JAMES D BLACKHALL
Barber in Monroeville, PA
License number
Pennsylvania BL043431L
Category
Barber Examiners
Type
Barber
Address
Address
Monroeville, PA 15146
Professional information
High Thermal Conductivity Materials Aligned Within Resins
US Patent:
2012011, May 17, 2012
Filed:
Jan 13, 2012
Appl. No.:
13/349900
Inventors:
JAMES DAVID BLACKHALL SMITH - Monroeville PA, US
Gary Stevens - Surrey, GB
John William Wood - Winter Springs FL, US
Gary Stevens - Surrey, GB
John William Wood - Winter Springs FL, US
International Classification:
H01B 17/60, B32B 38/00
US Classification:
174209, 156185, 156 731
Abstract:
In one embodiment the present invention provides for a high thermal conductivity resin that comprises a host resin matrix a high thermal conductivity filler . The high thermal conductivity filler forms a continuous organic-inorganic composite with the host resin matrix, and the fillers have an aspect ratio of between 3-100. The fillers are substantially evenly distributed through the host resin matrix, and are aligned in essentially the same direction. In some embodiments the resins are highly structured resin types.
Structured Resin Systems With High Thermal Conductivity Fillers
US Patent:
8216672, Jul 10, 2012
Filed:
Jun 14, 2005
Appl. No.:
11/152984
Inventors:
James David Blackhall Smith - Monroeville PA, US
Gary Stevens - Surrey, GB
John William Wood - Winter Springs FL, US
Gary Stevens - Surrey, GB
John William Wood - Winter Springs FL, US
Assignee:
Siemens Energy, Inc. - Orlando FL
International Classification:
B32B 7/12, H01L 23/24
US Classification:
428343, 257720
Abstract:
In one embodiment the present invention provides for a high thermal conductivity highly structured resin that comprises a host highly structured resin matrix, and a high thermal conductivity filler. The high thermal conductivity fillers are from 1-1000 nm in length, and high thermal conductivity fillers have an aspect ratio of between 3-100. Particular highly structured highly structured resins include at least one of liquid crystal polymers, interpenetrating networks, dendrimer type matrices, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids.
High Thermal Conductivity Materials With Grafted Surface Functional Groups
US Patent:
8039530, Oct 18, 2011
Filed:
Aug 20, 2010
Appl. No.:
12/860077
Inventors:
James David Blackhall Smith - Monroeville PA, US
Assignee:
Siemens Energy, Inc. - Orlando FL
International Classification:
C08L 63/00, C08K 3/00, B32B 27/20, B32B 27/38
US Classification:
523440, 524700
Abstract:
The present invention provides a continuous high thermal conductivity organic-inorganic composite material. The composite material features high thermal conductivity materials bonded to a host resin matrix by covalent linkages. The bonding takes place through surface functional groups that are reactively grafted to the high thermal conductivity material. These surface functional groups react with the host resin matrix, forming the covalent linkages. The structure of the composite material is effective to reduce phonon scattering and increase phonon transport in the composite material.
High Thermal Conductivity Materials With Grafted Surface Functional Groups
US Patent:
7781063, Aug 24, 2010
Filed:
Jun 14, 2005
Appl. No.:
11/152986
Inventors:
James David Blackhall Smith - Monroeville PA, US
Gary Stevens - Surrey, GB
John William Wood - Winter Springs FL, US
Gary Stevens - Surrey, GB
John William Wood - Winter Springs FL, US
Assignee:
Siemens Energy, Inc. - Orlando FL
International Classification:
B32B 27/38, B32B 27/04, B32B 27/20, C08L 63/00, C08K 3/00, C08K 7/00
US Classification:
428413, 4282974, 523440, 523445, 523447
Abstract:
The present invention is a continuous high thermal conductivity resin featuring high thermal conductivity (HTC) materials and a host resin matrix. The HTC materials form a continuous organic-inorganic composite with the host resin matrix via surface functional groups that are grafted to the HTC materials and form covalent linkages with the host resin matrix. Phonons tend to pass along the HTC materials as they travel through the host resin matrix , and phonons pass to the next HTC material if the distance between these materials is less than n.
Diamond Like Carbon Coating On Nanofillers
US Patent:
7309526, Dec 18, 2007
Filed:
May 19, 2005
Appl. No.:
11/132802
Inventors:
James David Blackhall Smith - Monroeville PA, US
Gary Stevens - Surrey, GB
John William Wood - Winter Springs FL, US
Gary Stevens - Surrey, GB
John William Wood - Winter Springs FL, US
Assignee:
Siemens Power Generation, Inc. - Orlando FL
International Classification:
B32B 5/16
US Classification:
428403, 428407, 428323, 428328, 428329, 428331
Abstract:
In one embodiment the present invention provides for a diamond like coating on small particles. This comprises small particles in the size range of approximately 1-1000 nm and a diamond like coating on the small particles. The diamond like coating is distributed over approximately 50-100% of the surface of the small particles and the diamond like coating is one micron or less in thickness. These small particles then may be applied to materials such as resins and insulating tapes.