HARRY LAMAR JONES, M.D.
Radiology at Medical Pkwy, Austin, TX

4814855, Mar 21, 1989

Apr 29, 1986

6/857227

Rodney T. Hodgson - Ossining NY
Harry J. Jones - Austin TX
Peter G. Ledermann - Pleasantville NY
Timothy C. Reiley - Ridgefield CT
Paul A. Moskowitz - Yorktown Heights NY

International Business Machines Corporation - Armonk NY

H02G 1308

174 524

Automated bonding of chips to tape and formation of bonding structures on Tape Automated Bonding (TAB) packaging structures are provided with bonding balls on the ends of beams leads of the TAB tape. Also balltape bonding balls are aligned on stacked TAB sheets and bonded together to form via interconnections through stacked balltape balls in multilayer, electronic packaging structures. Interconnection structures are provided for a universal chip connection laminate which can be applied between a chip and an MLC package. Area TAB tape, which comprises a modification of TAB tape provides balltape TAB connections by means of balltape bonds to areas within the interior of a chip whose leads are bonded in a TAB tape arrangement to the Inner Lead Bonds of the area tape.

4746815, May 24, 1988

Jul 3, 1986

6/881755

Harsaran S. Bhatia - Hopewell Junction NY
Mario E. Ecker - Poughkeepsie NY
Harry J. Jones - Austin TX
Shashi D. Malaviya - Hopewell Junction NY

International Business Machines Corporation - Armonk NY

H03K 326, H03K 3335

307303

A specially designed module and integrated circuit chip therefor which permits the sharing of module EC pads between chip receiver and driver circuits. The chip has a direct normal input line to each receiver circuit therein and a direct normal output line from each driver circuit therein along with signal lines from each of those circuits to various EC pads. The chip further includes a switching and control circuit for switching the receiver circuits and driver circuits between their normal and EC lines to effect an electronic delete function. In a preferred embodiment, a majority of the EC pads are switchably connected via the switching and control circuit to different sets of three adjacent receiver circuits, driver circuits, or a combination thereof. The design permits the use of approximately half the EC pads normally required for a module, while permitting EC connections to be made in most cases to three adjacent receiver or driver circuits simultaneously.

4743781, May 10, 1988

Jul 3, 1986

6/882058

Harsaran S. Bhatia - Hopewell Junction NY
Harry J. Jones - Austin TX
Shashi D. Malaviya - Hopewell Junction NY

International Business Machines Corporation - Armonk NY

H03K 19013, H03K 19086, H03K 1704, H03K 1760

307455

A new dotting circuit for integrated circuit chips which provides line switching, as well as simultaneous true and complementary outputs, while eliminating the need for the standard collector circuit voltage clamp. This circuit is implemented by the collector dotting of two or more input transistors, the collector dotting of their respective reference transistors, the emitter dotting of one input transistor and a reference transistor to a constant current source, the emitter dotting of the other input transistor and the other reference transistor to a different constant current source, and an inhibit circuit for permitting current to flow to only one of the emitter-dotted circuits in accordance with a logic control signal.