GRANT M SMITH
Engineers in Bryn Athyn, PA

6217440, Apr 17, 2001

Oct 29, 1998

9/182273

Mark William Wessel - New Oxford PA
Grant M. Smith - Bryn Athyn PA

Unisys Corporation - Blue Bell PA

H05K 720

454184

An air mover system is provided having plural air movers each mounted along an air flow path. Each of the air movers includes means mounted for forward rotation to generate forward air flow. Each of the air movers also includes means for preventing reverse rotation of the air flow generating means, thereby reducing reverse air flow.

6664463, Dec 16, 2003

Mar 15, 2000

09/525411

Mark R. Treiber - Philadelphia PA
Peter Klein - Phoenixville PA
Grant M. Smith - Bryn Athyn PA

Unisys Corporation - Blue Bell PA

H05K 900

174 35GC, 174 35 R, 361704, 361712, 361816

An apparatus is provided for dissipating heat from an electronic component, such as a processor, that is mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component. The apparatus includes a heat sink that is configured to be mounted to a surface of the electronic component. The apparatus also includes a conductor connected to the heat sink. The conductor is configured to provide electrical contact between the heat sink and a surface of the conductive enclosure. Accordingly, the apparatus at least partially shields the electromagnetic radiation generated by the electronic component. A corresponding method is also provided.

6049467, Apr 11, 2000

Aug 31, 1998

9/144322

Vladimir K. Tamarkin - Huntingdon Valley PA
Grant M. Smith - Bryn Athyn PA

Unisys Corporation - Blue Bell PA

H05K 702

361790

A stacked circuit assembly is provided for mounting memory modules in close proximity to an integrated circuit. The assembly includes an integrated circuit mounted on a printed circuit board and at least one stacked printed circuit board mounted in substantially parallel arrangement with respect to the printed circuit board on which the integrated circuit is mounted. A memory module is mounted for electrical connection on a surface of the stacked printed circuit board and an interface connector is mounted on facing surfaces of the printed circuit board and the stacked printed circuit board, thereby providing means for both mechanical and electrical connection between the boards. The integrated circuit and the memory module are mounted in parallel relationship with respect to one another for electrical interconnection through the boards and the interface connectors, thereby reducing the physical distance between the integrated circuit and the memory module.

6324062, Nov 27, 2001

Apr 2, 1999

9/285814

Mark R. Treiber - Philadelphia PA
Peter P. Klein - Huntington Valley PA
N. Kenneth Newman - Hatfield PA
Grant M. Smith - Bryn Athyn PA

Unisys Corporation - PA

G06F 116, H05K 502

361727

A packaging configuration is provided for a computer system that is adapted for operating multiple operating systems in different partitions of the computer system. The packaging configuration includes a main chassis having a main circuit board. The packaging configuration also includes a processor assembly configured for insertion into the main chassis. The processor assembly has a circuit board for connection to the main circuit board upon insertion of the processor assembly. The packaging configuration also includes a processor subassembly configured for insertion into the processor assembly. The processor subassembly includes a circuit board and a processor and is configured for connection with a circuit board in the processor assembly upon insertion of the processor subassembly. The processor assembly is removable from the main chassis without powering down the computer system, and the processor subassembly is removable from the processor assembly without powering down the computer system.

6987667, Jan 17, 2006

Mar 17, 2003

10/390370

Keith D. Mease - Gibbstown NJ, US
Grant M. Smith - Bryn Athyn PA, US

Unisys Corporation - Blue Bell PA

G06F 1/20

361687, 361752, 3122236, 3647081

A computer subassembly is configured to be mounted within a rack along an insertion axis. The computer subassembly includes a chassis configured for insertion into and removal from the rack along the insertion axis, wherein the chassis at least partially defines an interior. An interconnect assembly is mounted within or adjacent the interior of the chassis, and the interconnect assembly is oriented along a plane that is substantially parallel to the insertion axis. At lease one circuit assembly is positioned at least partially within the interior of the chassis and is connected to the interconnect assembly. The circuit assembly is oriented in a plane substantially parallel to the insertion axis. A source of cooling air is positioned to direct cooling air through the interior of the chassis along the insertion axis.

6198628, Mar 6, 2001

Nov 24, 1998

9/198719

Grant M. Smith - Bryn Athyn PA

Unisys Corporation - Blue Bell PA

H05H 720

361695

A system is provided for cooling electronic components and for localized cooling of selected electronic components. An air mover is mounted adjacent to an exhaust opening in order to generate a low pressure zone within the cabinet's interior. An inlet opening is defined in a cabinet so that the air mover can generate a serial air flow path extending from the inlet opening to the exhaust opening for cooling of electronic components within the cabinet. At least one secondary opening is defined in the cabinet so that the air mover can generate a parallel air flow path, for cooling of selected electronic components, that extends from the secondary opening and then joins the serial air flow path.

6992894, Jan 31, 2006

Mar 17, 2003

10/390419

Keith D. Mease - Gibbstown NJ, US
Mark W. Wessel - Bala Cynwyd PA, US
Grant M. Smith - Bryn Athyn PA, US
Terry W. Louth - Narvon PA, US
Daniel A. Jochym - Downingtown PA, US
Ronald T. Gibbs - Paoli PA, US

Unisys Corporation - Blue Bell PA

H05K 7/20, H01L 23/40

361719, 361697, 361799, 361800, 257718

An apparatus and method are provided for dissipating heat from an electronic component mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component. A heat sink is configured to be mounted in thermal contact with the electronic component. An electrical conductor is operatively connected to the heat sink and configured to provide electrical contact between the heat sink and a surface of the conductive enclosure, thereby at least partially shielding the electromagnetic radiation generated by the electronic component.

5424914, Jun 13, 1995

Nov 24, 1993

8/157858

Grant M. Smith - Bryn Athyn PA
John A. Helgenberg - Collegeville PA

Unisys Corporation - Blue Bell PA

H05K 720

361694

The present invention relates to an apparatus for providing a cooling system for electrical components mounted to the opposite side of a backplane from that on which the cooling air is dispersed. The invention of the present application accomplishes this cooling by providing for siphoning a portion of the cool air from the air plenum, directing it up a duct, and delivering it through a series of apertures onto the component which requires cooling on the back side of the backplane. The apertures include one through the backplane which is homologously positioned with respect to the electrical component on the back side of the backplane.

5574626, Nov 12, 1996

Jul 12, 1995

8/501479

Grant M. Smith - Bryn Athyn PA

Unisys Corporation - Blue Bell PA

H05K 720, H01L 2340

361704

An add-on heat sink for increasing the thermal efficiency of an existing heat sink comprises a support base, a first plurality of fins extending from the support base for dissipating heat and a second plurality of spaced fins extending from the support base that are arranged to intermesh with the fins of the existing heat sink and to form an interference fit therewith, whereby the add-on heat sink can be removably attached to the existing heat sink.

7054155, May 30, 2006

Mar 17, 2003

10/390369

Keith D. Mease - Gibbstown NJ, US
Grant M. Smith - Bryn Athyn PA, US
John Ruscitelli - Broomall PA, US

Unisys Corporation - Blue Bell PA

H05K 7/20

361695, 361694, 361690, 16510434, 454186

A fan tray assembly. The assembly comprises a module, housing electronic components that require cooling, and one or more fan trays having fans that direct a cooling air flow through the module. The assembly facilitates easy and fast removal and replacement of the fan trays with respect to the module. These desirable attributes are achieved by five main features of the assembly: (1) a retaining slot-and-tab engagement pivotally attaching each fan tray to one side of the module, (2) a channel-in-track automatically aligning each fan tray as it closes against the module, (3) a leaf spring releasably locking each fan tray into a closed position, (4) a floating power-and-signal connector on each fan tray electrically and mechanically engaging a corresponding receptacle on the module, and (5) a pull ring facilitating manipulation of each fan tray.