Inventors:
Jeffrey A. Lev - Tomball TX, US
Mark S. Tracy - Tomball TX, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
H05K 7/20
US Classification:
361704, 165 802, 165185, 361708, 361713
Abstract:
Carrier device for placement of thermal interface materials. At least some embodiments are systems including a first electrical component that defines a first surface at a first elevation relative to an underlying structure, a second electrical component that defines a second surface at a second elevation relative to the underlying structure, a metallic member configured to conduct heat from the electrical components, and a carrier between the electrical components and the metallic member. The carrier includes a third and fourth surface configured to mate with the first and second surfaces, respectively, a first aperture through the third surface, and a second aperture through the fourth surface. The system further includes a first thermal interface material coupled between the first electrical component and the metallic member through the first aperture, and a second thermal interface material coupled between the second electrical component and the metallic member through the second aperture.