JEFFREY STEPHEN DUHAIME
Pilots at Coachman Ln, New Haven, CT
License number
Connecticut A0508040
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
28 Coachman Ln, New Haven, CT 06524
Professional information
Heat-Control Process And Apparatus For Attachment/Detachment Of Soldered Components
US Patent:
5553768, Sep 10, 1996
Filed:
Feb 24, 1995
Appl. No.:
8/394138
Inventors:
Clifford S. Lasto - Woodbridge CT
Jeffrey S. Duhaime - Bethany CT
Jeffrey S. Duhaime - Bethany CT
Assignee:
Air-Vac Engineering Company, Inc. - Seymour CT
International Classification:
H05K 334, B23K 100
US Classification:
228102
Abstract:
Process, apparatus and nozzle device for controlling the soldering and/or desoldering of a land grid array (LGA) component and corresponding circuit grid present on the surface of a printed circuit board (PCB). The nozzle device comprises a vacuum cup for supporting the LGA parallel to the PCB, with the LGA and the circuit grid in contact or slightly spaced, a fixed orifice gap for directing hot inlet gas from a gas source horizontally through the array, a gas outlet, and a thermocouple for sensing the temperature of the hot outlet gas and for signaling a computer to actuate a heater and a flow rate regulator. According to a preferred embodiment, this increases the temperature and decreases the flow rate of the hot gas through the array when a predetermined gas outlet temperature is sensed at the thermocouple. Uniform slower circulation of the hotter gas is continued for the desired dwell time to produce uniform, simultaneous melting of the solder array to permit bonding to or desoldering from the circuit array of the PCB while supporting the component parallel to the PCB.
Differential Multi-Flow Control Nozzles, Apparatus And Process
US Patent:
5785237, Jul 28, 1998
Filed:
Aug 30, 1996
Appl. No.:
8/708040
Inventors:
Clifford S. Lasto - Woodbridge CT
Jeffrey S. Duhaime - Bethany CT
Brian P. Czaplicki - Oxford CT
David J. Guzowski - Orange CT
Jeffrey S. Duhaime - Bethany CT
Brian P. Czaplicki - Oxford CT
David J. Guzowski - Orange CT
Assignee:
Air-Vac Engineering Company, Inc. - Seymour CT
International Classification:
B23K 1012, B23K 1018
US Classification:
22818022
Abstract:
Process, apparatus and nozzle device are available for controlling the soldering/and or desoldering of a land grid array (LGA) component and corresponding circuit grid present in the surface of a printed circuit board (PCB). The nozzle device comprises a vacuum cup for supporting the LGA parallel to the PCB, with the LGA and the circuit grids in contact or slightly spaced, a device for directing a continuous flow of an inert hot gas, such as nitrogen, from a gas source against the upper surface of a dielectric body of a component to conduct heat therethrough to melt an underlying LGA, vents for venting the major volume of the hot gas, adjacent the upper surface of the body of the component, and one or more vertical passages for directing a minor volume of the total gas flow from the upper surface of the component around the edges, under and horizontally through the array into a discharge chamber, and out a gas outlet. A thermocouple preferably is located at the gas outlet for sensing the temperature of the minor volume of the hot outlet gas and regulating the process, thereby avoiding exposing the melted array to the possibly disruptive force of the total hot gas flow.