GEORGE ARTHUR PUBANZ
Pilots at 195 Ave, Beaverton, OR
License number
Oregon A2501475
Issued Date
Sep 2016
Expiration Date
Sep 2018
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
10627 NW 195Th Ave, Beaverton, OR 97124
Personal information
See more information about GEORGE ARTHUR PUBANZ at radaris.comName
Address
Phone
10627 NW 195Th Ave, Hillsboro, OR 97124
Beaverton, OR
10627 195Th Ave, Hillsboro, OR 97124
10627 NW 195Th Ave, Hillsboro, OR 97124
Professional information
Failure Analysis Engineer At Triquint Semiconductor
Position:
Failure Analysis Engineer at TriQuint Semiconductor
Location:
Portland, Oregon Area
Industry:
Semiconductors
Work:
TriQuint Semiconductor
- Hillsboro, OR since 2011
-
Failure Analysis Engineer
Advanced Inquiry Systems
2007 - Dec 2010
-
Sr. Materials Scientist
Steridian, Inc.
Aug 2005 - Apr 2006
-
Sr. Materials Scientist
Maxtek
2004 - 2005
-
Project Manager
Tektronix
1988 - 2002
-
Sr. Scientist / Engineering Manager
Oregon State University
1986 - 1988
-
Research Associate
Education:
Oregon State University 1980 - 1986
Ph.D., Physical Chemistry
Ph.D., Physical Chemistry
Cryogenic Optical/Electrical Interconnect Module
US Patent:
6048107, Apr 11, 2000
Filed:
May 5, 1998
Appl. No.:
9/073007
Inventors:
George Pubanz - Hillsboro OR
Assignee:
Tektronix, Inc. - Beaverton OR
International Classification:
G02B 636
US Classification:
385 92
Abstract:
A cryogenic optical/electrical interconnect module has optical fibers captivated by an optical fiber fixture. The optical fiber fixture includes a stress support section that captivates the buffers protecting the optical fibers in V-grooves, while the bared optical fibers are laid in V-grooves in a carrier portion that has a slant edge at the end. A photodiode fixture of the same material as the optical fiber fixture has a photodiode array mounted thereon, and the optical fiber fixture is aligned with the photodiode array so that optimal optical energy is coupled from the optical fibers to the photodiodes. The fixtures are mounted in a cavity of a conductive substrate and a circuit board is mounted on the top surface of the substrate surrounding the cavity. The circuit board has microstrip lines, and the photodiodes are electrically coupled to the microstrip lines by flexible microstraps. A thermal transition block may be mounted in the cavity between the substrate and the fixtures.