Jason Cheng-Hsiang Chen
Engineering at Timberline Ln, Walnut, CA
License number
Louisiana PE.0030703
Issued Date
Jun 10, 2003
Expiration Date
Sep 30, 2005
Category
Civil Engineer
Type
Civil Engineer
Address
Address
20812 Timberline Ln, Walnut, CA 91789
Professional information
Retractable Memory Drive
US Patent:
7422454, Sep 9, 2008
Filed:
Mar 20, 2007
Appl. No.:
11/688845
Inventors:
Choon Tak Tang - Irvine CA, US
Jason Chen - Walnut CA, US
Kevin Tseng - Baldwin Park CA, US
Jason Chen - Walnut CA, US
Kevin Tseng - Baldwin Park CA, US
Assignee:
Kingston Technology Corporation - Fountain Valley CA
International Classification:
H01R 13/60, H01R 13/44
US Classification:
439131
Abstract:
A retractable memory drive in accordance with the present invention comprises a top casing, a middle carrier, an electronic device such as a USB thumb drive, and a bottom casing. A positioning device on the middle carrier has a portion that protrudes outside the casing and operates like a button. The location of the positioning device where the button is located has two key attributes. First, there is a protrusion that acts as a lock with the casing. Second, the area below the button is not rigid and so it gives way when pressure is applied to the button. The top and bottom casings provide a casing structure which includes two detents. One detent is for locking the device with the connector in the extended position, and one detent for locking the device with the connector retracted in the in position. This allows for just one press of the extended portion of the positioning device to unlock it from its present position. When the device reaches its new position it will automatically lock.
Golf Club Grip And Manufacturing Method Thereof
US Patent:
2010019, Jul 29, 2010
Filed:
Mar 29, 2010
Appl. No.:
12/798109
Inventors:
Yung Hsiang Chen - Walnut CA, US
Jason Chen - Walnut CA, US
Jason Chen - Walnut CA, US
International Classification:
A63B 53/14, B29C 39/12
US Classification:
473300, 264245
Abstract:
A method of manufacturing a golf club grip includes the step of: (a) forming a first grip member in a first mold having a first predetermined mold pattern by vulcanizing a predetermined of non-vulcanized rubber material in the first predetermined mold, wherein the first grip member has a plurality of first pattern channels formed thereon corresponding with the first predetermined mold pattern; (b) disposing the first grip member in a second mold having a second predetermined mold pattern; and (c) forming a second grip member in the second mold by vulcanizing a predetermined amount of non-vulcanized rubber material in the second mold, wherein the second grip member has a plurality of second pattern channels formed thereon corresponding to the second predetermined mold pattern, wherein the first grip member and the second grip member are integrated in an edge-to-edge manner without intermixing of color and material.
Retractable Memory Drive
US Patent:
7661967, Feb 16, 2010
Filed:
Sep 5, 2008
Appl. No.:
12/205620
Inventors:
Choon Tak Tang - Irvine CA, US
Jason Chen - Walnut CA, US
Kevin Tseng - Baldwin Park CA, US
Jason Chen - Walnut CA, US
Kevin Tseng - Baldwin Park CA, US
Assignee:
Kingston Technology Corporation - Fountain Valley CA
International Classification:
H01R 13/60, H01R 13/44
US Classification:
439131
Abstract:
A retractable memory drive in accordance with the present invention comprises a top casing, a middle carrier, an electronic device such as a USB thumb drive, and a bottom casing. A positioning device on the middle carrier has a portion that protrudes outside the casing and operates like a button. The location of the positioning device where the button is located has two key attributes. First, there is a protrusion that acts as a lock with the casing. Second, the area below the button is not rigid and so it gives way when pressure is applied to the button. The top and bottom casings provide a casing structure which includes two detents. One detent is for locking the device with the connector in the extended position, and one detent for locking the device with the connector retracted in the in position. This allows for just one press of the extended portion of the positioning device to unlock it from its present position. When the device reaches its new position it will automatically lock.
Flash Memory Card
US Patent:
7659610, Feb 9, 2010
Filed:
Jul 29, 2008
Appl. No.:
12/181721
Inventors:
Ben Wei Chen - Fremont CA, US
David Hong-Dien Chen - Irvine CA, US
Jason Japen Chen - Walnut CA, US
David Hong-Dien Chen - Irvine CA, US
Jason Japen Chen - Walnut CA, US
Assignee:
Kingston Technology Corporation - Fountain Valley CA
International Classification:
H01L 23/02
US Classification:
257686, 257777, 257724
Abstract:
A Flash memory card is disclosed comprising a substrate, a Flash memory die on top of the substrate, a controller die on top of the Flash memory die, and an interposer coupled to with the controller die and on top of the Flash memory die wherein the interposer results in substantial reduced wire bonding to the substrate. The interposer can surround or be placed side by side with the controller die. A system and method in accordance with the present invention achieves the following objectives: (1) takes advantage of as large of a Flash memory die as possible, to increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies to increase density of the Flash card; and (3) has a substantially less number of bonding wires to the substrate as possible, to improve production yield.
Flash Memory Card
US Patent:
7411293, Aug 12, 2008
Filed:
Jun 14, 2006
Appl. No.:
11/452805
Inventors:
Ben Wei Chen - Fremont CA, US
David Hong-Dien Chen - Irvine CA, US
Jason Jajen Chen - Walnut CA, US
David Hong-Dien Chen - Irvine CA, US
Jason Jajen Chen - Walnut CA, US
Assignee:
Kingston Technology Corporation - Fountain Valley CA
International Classification:
H01L 23/48, H01L 23/52, H01L 29/40
US Classification:
257724, 257777
Abstract:
A Flash memory card is disclosed comprising a substrate, a Flash memory die on top of the substrate, a controller die on top of the Flash memory die, and an interposer coupled to with the controller die and on top of the Flash memory die wherein the interposer results in substantial reduced wire bonding to the substrate. The interposer can surround or be placed side by side with the controller die. A system and method in accordance with the present invention achieves the following objectives: (1) takes advantage of as large of a Flash memory die as possible, to increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies to increase density of the Flash card; and (3) has a substantially less number of bonding wires to the substrate as possible, to improve production yield.
Flash Memory Card
US Patent:
8097957, Jan 17, 2012
Filed:
Feb 8, 2010
Appl. No.:
12/702207
Inventors:
Ben Wei Chen - Fremont CA, US
David Hong-Dien Chen - Irvine CA, US
Jason Jajen Chen - Walnut CA, US
David Hong-Dien Chen - Irvine CA, US
Jason Jajen Chen - Walnut CA, US
Assignee:
Kingston Technology Corporation - Fountain Valley CA
International Classification:
H01L 23/48, H01L 23/52, H01L 29/40
US Classification:
257777, 257784
Abstract:
A Flash memory card is disclosed comprising a substrate, a Flash memory die on top of the substrate, a controller die on top of the Flash memory die, and an interposer coupled to with the controller die and on top of the Flash memory die wherein the interposer results in substantial reduced wire bonding to the substrate. The interposer can surround or be placed side by side with the controller die. A system and method in accordance with the present invention achieves the following objectives: (1) takes advantage of as large of a Flash memory die as possible, to increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies to increase density of the Flash card; and (3) has a substantially less number of bonding wires to the substrate as possible, to improve production yield.