MS. JENNIFER Y LU, PHARMD
Pharmacy at Mckee Rd, San Jose, CA

2002016, Nov 14, 2002

May 10, 2001

09/853345

Robert Fontana - San Jose CA, US
Jordan Katine - San Jose CA, US
Jennifer Lu - San Jose CA, US
Scott MacDonald - San Jose CA, US
Michael Rooks - Briarcliff Manor NY, US
Hugo Santini - San Jose CA, US

G11B005/39

360/313000, 029/603140

A suspended resist bridge suitable for lithographically patterning MR sensors having trackwidths narrower than 0.2 micron is fabricated using the method of the present invention. First, PMGI is spun onto a substrate to form a first thin resist layer. Next, PMMA is spun onto the first resist layer to form a second resist layer. The PMMA layer is exposed to an electron beam to pattern the trackwidth of the MR sensors. E-beam exposed PMMA is then developed in an IPA solution. The resist structure is then placed in a basic solution for dissolving PMGI, which results in a fully undercut resist bridge that is used for patterning the MR sensors.

2002018, Dec 19, 2002

Aug 12, 2002

10/217921

Jennifer Lu - San Jose CA, US
Scott MacDonald - San Jose CA, US
Hugo Emilio Santini - San Jose CA, US

INTERNATIONAL BUSINESS MACHINES CORPORATION

G11B005/127, B05D005/12, B05D001/36, H04R031/00, B05D001/32

029/603150, 427/264000, 427/058000, 427/272000, 427/407100, 029/603070, 029/603180

A bilayer mask employed for lift off has a top strip which bridges between first and second bilayer portions and is completely undercut so that when one or more materials is sputter deposited the materials do not form fences abutting recessed edges of a bottom layer in undercuts below a top layer. Sacrificial protective layers are formed on a sensor and lead layers for protecting these components while overlapping portions of these materials on the top of the sensor formed during deposition can be removed by ion beam sputtering, after which the sacrificial protective layers can be removed by ion milling or reactive ion etching.

7223350, May 29, 2007

Mar 29, 2002

10/109929

Ping-Wei Chang - San Jose CA, US
Brad Lee Jackson - San Diego CA, US
Bulent Nihat Kurdi - San Jose CA, US
Jennifer Lu - San Jose CA, US
Dennis Richard McKean - San Jose CA, US
Eun Kyoung Row - San Jose CA, US

International Business Machines Corporation - Armonk NY

B44C 1/22

216 22

A process to reduce step heights in planarization of thin film carriers in an encapsulation system. The improvements include using an adhesive tape having a thinner adhesive thickness and a stiffer tape for the film sealing the encapsulant on the carrier to result in a low step height surface transition between the carrier and the cured encapsulant. The composition of the encapsulant is modified to reduce the shrinkage upon curing of the encapsulant. The encapsulant may include an absorbent that absorbs the irradiation and cause the top surface to harden first compared to the bulk of the encapsulant, and/or a gas-emitting additive that creates gaseous products that expand upon irradiation to thereby reduce the shrinkage of the encapsulant upon curing. Alternatively, irradiation at very low incidence angle relative to the top surface of the encapsulant causes the top surface to harden before the bulk of the encapsulant.

2006023, Oct 19, 2006

Jun 21, 2006

11/425666

Ping-Wei Chang - San Jose CA, US
Brad Jackson - San Diego CA, US
Bulent Kurdi - San Jose CA, US
Jennifer Lu - San Jose CA, US
Dennis McKean - San Jose CA, US
Eun Row - San Jose CA, US

G11B 5/60

360235800

A process to reduce step heights in planarization of thin film carriers in an encapsulation system. The improvements include using an adhesive tape having a thinner adhesive thickness and a stiffer tape for the film sealing the encapsulant on the carrier to result in a low step height surface transition between the carrier and the cured encapsulant. The composition of the encapsulant is modified to reduce the shrinkage upon curing of the encapsulant. The encapsulant may include an absorbent that absorbs the irradiation and cause the top surface to harden first compared to the bulk of the encapsulant, and/or a gas-emitting additive that creates gaseous products that expand upon irradiation to thereby reduce the shrinkage of the encapsulant upon curing. Alternatively, irradiation at very low incidence angle relative to the top surface of the encapsulant causes the top surface to harden before the bulk of the encapsulant.

6995952, Feb 7, 2006

Mar 12, 2001

09/804105

Norbert A. Feliss - Sunnyvale CA, US
Yiyun Huang - Milpitas CA, US
Jennifer Lu - San Jose CA, US
Wing Tsang Tang - Palo Alto CA, US

Hitachi Global Storage Technologies Netherlands B.V. - Amsterdam

G11B 5/60

3602353

A slider in a disk drive is shock-protected with an overcoat layer of either metal or polymer directly on the areas of the slider that are prone to contact the disk when the slider is loaded off the platform, or when the slider is shocked while in operation over the data zone of the disk. The material used to form the layer absorbs shock and reduces wear, and is bonded or sputtered to the head in a region other than the pads of the air bearing surface. This region is typically the reactive ion etched (RIE) surface area and is slightly below the pads of the air bearing surface of the head. In an alternate version of the invention, the slider is protected by covering only the edges of the slider with a suitable material. Finally, the entire slider may be encased with the overcoating except for the pads of the air bearing surface.

7052618, May 30, 2006

Jan 28, 2004

10/766639

Nicolas J. Moll - Woodside CA, US
Daniel B. Roitman - Menlo Park CA, US
Jennifer Q. Lu - San Jose CA, US

Agilent Technologies, Inc. - Palo Alto CA

B44C 1/22

216 11, 216 41, 430322, 977700, 977773

Nanostructures and methods of making the same are described. In one aspect, a film including a vector polymer comprising a payload moiety is formed on a substrate. The film is patterned. Organic components of the patterned film are removed to form a payload-comprising nanoparticle.

7236328, Jun 26, 2007

Jan 10, 2001

09/758939

Jennifer Lu - San Jose CA, US
Dennis Richard McKean - San Jose CA, US
Cherngye Hwang - San Jose CA, US
Shi Ning - San Jose CA, US

Hitachi Global Storage Netherlands, B.V. - Amsterdam

G11B 15/64

3602351, 3602352, 3602353, 3602354, 3602355

The present invention relates to a method for producing a transducer slider. The method involves first coating a substrate with a radiation-sensitive layer and exposing the radiation-sensitive layer to radiation according to an intensity pattern. Preferably, the intensity pattern is provided using a grayscale mask. Once the image is developed into the radiation-sensitive layer, the image is transferred into the substrate to form a transducer slider having a surface profile comprising a tapered edge. In the alternative or in addition, the surface profile may comprise a rounded corner. The invention also relates to a structure for forming a transducer slider.

7022452, Apr 4, 2006

Sep 4, 2002

10/234931

Jennifer Lu - San Jose CA, US

Agilent Technologies, Inc. - Palo Alto CA

G03F 7/004, G03F 7/012, G03F 7/30

430156, 430157, 430162, 4302731, 430326, 430512

Contrast enhanced photolithography methods and devices formed by the same are described. In accordance with these methods, a photoresist layer is formed on a substrate. A contrast enhancing system including a solution or dispersion of a photobleachable dye is formed on the photoresist layer. The photoresist layer is exposed through an imaging pattern and through the contrast enhancing system to radiation having a wavelength between about 230 nm and about 300 nm. The contrast enhancing layer is removed, and the photoresist layer is developed to form a photoresist pattern on the substrate. The contrast enhancing system may be removed and the photoresist layer may be developed in a single process step or in different process steps.