JAMES STEVEN COLLINS
Pilots at Walpole Rd, Elk Grove Vlg, IL
License number
Illinois A0360369
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
26 Walpole Rd, Elk Grove Vlg, IL 60007
Professional information
Condenser Microphone
US Patent:
6654473, Nov 25, 2003
Filed:
May 9, 2001
Appl. No.:
09/851907
Inventors:
James Steven Collins - Elk Grove Village IL
Assignee:
Knowles Electronics, LLC - Itasca IL
International Classification:
H04R 908
US Classification:
381355, 381369
Abstract:
A condenser microphone, and method of construction, is disclosed. The microphone comprises a cup-shaped housing having a base surface and an upstanding peripheral wall. The wall terminates at a distal edge defining an opening. The microphone further comprises a diaphragm and ring assembly disposed on the base surface and having a peripheral edge, a backplate having a peripheral edge, and a spacing washer disposed between the diaphragm and ring assembly and the backplate for separating the diaphragm and ring assembly from the backplate. The microphone also comprises a substrate closing the housing opening. The spacer is disposed between the peripheral housing wall and the peripheral edges of the diaphragm and ring assembly and the backplate. The spacer includes a radially inwardly directed flange which engages an upper peripheral surface of the backplate.
Diaphragm For A Condenser Microphone
US Patent:
2009009, Apr 16, 2009
Filed:
Oct 16, 2007
Appl. No.:
11/873143
Inventors:
James S. Collins - Elk Grove Village IL, US
Assignee:
KNOWLES ELECTRONICS, LLC - Itasca IL
International Classification:
H04R 9/08
US Classification:
381369
Abstract:
A microphone for transducing between an acoustical signal and an electrical signal, comprises a housing and a motor assembly disposed within the housing. The motor assembly includes a backplate and a diaphragm attached to the backplate via a spacer. The diaphragm comprising a ring and a film, the diaphragm vibrates in response to an acoustical signal, wherein the film is formed from an amorphous or semi-crystallized polyphenylene sulfide (PPS) and a metal layer is attached to the film. The film is completely covered by the metal layer and a portion of the metal is removed using a direct energy source, leaving a portion of the film directly exposed resulting in reducing the parasitic capacitances between the backplate and the diaphragm and increasing the sensitivity. Alternatively, the film is partially covered by the metal layer. At least one opening is formed on the microphone and acoustically/electrically coupled to an opening formed on a main printed circuit board of an electronic device, defining a surface mountable microphone.
Apparatus For Suppressing Radio Frequency Interference In A Microphone Assembly With Preamplifier
US Patent:
7706559, Apr 27, 2010
Filed:
Jul 7, 2005
Appl. No.:
11/176455
Inventors:
James S. Collins - Elk Grove Village IL, US
Assignee:
Knowles Electronics, LLC - Itasca IL
International Classification:
H04R 25/00
US Classification:
381361, 381174
Abstract:
A microphone assembly comprises a housing that includes a conductive material. A preamplifier circuit is disposed within the housing, the preamplifier circuit having a signal input and a ground terminal. A microphone portion is disposed within the housing, the microphone portion having an output coupled to the signal input of the preamplifier circuit. A ribbon wire is attached to the ground terminal of the preamplifier circuit and is attached to the housing.
Microphone Assembly With Preamplifier And Manufacturing Method Thereof
US Patent:
2005021, Sep 29, 2005
Filed:
Mar 26, 2004
Appl. No.:
10/809984
Inventors:
James Collins - Elk Grove Village IL, US
Assignee:
KNOWLES ELECTRONICS, LLC - Itasca IL
International Classification:
H04R025/00, H04R009/08, H04R017/02, H04R011/04, H04R019/04
US Classification:
381355000, 381361000, 381369000, 381370000
Abstract:
A microphone assembly include a microphone housing unit having a cover and a base. The microphone assembly further includes a preamplifier circuit assembly attached to the base and protected by the cover. The protected preamplifier circuit assembly has at least one terminal unprotected by the cover. A radio frequency interference suppression device can be electrically coupled to the preamplifier circuit and includes at least one internal ground electrically coupled to the at least one terminal. The at least one internal ground provides a ground path between the cover and the base.
Acoustic Valve Mechanisms
US Patent:
2011012, Jun 2, 2011
Filed:
Dec 8, 2010
Appl. No.:
12/963289
Inventors:
Thomas E. Miller - Arlington Heights IL, US
William A. Ryan - Elgin IL, US
Joseph J. Heidenreich - Lake Zurich IL, US
Ryan S. Scott - Gainesville FL, US
Daniel Repplinger - Hawthorn Woods IL, US
James Steven Collins - Elk Grove Village IL, US
William A. Ryan - Elgin IL, US
Joseph J. Heidenreich - Lake Zurich IL, US
Ryan S. Scott - Gainesville FL, US
Daniel Repplinger - Hawthorn Woods IL, US
James Steven Collins - Elk Grove Village IL, US
Assignee:
KNOWLES ELECTRONICS, LLC - Itasca IL
International Classification:
H04R 25/00
US Classification:
381322
Abstract:
A valve for a personal auditory system is described. The auditory system is capable of converting between an acoustic signal and an electrical signal. The auditory system has an acoustic pathway through which an acoustic signal may travel between a first point exterior to the auditory system and a second point interior to the auditory system. The valve includes a free floating electrode and a second electrode adjacent to free floating electrode. An electric signal that is generated by the second electrode moves the free floating electrode to substantially open or close the acoustic pathway.
Electret Condenser Microphone
US Patent:
7184563, Feb 27, 2007
Filed:
Mar 4, 2003
Appl. No.:
10/379007
Inventors:
James Steven Collins - Elk Grove Village IL, US
Assignee:
Knowles Electronics LLC. - Itasca IL
International Classification:
H04R 25/00
US Classification:
381191, 381174
Abstract:
A condenser microphone having a housing, a diaphragm assembly and backplate located within the housing. A spacer isolates the diaphragm assembly from the housing and spaces the diaphragm assembly from the backplate. The spacer has a first portion disposed between the backplate and the diaphragm assembly, and a second portion disposed between the diaphragm assembly and the wall of the housing. A conductive member electrically connects the backplate to a ground.
Electret Condenser Microphone
US Patent:
7136500, Nov 14, 2006
Filed:
Aug 5, 2003
Appl. No.:
10/634552
Inventors:
James S. Collins - Elk Grove Village IL, US
Assignee:
Knowles Electronics, LLC. - Itasca IL
International Classification:
H04R 25/00
US Classification:
381369, 381359, 381191
Abstract:
An electret condenser microphone includes a housing, a diaphragm disposed within the housing, first and second sound inlet ports and an acoustic resistive material disposed within the housing and in the acoustic path between the second inlet port and the diaphragm. The acoustic resistive may further electrically couple a backplate coupled to the diaphragm to an amplifier disposed within the housing.
Microphone Assembly With Preamplifier And Manufacturing Method Thereof
US Patent:
2007028, Dec 13, 2007
Filed:
Apr 30, 2007
Appl. No.:
11/742238
Inventors:
James Collins - Elk Grove Village IL, US
Assignee:
KNOWLES ELECTRONICS, LLC - Itasca IL
International Classification:
H04R 17/02
US Classification:
381355000
Abstract:
A microphone assembly include a microphone housing unit having a cover and a base. The microphone assembly further includes a preamplifier circuit assembly attached to the base and protected by the cover. The protected preamplifier circuit assembly has at least one terminal unprotected by the cover. A radio frequency interference suppression device can be electrically coupled to the preamplifier circuit and includes at least one internal ground electrically coupled to the at least one terminal. The at least one internal ground provides a ground path between the cover and the base.
Acoustic Assembly With Supporting Members
US Patent:
2013028, Oct 31, 2013
Filed:
Apr 25, 2013
Appl. No.:
13/870362
Inventors:
Steven Roy Kearey - Carpentersville IL, US
Felix Matthew Naylor - Chicago IL, US
James Collins - Elk Grove Village IL, US
Felix Matthew Naylor - Chicago IL, US
James Collins - Elk Grove Village IL, US
Assignee:
Knowles Electronics, LLC - Itasca IL
International Classification:
H04R 7/16
US Classification:
181171
Abstract:
An apparatus includes a top assembly, a bottom assembly, and a diaphragm assembly. The bottom assembly is coupled to the top assembly to form an overall assembly. The diaphragm assembly includes a ring and a diaphragm flexible member that is attached to the ring. The ring forms an opening and at least one strengthening member is disposed at least partially across the opening. The at least one strengthening member is configured to provide strength and maintain a predetermined compliance of the diaphragm flexible member.
Electret Condenser Microphone
US Patent:
2007002, Feb 1, 2007
Filed:
Sep 8, 2006
Appl. No.:
11/530192
Inventors:
James Collins - Elk Grove Village IL, US
Assignee:
KNOWLES ELECTRONICS, LLC - Itasca IL
International Classification:
H04R 25/00
US Classification:
381174000
Abstract:
An electret condenser microphone includes a housing, a diaphragm disposed within the housing, first and second sound inlet ports and an acoustic resistive material disposed within the housing and in the acoustic path between the second inlet port and the diaphragm. The acoustic resistive may further electrically couple a backplate coupled to the diaphragm to an amplifier disposed within the housing.