JAMES M WEBB, DO
Marriage and Family Therapists at Council Dr, Damascus, OR

License number

Oregon DO19434

Professional information

Sales Engineer - Integrated Power Services

Position:

Sales Engineer at Integrated Power Services

Location:

Portland, Oregon Area

Industry:

Consumer Services

Work:

Integrated Power Services - Washington, Alaska, Hawaii, British Columbia, since Jul 2011 - Sales Engineer Aramark Uniform Services - Portland, Oregon Area 2010 - 2011 - District Manager Albina 2009 - 2010 - Account Manager CESCO Solutions Inc 1996 - 2009 - District Sales Manager

Education:

Lower Columbia College

Dr. James M Webb - DO (Doctor of Osteopathic Medicine)

Hospitals:

Adventist Health Gresham Station
831 Council Dr Ste STE 101, Gresham 97030
Adventist Medical Center
10123 East Market Street Dr, Portland 97216
Adventist Health Gresham Station
831 Council Dr Ste STE 101, Gresham 97030
Adventist Medical Center
10123 East Market Street Dr, Portland 97216

Philosophy:

Dr. Webb is board certified osteopathic physician, who enjoys working with people of all ages and providing care for the entire family. He is dedicated to maintaining and encouraging health and vitality, and will help you accomplish this by providing routine physical exams, immunizations, counseling, and lab screening. This helps to prevent problems before they occur or to catch them in early stages when they are less complicated. He also practices osteopathic manipulation to restore balance.

Education:

Medical Schools
Kirksville College Of Osteopathy And Surgery
Graduated: 1992

Electronic Cartridge Which Allows Differential Thermal Expansion Between Components Of The Cartridge

US Patent:

5894408, Apr 13, 1999

Filed:

Feb 17, 1998

Appl. No.:

9/024860

Inventors:

Michael Stark - Tempe AZ
Michael Rutigliano - Chandler AZ
James S. Webb - Portland OR

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361704

Abstract:

An electronic cartridge that may include a cover which is attached to a thermal element. A substrate may be located between the thermal element and the cover. The cartridge may include a first pin which extends from the thermal element through a datum hole of the substrate. The cartridge may also have a second pin which extends from the thermal element through a first float hole of the substrate. The first float hole may have a major diameter and a minor diameter. The major diameter of the first float hole may be larger than the diameter of the second pin so that the second pin can move relative to the substrate. The first float hole allows movement of the second pin when there is a differential thermal expansion between the thermal element and the substrate.

Assembly For Dissipatating Heat From A Semiconductor Chip Wherein A Stress On The Semiconductor Chip Due To A Thermally Conductive Member Is Partially Relieved

US Patent:

5920120, Jul 6, 1999

Filed:

Dec 19, 1997

Appl. No.:

8/995235

Inventors:

James S. Webb - Portland OR
Jack L. Goodman - Gilbert AZ
Nadir Sharaf - Olympia WA
Lawrence E. McKay - Kent WA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 2334, H01L 2310

US Classification:

257719

Abstract:

An assembly comprising a substrate, a thermally conductive member which is spaced from the substrate, and a semiconductor chip located on a side of the substrate facing the thermally conductive member. A resilient component is compressed between the substrate and the thermally conductive member so that a force clamping the substrate and the thermally conductive member together is shared by at least the semiconductor chip and the component.

Keyed Interlock And Mechanical Alignment Integrated Mechanical Retention Features For Pc System

US Patent:

6030251, Feb 29, 2000

Filed:

Feb 17, 1998

Appl. No.:

9/024741

Inventors:

Michael Stark - Tempe AZ
Michael Rutigliano - Chandler AZ
Bill Lieska - Shelton WA
Peter A Davison - Sumner WA
James S. Webb - Portland OR

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01R 1364

US Classification:

439377

Abstract:

A retention system for an electronic cartridge which mates with connector that is mounted to a substrate. The system may include a first guide rail that is adapted to receive one edge of the electronic cartridge and a second guide rail that is adapted to receive another edge of the electronic cartridge. The guide rails may be mounted to the motherboard by a plurality of threaded fasteners and corresponding nuts. The guide rails guide the electronic cartridge into the connector. The system may further have a beam that extends from the first guide rail to the second guide rail. The guide rails and beam provide structural support for the electronic cartridge.

Mechanical Latch For An Electronic Cartridge

US Patent:

6208514, Mar 27, 2001

Filed:

Feb 17, 1998

Appl. No.:

9/024861

Inventors:

Michael Stark - Tempe AZ
Michael Rutigliano - Chandler AZ
Bill Lieska - Shelton WA
Peter A. Davison - Sumner WA
James S. Webb - Portland OR

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K7/20

US Classification:

361704

Abstract:

An electronic cartridge which may include an integrated circuit package that is mounted to a substrate. The substrate may include a plurality of conductive pads that are inserted into an electrical connector. The cartridge may be guided into the connector by a guide rail which has a latch slot. The electronic cartridge may include a latch which extends from a cover that is coupled to the substrate. The latch may extend into the latch slot to secure the cartridge to the connector.

Apparatus And Method For Minimizing Electromagnetic Interference In Microcomputing Systems

US Patent:

6252313, Jun 26, 2001

Filed:

Dec 15, 1997

Appl. No.:

8/990902

Inventors:

Michael T. Zhang - Portland OR
Don Weiss - Beaverton OR
James Webb - Portland OR
Steve Lofland - Portland OR

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H04B 1502

US Classification:

307 91

Abstract:

An apparatus and method for minimizing electromagnetic interference in a microcomputing system. The apparatus and method of the present invention are based on the fundamental aspect of providing an EMI shield specifically dimensioned to receive a microprocessor within the microcomputing system. The apparatus and method of the present invention are further based on the aspect of providing at least one ferrite bead along a power delivery path to attenuate any high-frequency leakage current from the microprocessor that results at the resonant frequencies of the EMI shield.

Tamper Resistant Attach Mechanism Between Plastic Cover And Thermal Plate Assembly For Processor Cartridges

US Patent:

5973399, Oct 26, 1999

Filed:

Feb 17, 1998

Appl. No.:

9/024492

Inventors:

Michael Stark - Tempe AZ
Michael Rutigliano - Chandler AZ
Bill Lieska - Shelton WA
Peter A. Davison - Sumner WA
James S. Webb - Portland OR

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 2312, H01L 2302, H05K 700

US Classification:

257731

Abstract:

An electronic cartridge. The cartridge may include a first cover and a second cover that are adjacent to a substrate. One or more integrated circuit packages may be mounted to the substrate. The cartridge may include a pin that extends from the first cover and which has a barb that is embedded into the second cover. The embedded barb will damage the second cover if the cover is removed from the cartridge. The present invention thus prevents the removal and re-installation of the cover from the cartridge.

Fan Duct Module

US Patent:

6130819, Oct 10, 2000

Filed:

Jan 29, 1998

Appl. No.:

9/015423

Inventors:

Steve Lofland - Portland OR
Daryl James Nelson - Beaverton OR
Lloyd L. Pollard - Portland OR
James Stacker Webb - Portland OR
Scott L. Noble - Beaverton OR

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05H 720

US Classification:

361695

Abstract:

A modular cooling apparatus for computer systems is disclosed. The apparatus includes an air-guiding duct, a fan coupling to the duct and a coupling apparatus for coupling the air-guiding duct and the fan to an electronics housing. The air-guiding duct has an input opening to the exterior of the electronics housing and guides ambient outside air to the input of the fan. Then the fan directs this outside air to the inside of the electronics housing. The electronic housing can be formed between a base module and the computer system circuit board or between the air-guiding duct, fan and a retention module. Furthermore, outside air is delivered in a substantially perpendicular direction relative to the plane of the computer system circuit board within the electronics housing.