HOANG TRAN NGUYEN, M.D.
Osteopathic Medicine at Harbor Blvd, Santa Ana, CA

License number
California A80321
Category
Osteopathic Medicine
Type
Internal Medicine
Address
Address 2
16040 Harbor Blvd STE. G, Santa Ana, CA 92708
4061 Reyes St, Irvine, CA 92604
Phone
(714) 531-7930
(714) 531-7997 (Fax)
(949) 387-0239

Personal information

See more information about HOANG TRAN NGUYEN at radaris.com
Name
Address
Phone
Hoang Van Nguyen, age 62
4803 Sagasti Ave, San Diego, CA 92117
(858) 336-8115
Hoang Van Nguyen, age 83
47 S 21St St, San Jose, CA 95116
Hoang Van Nguyen
4812 Monument St, Simi Valley, CA 93063
(805) 581-1654
Hoang Van Nguyen, age 70
485 N Santa Maria St, Anaheim, CA 92801
Hoang Van Nguyen
4768 Winona Ave, San Diego, CA 92115

Organization information

See more information about HOANG TRAN NGUYEN at bizstanding.com

HOANG TRAN NGUYEN, MD., INC

16040 Hbr Blvd STE G, Fountain Valley, CA 92708

Registration:
Nov 1, 2004
State ID:
C2690808
Business type:
Articles of Incorporation
President:
Hoang Tran Nguyen (President)

Professional information

Hoang Nguyen Photo 1

R&Amp;D Engineer

Position:
Sr. R&D Engineer at Abbott Medical Optics
Location:
Orange County, California Area
Industry:
Medical Devices
Work:
Abbott Medical Optics since Oct 2010 - Sr. R&D Engineer Medegen May 2007 - Oct 2010 - Project Engineer Baxter Healthcare - Irvine, CA Oct 2006 - Apr 2007 - Contract Enginer
Education:
Cal State University, Fullerton; MSME 2010 - 2012
Master of Science (MS), Mechanical Engineering
University of California, San Diego 2002 - 2006
BS, Mechanical Engineering


Hoang Nguyen Photo 2

Project Engineer At Medegen

Position:
Project Engineer at Medegen
Location:
Orange County, California Area
Industry:
Medical Devices
Work:
Medegen - Project Engineer Baxter Healthcare Oct 2006 - Apr 2007 - Manufacturing Engineer
Education:
University of California, San Diego 2002 - 2006
BS, Mechanical Engineering


Hoang Nguyen Photo 3

Hoang Nguyen - Fountain Valley, CA

Work:
PANASONIC DISC MANUFACTURING CORPORATION
QC Supervisor
PANASONIC DISC MANUFACTURING CORPORATION - Torrance, CA
QC Supervisor
PANASONIC DISC MANUFACTURING CORPORATION
QA Lead
DELUXE VIDEO SERVICES AMERICA
QC Lead
DELUXE VIDEO SERVICES AMERICA - Garden Grove, CA
QC Inspector
DELUXE VIDEO SERVICES AMERICA
Quality Auditor
DELUXE VIDEO SERVICES AMERICA
QA Coordinator
DELUXE VIDEO SERVICES AMERICA
QC Inspector


Hoang Nguyen Photo 4

Hoang Nguyen - Fountain Valley, CA

Work:
Beckman Laser Institute
IT Technical Support
Private - Fountain Valley, CA
Academic Tutor
Education:
University of California - Irvine, CA
B.S. in Information and Computer Science
Skills:
Proficient in Java. Familiar with Javascript, MySQL, HTML, CSS


Hoang Nguyen Photo 5

Independent Information Technology And Services Professional

Location:
Orange County, California Area
Industry:
Information Technology and Services


Hoang Nguyen Photo 6

Independent Electrical/Electronic Manufacturing Professional

Location:
Orange County, California Area
Industry:
Electrical/Electronic Manufacturing


Hoang Nguyen Photo 7

Hoang Nguyen, Santa Ana CA

Specialties:
Social Work, Clinical Social Work
Address:
1540 E 1St St SUITE 100, Santa Ana 92701
(714) 972-3700 (Phone)
Languages:
English


Hoang Nguyen Photo 8

Semiconductor Package Having A Metal Paint Layer

US Patent:
2013033, Dec 19, 2013
Filed:
May 29, 2013
Appl. No.:
13/904566
Inventors:
Hoang Mong Nguyen - Fountain Valley CA, US
Anthony James LoBianco - Irvine CA, US
Howard E. Chen - Anaheim CA, US
International Classification:
H01L 23/552, H01Q 1/52, H01L 21/56
US Classification:
343841, 257659, 438127
Abstract:
Disclosed are devices and methods related to a conductive paint layer configured to provide radio-frequency (RF) shielding for a packaged semiconductor module. Such a module can include a packaging substrate, one or more RF components mounted on the packaging substrate, a ground plane disposed within the packaging substrate, and a plurality of RF-shielding wirebonds disposed on the packaging substrate and electrically connected to the ground plane. The module can further include an overmold structure formed over the packaging substrate and dimensioned to substantially encapsulate the RF component(s) and the RF-shielding wirebonds. The overmold structure can define an upper surface that exposes upper portions of the RF-shielding wirebonds. The module can further include a conductive paint layer having silver flakes disposed on the upper surface of the overmold structure so that the conductive paint layer, the RF-shielding wirebonds, and the ground plane form an RF-shield for the RF component(s).


Hoang Nguyen Photo 9

Power Amplifier Modules Including Related Systems, Devices, And Methods

US Patent:
2014000, Jan 2, 2014
Filed:
Jun 13, 2013
Appl. No.:
13/917384
Inventors:
Yifan Guo - Irvine CA, US
Mehran Janani - Oak Park CA, US
Tin Myint Ko - Newbury Park CA, US
Philip John Lehtola - Cedar Rapids IA, US
Anthony James LoBianco - Irvine CA, US
Hardik Bhupendra Modi - Irvine CA, US
Hoang Mong Nguyen - Fountain Valley CA, US
Matthew Thomas Ozalas - Novato CA, US
Sandra Louise Petty-Weeks - Newport Beach CA, US
Matthew Sean Read - Rancho Santa Margarita CA, US
Jens Albrecht Riege - Ojai CA, US
David Steven Ripley - Marion IA, US
Hongxiao Shao - Thousand Oaks CA, US
Hong Shen - Oak Park CA, US
Weimin Sun - Santa Rosa Valley CA, US
Hsiang-Chih Sun - Thousand Oaks CA, US
Patrick Lawrence Welch - Campbell CA, US
Guohao Zhang - Nanjing, CN
Assignee:
SKYWORKS SOLUTIONS, INC. - Woburn MA
International Classification:
H03F 3/19
US Classification:
330250
Abstract:
A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3×10cmat a junction with the base, the collector also having at least a first grading in which doping concentration increases away from the base; and an RF transmission line driven by the power amplifier, the RF transmission line including a conductive layer and finish plating on the conductive layer, the finish plating including a gold layer, a palladium layer proximate the gold layer, and a diffusion barrier layer proximate the palladium layer, the diffusion barrier layer including nickel and having a thickness that is less than about the skin depth of nickel at 0.9 GHz. Other embodiments of the module are provided along with related methods and components thereof.


Hoang Nguyen Photo 10

Radio-Frequency Modules Having Tuned Shielding-Wirebonds

US Patent:
2013002, Jan 24, 2013
Filed:
Jul 6, 2012
Appl. No.:
13/543084
Inventors:
Anil K. Agarwal - Ladera Ranch CA, US
Howard E. Chen - Anaheim CA, US
Anthony James LoBianco - Irvine CA, US
Matthew Sean Read - Rancho Santa Margarita CA, US
Hoang Mong Nguyen - Fountain Valley CA, US
Guohao Zhang - Irvine CA, US
Assignee:
SKYWORKS SOLUTIONS, INC. - Woburn MA
International Classification:
H01Q 1/52, H05K 3/30, H05K 9/00
US Classification:
343841, 361818, 29832
Abstract:
Disclosed are devices and methods related to radio-frequency (RF) shielding of RF modules. In some embodiments, tuned shielding can be achieved by utilizing different structures and/or arrangements of shielding-wirebonds to increase shielding in areas where needed, and to decrease shielding where not needed. Such tuning of shielding requirements can be obtained by measuring RF power levels at different locations of a module having a given design. Such tuned RF shielding configurations can improve the overall effectiveness of shielding, and can also be more cost effective to implement.