Havyn Eric Bradley
Engineers at Patterson Pl, Fort Collins, CO

5750422, May 12, 1998

Feb 24, 1995

8/394043

Louis Thomas Mills - Loveland CO
Richard M. Butler - Fort Collins CO
Havyn Eugene Bradley - Fort Collins CO

Hewlett-Packard Company - Palo Alto CA

H01L 2144

438112

An intergrated circuit package with plastic or glass reinforcement of leads to increase lead rigidity, to improve lead alignment and positional stability, and to prevent bent leads. The invention is particularly applicable to surface mount packages. For plastic packages, plastic between the leads is formed during molding of the plastic package. For metal packages, the plastic is molded as a separate operation. For ceramic packages with lead frames, glass may be formed as a separate operation or may be formed at the same time as a glass seal for the ceramic package. Reinforcement can optionally be thicker than the leads for increased rigidity. Optional extended lead lengths enable plastic or glass to be formed on either side of the soldered foot area of each lead. No changes to test fixtures or to pick and place equipment are required.

5281851, Jan 25, 1994

Oct 2, 1992

7/955622

Louis T. Mills - Loveland CO
Richard M. Butler - Fort Collins CO
Havyn E. Bradley - Fort Collins CO

Hewlett-Packard Company - Palo Alto CA

H01L 2348

257670

An integrated circuit package with plastic or glass reinforcement of leads to increase lead rigidity, to improve lead alignment and positional stability, and to prevent bent leads. The invention is particularly applicable to surface mount packages. For plastic packages, plastic between the leads is formed during molding of the plastic package. For metal packages, the plastic is molded as a separate operation. For ceramic packages with lead frames, glass may be formed as a separate operation or may be formed at the same time as a glass seal for the ceramic package. Reinforcement can optionally be thicker than the leads for increased rigidity. Optional extended lead lengths enable plastic or glass to be formed on either side of the soldered foot area of each lead. No changes to test fixtures or to pick and place equipment are required.

4054788, Oct 18, 1977

Jun 4, 1976

5/693063

David Steven Maitland - Loveland CO
Sandy Lee Chumbley - Loveland CO
Havyn E. Bradley - Fort Collins CO

Hewlett-Packard Company - Palo Alto CA

G06F 750

364786

Half-adder logic modules employing separate summing and carry circuitry are used in the construction of a modular binary half-adder. Carry bits of less significant digits are calculated independent of and prior to the calculation of corresponding sum bits, thus allowing rapid propagation of such carry bits to more significant digits and subsequent parallel summation of the sum bits using the carry bits previously calculated.

4103182, Jul 25, 1978

Sep 1, 1976

5/719541

Havyn E. Bradley - Fort Collins CO

Hewlett-Packard Company - Palo Alto CA

H03K 1920, H03K 1908, G06F 738

307203

A programmable transfer gate array generates control signals as functions of input variables in a digital logic circuit by using two-phase logic requiring no quiescent D. C. power consumption.