JASON MURL BRAND
Pilots at Life Way, Swansboro Country, CA
License number
California A2981815
Issued Date
Feb 2015
Expiration Date
Feb 2020
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
3207 Life Way, Swansboro Country, CA 95667
Professional information
Apparatuses And Methods For Sensing A Phase-Change Test Cell And Determining Changes To The Test Cell Resistance Due To Thermal Exposure
US Patent:
8351289, Jan 8, 2013
Filed:
Dec 30, 2009
Appl. No.:
12/655377
Inventors:
Jason Brand - Placerville CA, US
Jason Snodgress - Cameron Park CA, US
Jason Snodgress - Cameron Park CA, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G11C 7/04
US Classification:
365212, 365211, 365148, 365163, 365228, 365229
Abstract:
A phase change memory array may include at least one cell used to determine whether the array has been altered by thermal exposure over time. The cell may be the same or different from the other cells. In some embodiments, the cell is only read in response to an event. If, in response to that reading, it is determined that the cell has changed state or resistance, it may deduce whether the change is a result of thermal exposure. Corrective measures may then be taken.
Low Temperature Board Level Assembly Using Anisotropically Conductive Materials
US Patent:
2010012, May 20, 2010
Filed:
Nov 14, 2008
Appl. No.:
12/271077
Inventors:
Myung Jin Yim - Chandler AZ, US
Jason Brand - Placerville CA, US
Jason Brand - Placerville CA, US
International Classification:
H01L 23/12, B32B 37/12
US Classification:
257783, 156325, 257E23003
Abstract:
An integrated circuit may be secured to a substrate using an anisotropically conductive adhesive that may be cured at a temperature of less than 150° C. In some embodiments, an acrylic resin with embedded metallic particles may be used as the anisotropically conductive adhesive. In some embodiments, the board level reliability of the resulting product may be improved through the use of the anisotropically conductive adhesive that may be cured at a temperature of less than 150° C.
Molding Compound Including A Carbon Nano-Tube Dispersion
US Patent:
2010015, Jun 24, 2010
Filed:
Dec 23, 2008
Appl. No.:
12/343398
Inventors:
Myung Jin Yim - Chandler AZ, US
Jason Brand - Placerville CA, US
Jason Brand - Placerville CA, US
International Classification:
H01L 23/04, C08K 3/04, C08J 3/28
US Classification:
257704, 524495, 522166, 257E23181
Abstract:
A molding compound comprising a resin, a filler, and a carbon nano-tube dispersion is disclosed. The carbon nano-tube dispersion achieves a low average agglomeration size in the molding compound thereby providing desirable electromechanical properties and laser marking compatibility. A shallow laser mark may be formed in a mold cap with a maximum depth of less than 10 microns.
Package Including At Least One Topological Feature On An Encapsulant Material To Resist Out-Of-Plane Deformation
US Patent:
2011012, Jun 2, 2011
Filed:
Nov 30, 2009
Appl. No.:
12/628042
Inventors:
James Jian Zhang - Folsom CA, US
Jason Brand - Placerville CA, US
Jacob Brooksby - Folsom CA, US
Dejen Eshete - Mesa AZ, US
Myung Jin Yim - Chandler AZ, US
Ravikumar Adimula - Chandler AZ, US
Dan Graves - Folsom CA, US
Jason Brand - Placerville CA, US
Jacob Brooksby - Folsom CA, US
Dejen Eshete - Mesa AZ, US
Myung Jin Yim - Chandler AZ, US
Ravikumar Adimula - Chandler AZ, US
Dan Graves - Folsom CA, US
International Classification:
H01L 23/544, H01L 21/26
US Classification:
257618, 438795, 257E23179, 257E21328
Abstract:
Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, including a die and an encapsulant material formed over the die, and at least one topological feature formed on an external surface of the encapsulant material, and configured to resist out-of-plane deformation of the package. Other embodiments may be described and claimed.
Variable Latch
US Patent:
2004018, Sep 23, 2004
Filed:
Mar 18, 2003
Appl. No.:
10/391893
Inventors:
Jason Brand - Placerville CA, US
International Classification:
G01R031/02
US Classification:
324/755000
Abstract:
Numerous embodiments of variable latch and a method of formation are disclosed. One or more embodiments of the claimed subject matter may comprise a latch with a plurality of contact points formed thereon, and method of fabrication. The plurality of contact points may allow adequate socketing of microelectronic packages of varying sizes in a socket assembly, without the need to modify the latch when the microelectronic package size varies.
Variable Latch
US Patent:
2007009, Apr 26, 2007
Filed:
Nov 20, 2006
Appl. No.:
11/561684
Inventors:
Jason Brand - Placerville CA, US
International Classification:
H01R 29/00
US Classification:
439172000
Abstract:
Numerous embodiments of variable latch and a method of formation are disclosed. One or more embodiments of the claimed subject matter may comprise a latch with a plurality of contact points formed thereon, and method of fabrication. The plurality of contact points may allow adequate socketing of microelectronic packages of varying sizes in a socket assembly, without the need to modify the latch when the microelectronic package size varies.