Jeffrey L Deeney
Engineers at Colt Ct, Fort Collins, CO

6541710, Apr 1, 2003

Nov 16, 2001

09/991430

Jeffrey L. Deeney - Fort Collins CO
David W. Mayer - Fort Collins CO

Hewlett-Packard Company - Palo Alto CA

H05K 103

174255, 29739, 257697, 361770

A column grid array integrated circuit package has a substrate. The substrate has a solder column array having a plurality of solder columns and a plurality of rigid columns interspersed with the solder columns at no-connect locations. The rigid columns contact a circuit board to which the column grid array integrated circuit package is mounted and support the column grid array integrated circuit package against compressive force.

6549418, Apr 15, 2003

Sep 26, 2001

09/965281

Jeffrey L. Deeney - Fort Collins CO

Hewlett Packard Development Company, L.P. - Houston TX

H05K 100

361736, 361767, 361768, 361769, 361787

An integrated circuit device module comprises a printed circuit board having opposed sides, the printed circuit board comprising a portion carrying an area contact array on one of the sides of the printed circuit board. The module comprises an integrated circuit device having opposed, top and bottom surfaces, the bottom surface of the integrated circuit device comprising an area contact array for electrical communication with the area contact array on the printed circuit board. The module further comprises a clamping mechanism for compressively urging the area contact array on the bottom surface of the integrated circuit device into electrical communication with the area contact array on the portion of the printed circuit board, the forces applied by the clamping mechanism tending to deflect the portion of the printed circuit board and cause the area contact array on the bottom surface of the integrated circuit device to lose electrical communication with the area contact array on the integrated circuit device. A biasing structure is coupled to the printed circuit board for counteracting the forces applied by the clamping mechanism and the resulting tendency of the portion of the printed circuit board to deflect.

6710264, Mar 23, 2004

Nov 16, 2001

09/994004

Jeffrey L. Deeney - Fort Collins CO
Joseph D. Dutson - Loveland CO
Richard J. Luebs - Windsor CO

Hewlett-Packard Development Company, L.P. - Houston TX

H05K 116

174260, 361783

A circuit board assembly having a circuit board and a column grid array (“CGA”) integrated circuit package. The CGA package has a substrate having an array of solder columns extending from a bottom surface. A frame surrounds the CGA integrated circuit package and is affixed thereto. The frame extends from the substrate to a portion of the circuit board when the column grid array integrated circuit package is mounted on the circuit board to support the column grid array integrated circuit package. The frame is affixed to the CGA integrated circuit package by adhesive after the CGA integrated circuit package is mounted on the circuit board, the adhesive accommodating any variations in height of the CGA integrated circuit package.

6813162, Nov 2, 2004

Nov 16, 2001

09/992864

Jeffrey L. Deeney - Fort Collins CO

Hewlett-Packard Development Company, L.P. - Houston TX

H05K 118

361762, 361803, 361720, 361730, 361758

A circuit board assembly has a circuit board and a column grid array (“CGA”) integrated circuit package. The CGA integrated circuit package has a substrate having an array of solder columns extending from a bottom surface. An oversized lid is affixed to the substrate. Support shims are disposed between a portion of the lid that extends beyond an outer periphery of the substrate and a circuit board to which the CGA integrated circuit package is mounted. The support shims are affixed to the lid with adhesive after the CGA integrated circuit package is mounted on the circuit board. The adhesive accommodates any variations in height in the CGA integrated circuit package.

6600661, Jul 29, 2003

Apr 8, 2002

10/118418

Jeffrey L. Deeney - Fort Collins CO

Hewlett-Packard Development Company, L.P. - Houston TX

H05K 714

361801, 361704, 361715, 361707, 361825, 361764, 257726, 257718, 257719

A support assembly useful for supporting an integrated circuit package having an array of solder columns extending to a circuit board when the integrated circuit package is mounted on the circuit board. The support assembly includes a support member for supporting the integrated circuit package and having a ramped surface. A biasing member associated with the support member couples the ramped surface to the integrated circuit package such that the support member resists downward movement of the integrated circuit package. The support member may include a plurality of support members with ramped surfaces which cooperate to raise a combined height of the support members. A related method of supporting an integrated circuit package is also provided.

6791184, Sep 14, 2004

Jul 23, 2002

10/202416

Jeffrey L Deeney - Fort Collins CO
Laszlo Nobi - Fort Collins CO
Joseph D. Dutson - Loveland CO

Hewlett-Packard Development Company, L.P. - Houston TX

H01L 2334

257726, 257727, 257730, 257732, 361740, 361743, 361759, 361801

A support assembly for supporting an integrated circuit package with an array of solder columns extending from a bottom surface of the integrated circuit package to a circuit board preferably includes: a pair of shims for supporting the integrated circuit package, the shims being positioned along opposite edges of the integrated circuit package and placed between and abutting the integrated circuit package and the circuit board; and a retention clip for aligning and securing in place the pair of shims.

2005001, Jan 27, 2005

Aug 25, 2004

10/925629

Jeffrey Deeney - Fort Collins CO, US

H01L023/52

257704000

A circuit board assembly has a circuit board and a column grid array (“CGA”) integrated circuit package. The CGA integrated circuit package has a substrate having an array of solder columns extending from a bottom surface. An oversized lid is affixed to the substrate. The method of supporting the CGA integrated circuit package includes disposing support shims between a portion of the lid that extends beyond an outer periphery of the substrate and a circuit board to which the CGA integrated circuit package is mounted. The support shims are affixed to the lid with adhesive after the CGA integrated circuit package is mounted on the circuit board. The adhesive accommodates any variations in height in the CGA integrated circuit package.

2003002, Jan 30, 2003

Jul 25, 2001

09/915071

Jeffrey Deeney - Fort Collins CO, US

H01L023/10

257/706000, 257/712000, 257/717000

The overall thermal resistance of a semiconductor device package containing a semiconductor die such as a VLSI IC die is reduced so as to improve the thermal performance of the package without any modification of the basic package structure. An extension of inactive or substantially inactive semiconductor material is added to the die adjacent to the boundary of a heat dissipating active circuit area on the die thereby increasing the effective heat transfer area of the die and establishing a heat spreading flow path to conduct heat away from the active circuit area.

5521425, May 28, 1996

Dec 21, 1990

7/633591

Jeffrey L. Deeney - Fort Collins CO

Hewlett-Packard Company - Palo Alto CA

H01L 2348, H01L 2352, H01L 2940, H01L 2328

257666

A tape automated bonded circuit comprising a flexible substrate having an opening defined by a peripheral sidewall. A plurality of conductive traces are provided on the flexible substrate which terminate in a plurality of leads which extend into alignment with the opening. An electronic device having a plurality of pad regions is aligned with the opening in the substrate. The leads are bonded to the pad regions. A continuous encapsulation layer which touches the peripheral side wall of the substrate opening on all sides encapsulatingly covers the bonded leads and pad regions and structurally reinforces each lead along the entire length which projects over the opening.