JAMES R DAVIS
Medical Practice at 118 Ave, Fort Lauderdale, FL

5092943, Mar 3, 1992

Sep 17, 1990

7/583629

James L. Davis - Tamarac FL
Robert W. Pennisi - Boca Raton FL
Fadia Nounou - Plantation FL
Bobby D. Landreth - Ft. Lauderdale FL
Robert J. Mulligan - Plantation FL

Motorola, Inc. - Schaumburg IL

B23K 3534

148 23

Solder pastes having vehicles including blends of low boiling point alcohols and relatively high boiling point alcohols are described which leave residues which may be cleaned using only water are described. The low boiling point alcohols have a boiling point range of between about 65. degree. and about 150. degree. C. whereas the high boiling point alcohols have a boiling point in rhe range of about 150. degree. to about 270. degree. C. The solder pastes also use water-soluble organic acids as fluxing agents such as compounds of the formula: ##STR1## where R is an electron withdrawing group such as fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl. Other suitable formic-acid fluxing agents include, but are not limited to, adipic acid, polyacrylic acid, methacrylic acid and polymethacrylic acid. The compounds clean oxides from the printed circuit boards (PCBs) under assembly and then volatilze leaving a residue to be cleaned away. The cleaning step involves rinsing with water.

5122200, Jun 16, 1992

Sep 17, 1990

7/583630

James L. Davis - Tamarac FL
Robert W. Pennisi - Boca Raton FL
Fadia Nounou - Plantation FL
Robert J. Mulligan - Plantation FL
Bobby D. Landreth - Ft. Lauderdale FL

Motorola, Inc. - Schaumburg IL

B23K 3534

148 23

Solder pastes having vehicles including formic acid-soluble organic acids as fluxing agents are described. Fluxing agents may be compounds of the formula: ##STR1## where R is an electron withdrawing group. In one embodiment, R is selected from the group consisting of fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl. Other suitable formic-acid fluxing agents include, but are not limited to, adipic acid, acrylic acid, polyacrylic acid, methacrylic acid and polymethacrylic acid. The compounds clean oxides from the printed circuit boards (PCBs) under assembly and then volatilize leaving a residue to be cleaned away. The cleaning step involves rinsing with formic acid. No undesired residue remains indicating that the organic acids of the invention are effective in cleaning boards. Such acid fluxing agents can be used mixed with typical solder components, such as lead/tin solder pastes, or applied topically to solders, such as solder balls; both techniques permit the assembly of PCBs more easily with high quality bonds, and with little or no residue.

4995921, Feb 26, 1991

May 11, 1990

7/521871

James L. Davis - Tamarac FL
Robert W. Pennisi - Boca Raton FL
Fadia Nounou - Plantation FL
Bobby D. Landreth - Davie FL

Motorola, Inc. - Schaumburg IL

B23K 3534

148 22

Solder paste vehicles using blends of monofunctional and polyfunctional alcohols are described. The blend may have a major portion of a low viscosity, monofunctional alcohol solvent and a minor portion of a high viscosity polyfunctional alcohol thickener. The monohydric solvent has a room temperature viscosity of at least 3 centipoise and from about 3 to 18 carbon atoms and may include such materials as 2-butanol, 1-hexanol, 1-heptanol, 1-octanol, 1-nonanol, 1-dodecanol, 2-ethoxyethanol, 2-(2-ethoxyethoxy)ethanol, 2-(2-butoxyethoxy)ethanol, n-hexadecanol, n-octadecanol, benzyl alcohol and mixtures thereof. The polyalcohol has a room temperature viscosity of between about 26 to about 1500 cp and includes compounds such as 1,2-ethanediol; 1,2-propanediol; 1,3-propanediol; 1,2-butanediol; 1,3-butanediol; 1,4-butanediol; 1,2-pentanediol; 1,5-pentanediol; 2,4-pentanediol; 2,5-hexane-diol; glycerol; 1,2,4-butanetriol; 2,2'-(ethylenedioxy)diethanol; 1,12-dodecane-diol; 1,16-hexanedecanediol and mixtures thereof. These blends give improved solubility of organic acid fluxing agents, provide relatively high viscosities of the solder paste and permit lower amounts of solvent to be used.

5424921, Jun 13, 1995

Sep 7, 1993

8/116647

James T. Davis - Sunrise FL
Kok H. Chong - Tamarac FL
Thomas A. Goodwin - Coral Springs FL

Motorola, Inc. - Schaumburg IL

H05C 900

361816

An electronic assembly (100) includes a first circuit board (120) which houses electronic components (122), a second circuit board (140) being three-dimensional and having integral members (143) to receive and position the first circuit board (120), and an electrical connector (130) between the first circuit board (120) and the second circuit board (140).

5045128, Sep 3, 1991

Aug 13, 1990

7/566029

Bobby D. Landreth - Ft. Lauderdale FL
Robert W. Pennisi - Boca Raton FL
James L. Davis - Tamarac FL
Fadia Nounou - Plantation FL

Motorola, Inc. - Schaumburg IL

B23K 3534

148 23

Fluxing compositions containing compounds that generate acids upon photoinitiation from a light source such as Hg/Xe ultraviolet (UV) light sources are described. The acids clean oxides from the printed circuit boards (PCBs) under assembly and then volatilize with little or no need for a cleaning step, or cleaning only with water. The compounds that release an oxide removing agent, sometimes called a "photoacid" include metal and organic onium salts and furyl compounds bearing a carbonyl group. Such fluxing compositions can be used mixed with typical solder formulations, such as lead/tin solders, or applied topically thereto; both techniques permit the assembly of PCBs more easily and with high quality bonds.

4992139, Feb 12, 1991

Nov 16, 1989

7/437136

Anthony B. Suppelsa - Coral Springs FL
Robert W. Pennisi - Boca Raton FL
James L. Davis - Tamarac FL
Robert J. Mulligan - Plantation FL

Motorola, Inc. - Schaumburg IL

C23F 102, B44C 122, C03C 1500, C03C 2506

156656

A first conductive layer 12 is deposited on the substrate 14. Next, a second conductive layer 16 with a circuit pattern is deposited on the first layer 12. Finally, the first conductive layer 12 not residing under the second conductive layer 16 is etched off, leaving the second layer 16 above the first layer 12.

5562467, Oct 8, 1996

Aug 18, 1995

8/517006

James T. Davis - Sunrise FL
Benjamin J. Hafen - Sunrise FL
Julio A. Abdala - Ft. Lauderdale FL
Steven J. Finch - Plantation FL
Brock J. Langan - Plantation FL

Motorola, Inc. - Schaumburg IL

H01R 2900

439188

An electrical interface (210) for an electronic device (200) includes an integral connector portion (215). The connector portion (215) has protected connector contacts (220) which provide an electrical signal path to the internal circuitry of the device. The electrical interface (210) has a contact surface (112) disposed proximate to the connector portion (215) and interface contacts (117) electrically decoupled from the connector contacts (220). The contact surface (112) is responsive to a mechanical force, to electrically couple at least one of the interface contacts (117) to at least one of the connector contacts (220).

5064481, Nov 12, 1991

May 17, 1990

7/524540

James L. Davis - Tamarac FL
Robert W. Pennisi - Boca Raton FL
Fadia Nounou - Plantation FL
Bobby D. Landreth - Davie FL

Motorola, Inc. - Schaumburg IL

B23K 3534

148 23

Fluxing compositions are described containing as fluxing agents compounds of the formula: ##STR1## where R is an electron withdrawing group. In one embodiment, R is selected from the group consisting of fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl. The compound cleans oxides from the printed circuit boards (PCBs) under assembly and then volatilize with little or no need for a cleaning step, or cleaning only with water or formic acid. Very little or no undesired residue remains. Such acid fluxing agents can be used mixed with typical solder formulations, such as lead/tin solder pastes, or applied topically to solders, such as solder balls; both techniques permit the assembly of PCBs more easily with high quality bonds, and with little or no residue. Malic acid is a preferred organic acid fluxing agent.

5100323, Mar 31, 1992

Sep 5, 1990

7/577787

Kurt E. Friedman - Plantation FL
James E. Davis - Fort Lauderdale FL

Impla-Med Incorporated - Sunrise FL

A61C 800

433173

A dental implant for supporting and positioning an artificial tooth or other prosthetic device in the mouth, and preventing its rotation is provided. The dental implant is adapted to be installed in a pre-drilled bore in the bone of the maxilla or mandible and is eseointegrated into the bone. The dental implant has a generally cylindrical body with a first end implanted in the bone and second end including an annular base. The cylindrical body also includes a threaded bore extending from the second end into the cylindrical body along the longitudinal axis of the cylindrical body. A hexagonal shaped protrusion, when viewed along the bore of the cylinder, is integrally attached to and extends away from the annular base. The central bore of the cylinder extends concentrically through both the annular base and the hexagonal protrusion. The hexagonal protrusion will mate with a corresponding shaped female recess in an abutment which supports and positions an artificial tooth or other prosthetic device above the gum material located above the bone.