JAMES SMITH
Real Estate Commission in Monroeville, PA
License number
Pennsylvania RS270732
Category
Real Estate Commission
Type
Real Estate Salesperson-Standard
Address
Address
Monroeville, PA 15146
Professional information
Nano And Meso Shell-Core Control Of Physical Properties And Performance Of Electrically Insulating Composites
US Patent:
2010023, Sep 23, 2010
Filed:
Sep 28, 2006
Appl. No.:
11/529453
Inventors:
Gary Stevens - Surrey, GB
James D.B. Smith - Monroeville PA, US
John W. Wood - Winter Springs FL, US
James D.B. Smith - Monroeville PA, US
John W. Wood - Winter Springs FL, US
International Classification:
B32B 5/16, B32B 29/06, C08L 63/00
US Classification:
428324, 428327, 525523
Abstract:
A high thermal conductivity resin that is made up of a host resin matrix () and high thermal conductivity fillers () that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell () around the high thermal conductivity fillers (), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells () is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.
Treatment Of Micropores In Mica Materials
US Patent:
2007011, May 24, 2007
Filed:
Jan 23, 2007
Appl. No.:
11/656727
Inventors:
Gary Stevens - Surrey, GB
James Smith - Monroeville PA, US
John Wood - Winter Springs FL, US
James Smith - Monroeville PA, US
John Wood - Winter Springs FL, US
International Classification:
C04B 33/32, B32B 3/26, B28B 1/00, C04B 35/64, C04B 33/36, B28B 3/00, B28B 5/00
US Classification:
264643000, 428304400
Abstract:
A method for the treatment of micro pores () within a mica paper () that includes obtaining a silane with a molecular weight of between approximately and , and adding the silane to the mica paper (). Then reacting the silane with the inner surface of the micro pores within the mica paper. After this, a resin is impregnated into the mica paper, and the resin binds to the inner surfaces of the micro pores () with the mica paper through the silane.
Seeding Resins For Enhancing The Crystallinity Of Polymeric Substructures
US Patent:
2006028, Dec 14, 2006
Filed:
Apr 3, 2006
Appl. No.:
11/396988
Inventors:
James Smith - Monroeville PA, US
Gary Stevens - Surrey, GB
John Wood - Winter Springs FL, US
Gary Stevens - Surrey, GB
John Wood - Winter Springs FL, US
International Classification:
B32B 17/04, B32B 27/04, B32B 17/02
US Classification:
442110000, 428297400, 428317900, 442320000, 428901000, 442180000, 264165000, 264349000, 264907000
Abstract:
The present invention provides for a resin mixture that comprises a highly structured resin and a less structured resin . The highly structured resin and the less structured resin are mixed to a ratio of between 1:9 and 4:1 by volume, with a more particular ratio of 1:5 to 3:1. The highly structured resin forms ordered micro regions and the ordered micro regions impose order on surrounding less structured resin molecules. The micro regions are essentially groups of the HS resin that will naturally form order structures.
Fabrics With High Thermal Conductivity Coatings
US Patent:
2005027, Dec 15, 2005
Filed:
Apr 15, 2005
Appl. No.:
11/106847
Inventors:
James Smith - Monroeville PA, US
Gary Stevens - Surrey, GB
John Wood - Winter Springs FL, US
Gary Stevens - Surrey, GB
John Wood - Winter Springs FL, US
International Classification:
B32B017/02
US Classification:
442110000, 442063000, 442111000, 442180000, 427058000, 427215000, 427249300, 427249400, 427249700, 427249170, 442228000, 427126100, 427126200, 427126300
Abstract:
The present invention facilitates the thermal conductivity of fabrics by surface coating of the fabrics with high thermal conductivity materials The fabrics may be surface coated when they are individual fibers or strands bundles of strands, formed fabric or combinations therefore. A particular type of fibrous matrix used with the present invention is glass. Some fabrics may be a combination of more than one type of material, or may have different materials in alternating layers. HTC coatings of the present invention include diamond like coatings (DLC) and metal oxides, nitrides, carbides and mixed stoichiometric and non-stoichiometric combinations that can be applied to the host matrix.
High Thermal Conductivity Materials With Grafted Surface Functional Groups
US Patent:
2005024, Nov 3, 2005
Filed:
Jun 14, 2005
Appl. No.:
11/152986
Inventors:
James Smith - Monroeville PA, US
Gary Stevens - Surrey, GB
John Wood - Winter Springs FL, US
Gary Stevens - Surrey, GB
John Wood - Winter Springs FL, US
International Classification:
C08L063/00
US Classification:
523400000
Abstract:
In one embodiment the present invention provides for high thermal conductivity materials that have surface functional groups grafted thereto. These grafted surface functional groups then form a continuous bond with a host resin matrix that the high thermal conductivity materials are added to.
Structured Resin Systems With High Thermal Conductivity Fillers
US Patent:
2005027, Dec 15, 2005
Filed:
Jun 14, 2005
Appl. No.:
11/152984
Inventors:
James Smith - Monroeville PA, US
Gary Stevens - Surrey, GB
John Wood - Winter Springs FL, US
Gary Stevens - Surrey, GB
John Wood - Winter Springs FL, US
International Classification:
B32B005/02, B32B027/04, B32B027/12
US Classification:
442110000, 428297400, 428317900, 428901000, 442180000, 442320000
Abstract:
In one embodiment the present invention provides for a high thermal conductivity highly structured resin that comprises a host highly structured resin matrix, and a high thermal conductivity filler The high thermal conductivity fillers are from 1-1000 nm in length, and high thermal conductivity fillers have an aspect ratio of between 3-100. Particular highly structured highly structured resins include at least one of liquid crystal polymers, interpenetrating networks, dendrimer type matrices, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids
High Voltage Capable Non-Volatile Low Viscosity Insulating Resins
US Patent:
2002001, Jan 24, 2002
Filed:
Jul 19, 1999
Appl. No.:
09/356977
Inventors:
JAMES D.B. SMITH - MONROEVILLE PA, US
FRANKLIN T. EMERY - FORT PAYNE AL, US
FRANKLIN T. EMERY - FORT PAYNE AL, US
International Classification:
C08L063/00
US Classification:
525/524000
Abstract:
An insulating resin is made, containing an epoxy system of resin and epoxy diluent, with phenolic accelerator selected from catechol and pyrogallol and organotin latent catalyst selected from triphenyltin chloride, tribenzyltin chloride, tribenzyltin hydroxide and triphenyltin acetate; where the insulating resin is solventless and has a viscosity of from 10 centipoise to 450 centipoise at 25° C. for up to eight weeks, where the insulating resin can be used as an impregnating resin in slot portions () and of an electrical coil (), usually in combination with mica tape, in a motor () or a generator ().
Seeding Of Htc Fillers To Form Dendritic Structures
US Patent:
2006028, Dec 14, 2006
Filed:
Apr 3, 2006
Appl. No.:
11/397000
Inventors:
James Smith - Monroeville PA, US
Gary Stevens - Surrey, GB
John Wood - Winter Springs FL, US
Gary Stevens - Surrey, GB
John Wood - Winter Springs FL, US
International Classification:
B05D 3/02, B05D 1/18
US Classification:
427372200, 427430100
Abstract:
In one embodiment the present invention provides for a method of forming HTC dendritic fillers within a host resin matrix that comprises adding HTC seeds to the host resin matrix. The HTC seeds have been surface functionalized to not substantially react with one another. The seeds then accumulate HTC building blocks , and the HTC building blocks have also been surface functionalized to not substantially react with one another. Then assembling the HTC building blocks with the HTC seeds to produce HTC dendritic fillers within the host resin matrix.
Fabrics With High Thermal Conductivity Coatings
US Patent:
2009023, Sep 24, 2009
Filed:
Jun 8, 2009
Appl. No.:
12/480190
Inventors:
James D. Smith - Monroeville PA, US
Gary Stevens - Surrey, GB
John W. Wood - Winter Springs FL, US
Gary Stevens - Surrey, GB
John W. Wood - Winter Springs FL, US
International Classification:
B05D 3/12
US Classification:
4271262
Abstract:
The present invention facilitates the thermal conductivity of fabrics by surface coating of the fabrics with high thermal conductivity materials 6. The fabrics may be surface coated when they are individual fibers or strands 4, bundles of strands, formed fabric or combinations therefore. A particular type of fibrous matrix used with the present invention is glass. Some fabrics may be a combination of more than one type of material, or may have different materials in alternating layers. HTC coatings of the present invention include diamond like coatings (DLC) and metal oxides, nitrides, carbides and mixed stoichiometric and non-stoichiometric combinations that can be applied to the host matrix.
Polymer Brushes
US Patent:
2008026, Oct 23, 2008
Filed:
Jun 30, 2008
Appl. No.:
12/164591
Inventors:
Gary Stevens - Surrey, GB
James D.B. Smith - Monroeville PA, US
John W. Wood - Winter Springs FL, US
James D.B. Smith - Monroeville PA, US
John W. Wood - Winter Springs FL, US
Assignee:
SIEMENS POWER GENERATION, INC. - Orlando FL
International Classification:
C08L 63/00, B05D 1/16
US Classification:
523400, 428 90
Abstract:
Polymer brushes () in a resin that create phonon pathways therein The polymer brushes themselves comprise structured polymer hairs having a density of 0.8 to 1.0 g/cc, a chain length of 1 to 1000 nm, and a thermal conductivity of 0.5 to 5.0 W/mK. The polymer brushes are 10-25% by volume of the resin, and the polymer hairs can orient surrounding resin molecules to the polymer hairs alignment ().