JIAN WANG
Accountancy in Fremont, CA
License number
Massachusetts 26764
Issued Date
Sep 1, 2009
Expiration Date
Jun 30, 2011
Type
Certified Public Accountant
Address
Address
Fremont, CA 94555
Professional information
Jian Wang - Fremont, CA
Work:
TE Connectivity Technology Group
Staff Scientist and Program/project Leader Argonne National Laboratory - Argonne, IL, US
Post-doctoral Research Associate Michigan State University
Graduate Research Assistant, Department of Chemistry
Staff Scientist and Program/project Leader Argonne National Laboratory - Argonne, IL, US
Post-doctoral Research Associate Michigan State University
Graduate Research Assistant, Department of Chemistry
Education:
Michigan State University - East Lansing, MI
Ph.D in Chemistry Fudan University
M.S. in Physical Chemistry Fudan University
B.S. in Applied Chemistry
Ph.D in Chemistry Fudan University
M.S. in Physical Chemistry Fudan University
B.S. in Applied Chemistry
Electrical Connector Having A Magnetic Assembly
US Patent:
8591261, Nov 26, 2013
Filed:
Aug 1, 2011
Appl. No.:
13/195356
Inventors:
Jaydip Das - Cupertino CA, US
Jian Wang - Fremont CA, US
Na An - Mountain View CA, US
Randy K. Rannow - Reno NV, US
Mark W. Ellsworth - Dublin CA, US
Jian Wang - Fremont CA, US
Na An - Mountain View CA, US
Randy K. Rannow - Reno NV, US
Mark W. Ellsworth - Dublin CA, US
Assignee:
Tyco Electronics Corporation - Berwyn PA
International Classification:
H01R 13/66
US Classification:
43962005, 439676
Abstract:
An electrical connector includes a housing having a plug cavity configured to receive a modular plug therein. A terminal assembly is coupled to the housing. The terminal assembly has a plurality of terminals configured to engage corresponding terminals of the modular plug. The electronic connector includes a magnetic assembly that has a circuit board. The terminals are terminated to the circuit board. The magnetic assembly has magnetic circuits coupled to the circuit board. Each magnetic circuit has a ferrous portion and conductors circumferentially wrapped around the ferrous portion. At least one of the magnetic circuits is coated with a coating material that includes a matrix and filler. The filler can have a higher or lower dielectric constant than the matrix. The dielectric characteristics of the nano-composite can be tuned by varying the concentrations of the filler and matrix material. This tunable nano-composite can serve as an additional design knob for better impedance matching for the magnetic connectors over a wide frequency range.
Electrical Conductors Having Organic Compound Coatings
US Patent:
2012027, Nov 1, 2012
Filed:
Feb 24, 2012
Appl. No.:
13/404711
Inventors:
Jessica Henderson Brown Hemond - Mifflintown PA, US
Andrew Nicholas Loyd - Dillsburg PA, US
Rodney Ivan Martens - Mechanicsburg PA, US
Jian Wang - Fremont CA, US
Andrew Nicholas Loyd - Dillsburg PA, US
Rodney Ivan Martens - Mechanicsburg PA, US
Jian Wang - Fremont CA, US
Assignee:
Tyco Electronics Corporation - Berwyn PA
International Classification:
B32B 15/04, B82Y 30/00
US Classification:
1741262, 977932
Abstract:
An electrical conductor includes a metallic substrate having a surface and an organic compound coating deposited on the surface. The organic compound coating may comprise a graphene coating, a carbon nanotube (CNT) coating or a blended graphene/CNT coating. The organic compound coating defines a separable interface of the electrical conductor configured to be mated to and unmated from a mating conductor. The organic compound coating is electrically conductive. The organic compound coating has a lower friction coefficient than the surface of the metallic substrate.
Electropolishing And Electroplating Methods
US Patent:
2006004, Mar 9, 2006
Filed:
Apr 11, 2003
Appl. No.:
10/510656
Inventors:
Hui Wang - Fremont CA, US
Jian Wang - Fremont CA, US
Peihaur Yih - Boonton NJ, US
Huiquan Wu - Rockville MD, US
Jian Wang - Fremont CA, US
Peihaur Yih - Boonton NJ, US
Huiquan Wu - Rockville MD, US
Assignee:
ACM Research, Inc. - Fremont CA
International Classification:
C25D 7/12
US Classification:
205123000, 205157000
Abstract:
In one aspect of the present invention, an exemplary method is provided for electroplating a conductive film on a wafer. The method includes electroplating a metal film on a semiconductor structure having recessed regions and non-recessed regions within a first current density range before the metal layer is planar above recessed regions of a first density, and electroplating within a second current density range after the metal layer is planar above the recessed regions. The second current density range is greater than the first current density range. In one example, the method further includes electroplating in the second current density range until the metal layer is planar above recessed regions of a second density, the second density being greater than the first density, and electroplating within a third current density range thereafter.
Apparatus And Method Of Exact Time Framing In A Dmb-Th Transmitter
US Patent:
2008027, Nov 6, 2008
Filed:
May 4, 2007
Appl. No.:
11/744828
Inventors:
LIN YANG - FREMONT CA, US
HAIYUN YANG - FREMONT CA, US
EDWARD YU - FREMONT CA, US
JIAN WANG - FREMONT CA, US
HAIYUN YANG - FREMONT CA, US
EDWARD YU - FREMONT CA, US
JIAN WANG - FREMONT CA, US
Assignee:
LEGEND SILICON CORP. - FREMONT CA
International Classification:
H04L 7/00
US Classification:
375368, 375E01037
Abstract:
A transmitter comprising: a digital encoder for encoding incoming digital information; and a digital to analog converter for converting the encoded digital information into analog information is described. The transmitter further comprises an exact time framing block disposed between the digital encoder and the digital to analog converter. The exact time framing block receives the digitally encoded information and comprises a method for synchronization. The method including the steps of: providing a clock signal having at least two adjacent pulses; providing information subjected to transmission in the form of a set of frames; and accommodating a whole number of frames between the two adjacent pulses.
Graphene And Graphene Oxide Aerogels
US Patent:
2010014, Jun 10, 2010
Filed:
Dec 4, 2008
Appl. No.:
12/315701
Inventors:
Jian Wang - Fremont CA, US
Mark W. Ellsworth - Dublin CA, US
Mark W. Ellsworth - Dublin CA, US
Assignee:
TYCO ELECTRONICS CORPORATION - Berwyn PA
International Classification:
B01J 13/00
US Classification:
516 98
Abstract:
A carbon-based aerogel is disclosed in which the carbon atoms are arranged in a sheet-like nanostructure. The aerogel may be either a graphene oxide aerogel or a graphene aerogel and may further be reinforced with a polymer. A method for making the aerogel is also disclosed and includes providing graphite oxide, creating a dispersion of the graphite oxide in a liquid, and drying the dispersion to form a graphene oxide aerogel. In one embodiment, the graphene oxide aerogel is thermally treated to convert the graphene oxide to graphene.
Method For Applying Carbon/Tin Mixtures To Metal Or Alloy Layers
US Patent:
2013000, Jan 3, 2013
Filed:
Oct 1, 2010
Appl. No.:
13/511646
Inventors:
Udo Adler - Koblenz, DE
Dirk Rode - Osnabruck, DE
Isabell Buresch - Illertissen, DE
Jian Wang - Fremont CA, US
Dominique Freckmann - San Francisco CA, US
Helge Schmidt - Speyer, DE
Dirk Rode - Osnabruck, DE
Isabell Buresch - Illertissen, DE
Jian Wang - Fremont CA, US
Dominique Freckmann - San Francisco CA, US
Helge Schmidt - Speyer, DE
International Classification:
H01B 1/02, B05D 5/12, B32B 15/02, B32B 9/00, B32B 3/10, B82Y 40/00, B82Y 30/00
US Classification:
428208, 428323, 427122, 428457, 252503, 977742, 977734, 977842, 977773, 977932
Abstract:
The invention relates to a method for applying to a substrate a coating composition containing carbon in the form of carbon nanotubes, graphenes, fullerenes, or mixtures thereof and metal particles. The invention further relates to the coated substrate produced by the method according to the invention and to the use of the coated substrate as an electromechanical component.
Controlling Removal Rate Uniformity Of An Electropolishing Process In Integrated Circuit Fabrication
US Patent:
2007012, Jun 7, 2007
Filed:
Feb 23, 2005
Appl. No.:
10/590460
Inventors:
Hui Wang - Fremont CA, US
Afnan Muhammed - Fremont CA, US
Jian Wang - Fremont CA, US
Felix Gutman - San Jose CA, US
Frederick Ho - San Jose CA, US
Afnan Muhammed - Fremont CA, US
Jian Wang - Fremont CA, US
Felix Gutman - San Jose CA, US
Frederick Ho - San Jose CA, US
Assignee:
ACM RESEARCH INC. - FREMONT CALIFORNIA CA
International Classification:
B23H 3/00
US Classification:
205651000
Abstract:
A metal layer formed on a wafer, the wafer having a center portion and an edge portion, is electropolished by aligning a nozzle and the wafer to position the nozzle adjacent to the center portion of the wafer. The wafer is rotated. As the wafer is rotated, a stream of electrolyte is applied from the nozzle onto a portion of the metal layer adjacent to the center portion of the wafer to begin to electropolish the portion of the metal layer with a triangular polishing profile to initially expose an underlying layer underneath the metal layer at a point.