Inventors:
Michael D. Cusack - Monument CO
Michael P. Hagen - Colorado Springs CO
James E. Larkin - Colorado Springs CO
Assignee:
United Technologies Corporation - Hartford CT
International Classification:
H01L 2348, H01L 2944, H01L 2952
Abstract:
An improved bond pad on an integrated circuit has an elongated rectangular shape, on which the wire is bonded at a non-central location displaced toward an outer corner, so that there is room on the pad for a second bond site to be used for a rework bond. The pad corner closest to the path of a wire may be chamfered to reduce the distance of closest approach.