Inventors:
Kim Ritchie - Phoenix AZ
James N. Smith - Tempe AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 2336
Abstract:
A desiccant for semiconductor packaging which may be applied in liquid form consists essentially of approximately 60% by weight absolute ethyl alcohol, 25% by weight ethyl acetate, 5% by weight water, 5% by weight a source of boron, aluminum or phosphorus and 5% by weight of an organic silane having the structural formula: ##STR1## where R. sub. 1 is a radical selected from the group consisting of H. sup. -, CH. sub. 2. dbd. CH. sup. -, CH. sub. 3 O. sup. -, C. sub. 2 H. sub. 5 O. sup. -, CH. sub. 3 CO. sub. 2. sup. -, C. sub. 2 H. sub. 5 CO. sup. -, and C. sub. 3 H. sub. 7 O. sup. -, and R is a radical selected from the group consisting of CH. sub. 3 O. sup. -, C. sub. 2 H. sub. 5 O. sup. -, C. sub. 3 H. sub. 7 O. sup. -, CH. sub. 3 CO. sub. 2. sup. -, C. sub. 2 H. sub. 5 CO. sub. 2. sup. -, Si. sup. +, OH. sup. -, and O. sup. -. The sources of boron, aluminum, and phosphorus may be halides, oxides or nitrates. Also a process for incorporating the foregoing into semiconductor package and process for formulating the above solution.