JAMES A MOGEL
Vehicle Board in Spangsville, PA
License number
Pennsylvania MV115295L
Category
Vehicle Board
Type
Vehicle Salesperson
Address
Address
Spangsville, PA 19512
Personal information
See more information about JAMES A MOGEL at radaris.comName
Address
Phone
415 Hill Church Rd, Boyertown, PA 19512
5911 Washington Ave, Erie, PA 16509
Boyertown, PA
5750 Crowell St, Erie, PA 16509
415 Hill Church, Buyerstown, PA 19512
Professional information
See more information about JAMES A MOGEL at trustoria.com
Constant Gain, Constant Phase Rf Power Block
Constant Gain, Constant Phase Rf Power Block
US Patent:
6791419, Sep 14, 2004
Filed:
Dec 2, 1998
Appl. No.:
09/205238
Inventors:
Thomas Moller - Gilroy CA
William Hart - Plano TX
James Mogel - Boyertown PA
Robert Bartola - Pottstown PA
William Hart - Plano TX
James Mogel - Boyertown PA
Robert Bartola - Pottstown PA
Assignee:
Ericsson, Inc. - Morgan Hill CA
International Classification:
H03F 304
US Classification:
330297, 330285
Abstract:
A constant gain, constant phase RF power block, e. g. , for use in a RF amplifier apparatus. In a preferred embodiment, the power block includes a DC to DC power supply circuit co-located with an RF power transistor device on a common heat sink. The power supply circuit has as an input a varying DC voltage and as outputs a constant supply voltage and a constant bias voltage. The power device has as inputs the constant supply voltage and the constant bias voltage, and further configured to receive and amplify an RF signal. The power supply circuit preferably includes a first laser trimmable resistor for setting the constant supply voltage and a second laser trimmable resistor for setting the bias voltage. In this manner, the constant supply and bias voltages may be easily tuned to a desired level during assembly of the power block device. The input and amplified RF signals are each matched to a relatively high impedance, e. g.
Integrated Cooling Of A Printed Circuit Board Structure
Integrated Cooling Of A Printed Circuit Board Structure
US Patent:
2002016, Nov 7, 2002
Filed:
May 1, 2001
Appl. No.:
09/847746
Inventors:
Robert Bartola - Pottstown PA, US
James Mogel - Boyertown PA, US
Steven Laureanti - Lewisville TX, US
James Mogel - Boyertown PA, US
Steven Laureanti - Lewisville TX, US
Assignee:
Ericsson Inc.
International Classification:
H05K007/20
US Classification:
361/699000
Abstract:
A cooling system for electronic components and printed circuit boards (PCBs) provides close thermal contact of a bulk coolant circulating through channels formed inside or on the surface of a multi-layer PCB carrying the electronic components, such that heat produced by the components is efficiently removed to a heat sink. The circulation channels may be formed by removing portions of layers, and inserting overlaying vias, during manufacturing or assembly of the PCB.