JAMES F FLEMING, CNP
Marriage and Family Therapists in Albuquerque, NM

6388795, May 14, 2002

May 11, 2000

09/569985

James G. Fleming - Albuquerque NM

Sandia Corporation - Albuquerque NM

G02F 101

359240, 359129, 359131

A new class of structured dielectric media which exhibit significant photonic bandstructure has been invented. The new structures, called photonic layered media, are easy to fabricate using existing layer-by-layer growth techniques, and offer the ability to significantly extend our practical ability to tailor the properties of such optical materials.

6812482, Nov 2, 2004

Aug 28, 2001

09/941820

James G. Fleming - Albuquerque NM

Sandia Corporation - Albuquerque NM

H01I 3300

257 17, 257 98, 385129

A new class of processes suited to the fabrication of layered material compositions is disclosed. Layered material compositions are typically three-dimensional structures which can be decomposed into a stack of structured layers. The best known examples are the photonic lattices. The present invention combines the characteristic features of photolithography and chemical-mechanical polishing to permit the direct and facile fabrication of, e. g. , photonic lattices having photonic bandgaps in the 0. 1-20 spectral range.

6807353, Oct 19, 2004

Dec 19, 2001

10/025447

James G. Fleming - Albuquerque NM
G. Ronald Hadley - Albuquerque NM

Sandia Corporation - Albuquerque NM

G02B 600

385132, 385129, 385130, 385131

A microfabricated Bragg waveguide of semiconductor-compatible material having a hollow core and a multilayer dielectric cladding can be fabricated by integrated circuit technologies. The microfabricated Bragg waveguide can comprise a hollow channel waveguide or a hollow fiber. The Bragg fiber can be fabricated by coating a sacrificial mandrel or mold with alternating layers of high- and low-refractive-index dielectric materials and then removing the mandrel or mold to leave a hollow tube with a multilayer dielectric cladding. The Bragg channel waveguide can be fabricated by forming a trench embedded in a substrate and coating the inner wall of the trench with a multilayer dielectric cladding. The thicknesses of the alternating layers can be selected to satisfy the condition for minimum radiation loss of the guided wave.

6583350, Jun 24, 2003

Apr 3, 2002

10/114820

James M. Gee - Albuquerque NM
James G. Fleming - Albuquerque NM
James B. Moreno - Albuquerque NM

Sandia Corporation - Albuquerque NM

H01L 31058

136253, 606418, 431100, 438 57, 257432, 257431

A method for thermophotovoltaic generation of electricity comprises heating a metallic photonic crystal to provide selective emission of radiation that is matched to the peak spectral response of a photovoltaic cell that converts the radiation to electricity. The use of a refractory metal, such as tungsten, for the photonic crystal enables high temperature operation for high radiant flux and high dielectric contrast for a full 3D photonic bandgap, preferable for efficient thermophotovoltaic energy conversion.

6020272, Feb 1, 2000

Oct 8, 1998

9/169307

James G. Fleming - Albuquerque NM

Sandia Corporation - Albuquerque NM

H01L 2100

438734

A micromachining method is disclosed for forming a suspended micromechanical structure from {111} crystalline silicon. The micromachining method is based on the use of anisotropic dry etching to define lateral features of the structure which are etched down into a {111}-silicon substrate to a first etch depth, thereby forming sidewalls of the structure. The sidewalls are then coated with a protection layer, and the substrate is dry etched to a second etch depth to define a spacing of the structure from the substrate. A selective anisotropic wet etchant (e. g. KOH, EDP, TMAH, NaOH or CsOH) is used to laterally undercut the structure between the first and second etch depths, thereby forming a substantially planar lower surface of the structure along a {111} crystal plane that is parallel to an upper surface of the structure. The lateral extent of undercutting by the wet etchant is controlled and effectively terminated by either timing the etching, by the location of angled {111}-silicon planes or by the locations of preformed etch-stops. This present method allows the formation of suspended micromechanical structures having large vertical dimensions and large masses while allowing for detailed lateral features which can be provided by dry etch definition.

7154088, Dec 26, 2006

Mar 23, 2005

11/089318

Matthew G. Blain - Albuquerque NM, US
James G. Fleming - Albuquerque NM, US

Sandia Corporation - Albuquerque NM

H01J 49/42

250292

A microfabricated ion trap array, comprising a plurality of ion traps having an inner radius of order one micron, can be fabricated using surface micromachining techniques and materials known to the integrated circuits manufacturing and microelectromechanical systems industries. Micromachining methods enable batch fabrication, reduced manufacturing costs, dimensional and positional precision, and monolithic integration of massive arrays of ion traps with microscale ion generation and detection devices. Massive arraying enables the microscale ion traps to retain the resolution, sensitivity, and mass range advantages necessary for high chemical selectivity. The reduced electrode voltage enables integration of the microfabricated ion trap array with on-chip circuit-based rf operation and detection electronics (i. e. , cell phone electronics). Therefore, the full performance advantages of the microfabricated ion trap array can be realized in truly field portable, handheld microanalysis systems.

7159397, Jan 9, 2007

Jun 7, 2005

11/146811

James G. Fleming - Albuquerque NM, US

Sandia Corporation - Albuquerque NM

F01B 29/10

60528, 310306, 359224

A microelectromechanical (MEM) apparatus is disclosed which includes a pair of tensile-stressed actuators suspending a platform above a substrate to tilt the platform relative to the substrate. A tensile stress built into the actuators initially tilts the platform when a sacrificial material used in fabrication of the MEM apparatus is removed. Further tilting of the platform can occur with a change in the ambient temperature about the MEM apparatus, or by applying a voltage to one or both of the tensile-stressed actuators. The MEM apparatus can be used to form a tiltable micromirror or an array of such devices, and also has applications for thermal management within satellites.

7992309, Aug 9, 2011

Apr 21, 2003

10/421025

James G. Fleming - Albuquerque NM, US
Carol Fleming, legal representative - Burbank CA, US
Jeffry J. Sniegowski - Tijeras NM, US
Stephen Montague - Albuquerque NM, US

Sandia Corporation - Albuquerque NM

B26B 9/00, B21K 11/00

30350, 761041

A cutting blade is disclosed fabricated of micromachined silicon. The cutting blade utilizes a monocrystalline silicon substrate having a {211} crystalline orientation to form one or more cutting edges that are defined by the intersection of {211} crystalline planes of silicon with {111} crystalline planes of silicon. This results in a cutting blade which has a shallow cutting-edge angle θ of 19. 5°. The micromachined cutting blade can be formed using an anisotropic wet etching process which substantially terminates etching upon reaching the {111} crystalline planes of silicon. This allows multiple blades to be batch fabricated on a common substrate and separated for packaging and use. The micromachined cutting blade, which can be mounted to a handle in tension and optionally coated for increased wear resistance and biocompatibility, has multiple applications including eye surgery (LASIK procedure).

5997949, Dec 7, 1999

Sep 20, 1996

8/717316

Roland Madar - Eybens, FR
Claude Bernard - Brie et Angonnes, FR
James G. Fleming - Albuquerque NM
Paul M. Smith - Albuquerque NM
Jonathan S. Custer - Albuquerque NM
Ronald V. Jones - Albuquerque NM

California Institute of Technology - Pasadena CA
Sandia Corporation - Albuquerque NM

C23C 1608

4272552

The present invention relates to the forming of amorphous or near-amorphous, ternary films of W-Si-N on substrates by chemical vapor deposition of WF. sub. 6, SiH. sub. 4 and NH. sub. 3 and a carrier gas. The present invention method will allow the conformal forming of amorphous or near-amorphous, ternary films of W-Si-N on patterned non-planar substrates at temperatures at or below about 450. degree. C. , by chemical vapor deposition of WF. sub. 6, SiH. sub. 4 and NH. sub. 3 and a carrier gas. A typical temperature range for the formation of the films is between 473. degree. K. and 773. degree. K. , while the reactor pressure can be varied between 0. 1 to 50 Torr. The composition of the deposited films is adjusted by varying the flow ratios of the reactive gases.