Jean Vangsness
Broker in Stow, MA
License number
Massachusetts 9553490
Issued Date
Nov 16, 2016
Expiration Date
Jul 3, 2019
Type
Salesperson
Address
Address
Stow, MA 01775
Professional information
Polishing Pads Useful In Chemical Mechanical Polishing Of Substrates In The Presence Of A Slurry Containing Abrasive Particles
US Patent:
6656018, Dec 2, 2003
Filed:
Apr 10, 2000
Appl. No.:
09/545982
Inventors:
Oscar K. Hsu - Chelmsford MA
Jean K. Vangsness - Stow MA
Scott C. Billings - Kingston NH
David S. Gilbride - Lowell MA
Jean K. Vangsness - Stow MA
Scott C. Billings - Kingston NH
David S. Gilbride - Lowell MA
Assignee:
Freudenberg Nonwovens Limited Partnership - Durham NC
International Classification:
B24B 100
US Classification:
451 41, 451 42, 451285, 51294
Abstract:
A polishing pad for polishing semiconductors and other planar substrates in the presence of a slurry comprising abrasive particles and a dispersive agent is disclosed. The polishing pad includes a soluble component, preferably fibrous, within a polymer matrix component. The fibrous component includes fibers soluble in the slurry sufficiently to provide a void structure in the polishing surface of the pad. The void structure enhances the polishing rate and uniformity by increasing the mobility of the abrasive particles while reducing scratching of the polished surface. Additives that further enhance polishing and/or assist in the removal of residues generated during polishing, such as surfactants and removers, are optionally incorporated in the fibrous substance or topographically coated on the fibrous substance.
Polishing Pads With Polymer Filled Fibrous Web, And Methods For Fabricating And Using Same
US Patent:
6712681, Mar 30, 2004
Filed:
Nov 20, 2000
Appl. No.:
09/715184
Inventors:
Kenneth P. Rodbell - Sandy Hook CT
Oscar Kai Chi Hsu - Chelmsford MA
Jean Vangsness - Stow MA
David S. Gilbride - Lowell MA
Scott Clayton Billings - Kingston NH
Kenneth Davis - Newburgh NY
Oscar Kai Chi Hsu - Chelmsford MA
Jean Vangsness - Stow MA
David S. Gilbride - Lowell MA
Scott Clayton Billings - Kingston NH
Kenneth Davis - Newburgh NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B24D 1100
US Classification:
451532, 451536
Abstract:
A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The fibers define interstices, and the precursors fill these interstices substantially completely before completion of the reaction. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers. The fibers may be separate, or in the form of a woven or non-woven web.
Multilayered Polishing Pad, Method For Fabricating, And Use Thereof
US Patent:
6383066, May 7, 2002
Filed:
Jun 23, 2000
Appl. No.:
09/599514
Inventors:
Alex Siu Keung Chung - Marlborough MA
Oscar Kai Chi Hsu - Chelmsford MA
Kenneth P. Rodbell - Sandy Hook CT
Jean Vangsness - Stow MA
Oscar Kai Chi Hsu - Chelmsford MA
Kenneth P. Rodbell - Sandy Hook CT
Jean Vangsness - Stow MA
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B24D 1100
US Classification:
451532, 451533
Abstract:
A multilayered polishing pad especially suitable for chemical-mechanical polishing or planarizing metal, semiconductor or optical surfaces is provided. The invention allows the mechanical and polishing properties of the several layers to be independently varied.
Polishing Pads Useful In Chemical Mechanical Polishing Of Substrates In The Presence Of A Slurry Containing Abrasive Particles
US Patent:
6890244, May 10, 2005
Filed:
Sep 18, 2003
Appl. No.:
10/664735
Inventors:
Oscar K. Hsu - Chelmsford MA, US
Jean K. Vangsness - Stow MA, US
Scott C. Billings - Kingston NH, US
David S. Gilbride - Lowell MA, US
Jean K. Vangsness - Stow MA, US
Scott C. Billings - Kingston NH, US
David S. Gilbride - Lowell MA, US
Assignee:
Freudenberg Nonwovens Limited Partnership - Durham NC
International Classification:
B24B007/19
US Classification:
451 41, 451 42, 451287, 451296, 51294, 51389
Abstract:
A polishing pad for polishing semiconductors and other planar substrates in the presence of a slurry comprising abrasive particles and a dispersive agent is disclosed. The polishing pad includes a soluble component within a polymer matrix component. The soluble component includes particles soluble in the slurry sufficiently to provide a void structure in the polishing surface of the pad. The void structure enhances the polishing rate and uniformity by increasing the mobility of the abrasive particles while reducing scratching of the polished surface. Additives that further enhance polishing and/or assist in the removal of residues generated during polishing, such as surfactants and removers, are optionally incorporated in the soluble particles or topographically coated on the soluble particles.
Polishing Pads With Polymer Filled Fibrous Web, And Methods For Fabricating And Using Same
US Patent:
6989117, Jan 24, 2006
Filed:
Feb 23, 2004
Appl. No.:
10/782922
Inventors:
Kenneth P. Rodbell - Sandy Hook CT, US
Oscar Kai Chi Hsu - Chelmsford MA, US
Jean Vangsness - Stow MA, US
David S. Gilbride - Lowell MA, US
Scott Clayton Billings - Kingston NH, US
Kenneth Davis - Newburgh NY, US
Oscar Kai Chi Hsu - Chelmsford MA, US
Jean Vangsness - Stow MA, US
David S. Gilbride - Lowell MA, US
Scott Clayton Billings - Kingston NH, US
Kenneth Davis - Newburgh NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B29C 39/42
US Classification:
264102, 264139, 264255, 264257, 264258, 264324, 156245
Abstract:
A method of making a polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The fibers define interstices, and the precursors fill these interstices substantially completely before completion of the reaction. The method comprising placing the fibers and the precursors in a cavity of a mold for shaping the polishing pad; applying a differential pressure across a mold cavity, where the differential pressure and the amount of precursors are sufficient to cause the precursors to fill the interstices substantially completely before completion of the reaction; and applying sufficient heat to the mold to at least partially cure the polishing pad by causing the precursors to react.
Fiber Embedded Polishing Pad
US Patent:
7186166, Mar 6, 2007
Filed:
Nov 14, 2005
Appl. No.:
11/271744
Inventors:
Kenneth Davis - Newburgh NY, US
Oscar Kai Chi Hsu - Chelmsford MA, US
Kenneth Rodbell - Sandy Hook CT, US
Jean Vangsness - Stow MA, US
Oscar Kai Chi Hsu - Chelmsford MA, US
Kenneth Rodbell - Sandy Hook CT, US
Jean Vangsness - Stow MA, US
Assignee:
International Business Machines Corporation - Armonk NY
Freudenberg Nonwovens Ltd. - Lowell MA
Freudenberg Nonwovens Ltd. - Lowell MA
International Classification:
B24B 1/00
US Classification:
451 28, 451532
Abstract:
A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers.
Fiber Embedded Polishing Pad
US Patent:
6964604, Nov 15, 2005
Filed:
Apr 5, 2004
Appl. No.:
10/816882
Inventors:
Kenneth Davis - Newburgh NY, US
Oscar Kai Chi Hsu - Chelmsford MA, US
Kenneth Rodbell - Sandy Hook CT, US
Jean Vangsness - Stow MA, US
Oscar Kai Chi Hsu - Chelmsford MA, US
Kenneth Rodbell - Sandy Hook CT, US
Jean Vangsness - Stow MA, US
Assignee:
International Business Machines Corporation - Armonk NY
Freudenberg Nonwovens Ltd. - Lowell MA
Freudenberg Nonwovens Ltd. - Lowell MA
International Classification:
B24D011/00
US Classification:
451532, 451527, 451 41
Abstract:
A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers.
Polishing Pad
US Patent:
7534163, May 19, 2009
Filed:
Feb 28, 2008
Appl. No.:
12/039056
Inventors:
Jean Vangsness - Stow MA, US
Oscar Kai Chi Hsu - Chelmsford MA, US
Alaka Potnis - Hudson NH, US
Oscar Kai Chi Hsu - Chelmsford MA, US
Alaka Potnis - Hudson NH, US
Assignee:
innoPad, Inc. - Peabody MA
International Classification:
B24B 7/19
US Classification:
451 41, 451532
Abstract:
An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
Polishing Pad
US Patent:
7357704, Apr 15, 2008
Filed:
Jun 15, 2006
Appl. No.:
11/424466
Inventors:
Jean Vangsness - Stow MA, US
Oscar Kai Chi Hsu - Chelmsford MA, US
Alaka Potnis - Hudson NH, US
Oscar Kai Chi Hsu - Chelmsford MA, US
Alaka Potnis - Hudson NH, US
Assignee:
innoPad, Inc. - Peabody MA
International Classification:
B24D 11/00
US Classification:
451532, 451 28
Abstract:
An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
Polishing Pad
US Patent:
7086932, Aug 8, 2006
Filed:
May 11, 2004
Appl. No.:
10/843111
Inventors:
Jean Vangsness - Stow MA, US
Oscar Kai Chi Hsu - Chelmsford MA, US
Alaka Potnis - Hudson NH, US
Oscar Kai Chi Hsu - Chelmsford MA, US
Alaka Potnis - Hudson NH, US
Assignee:
Freudenberg Nonwovens - Lowell MA
International Classification:
B24B 1/00
US Classification:
451 28, 451532
Abstract:
An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.