surface and a video screen positioned thereon. The device includes a digitizer positioned substantially coextensively under the video screen and a pen having a power source for activating the digitizer. Means for controlling the data acquisition device includes controllers comprising a first microprocessor, a second microprocessor connected to said digitizer and first processor for scanning the digitizer, a third microprocessor connected to said video screen for controlling screen images, a power manager connected to the first processor, the power manager including a power source and controller, program storage, and a program stored in the program storage for controlling the microprocessors.

Stacked Memory With Interface Providing Offset Interconnects

US Patent:

2013027, Oct 17, 2013

Filed:

Dec 2, 2011

Appl. No.:

13/997148

Inventors:

Pete Vogt - Boulder CO, US
Andre Schaefer - Braunschweig, DE
Warren Morrow - Steilacoom WA, US
John Halbert - Beaverton OR, US
Jin Kim - Beaverton OR, US
Kenneth Shoemaker - Los Altos Hills CA, US

Assignee:

INTEL CORPORATION - Santa Clara CA

International Classification:

G11C 5/06, H01L 23/48

US Classification:

365 63, 257774

Abstract:

Dynamic operations for operations for a stacked memory with interface providing offset interconnects. An embodiment of memory device includes a system element and a memory stack coupled with the system element, the memory stack including one or more memory die layers. Each memory die layer includes first face and a second face, the second face of each memory die layer including an interface for coupling data interface pins of the memory die layer with data interface pins of a first face of a coupled element. The interface of each memory die layer includes connections that provide an offset between each of the data interface pins of the memory die layer and a corresponding data interface pin of the data interface pins of the coupled element.