GARY LOREN LEWIS
Pilots at Reed Hl Rd, Campbell, NY
License number
New York A3827592
Issued Date
May 2016
Expiration Date
May 2018
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
4650 Reed Hill Rd, Campbell, NY 14821
Professional information
Chuck Heater For Improved Planar Deposition Process
US Patent:
6328807, Dec 11, 2001
Filed:
Dec 14, 1999
Appl. No.:
9/461082
Inventors:
Heather D. Boek - Corning NY
Elizabeth A. Boylan - Big Flats NY
Haibo Huang - Painted Post NY
Pascale Laborde - Corning NY
Gary L. Lewis - Campbell NY
William P. Ryszytiwskyj - Corning NY
Pushkar Tandon - Corning NY
Elizabeth A. Boylan - Big Flats NY
Haibo Huang - Painted Post NY
Pascale Laborde - Corning NY
Gary L. Lewis - Campbell NY
William P. Ryszytiwskyj - Corning NY
Pushkar Tandon - Corning NY
Assignee:
Corning Incorporated - Corning NY
International Classification:
C23C 1600, C23C 1602
US Classification:
118724
Abstract:
A method and apparatus for the flame hydrolysis deposition (FHD) of a core material on a substrate provides a holder for a substrate which is heated to a predetermined temperature selected to maintain the substrate temperature relatively constant during the FHD process. As a result, the thickness of a thin film applied to the substrate is relatively uniform as is the index of refraction of the core material deposited on the substrate. In one embodiment, a chuck for receiving a disk-shaped substrate wafer is supplied with an embedded electrical heater for maintaining the chuck temperature at from about 700. degree. C. to about 900. degree. C. In another embodiment, a gas heater positioned on a side of the chuck opposite the wafer mounting is provided to heat the chuck at substantially the same temperature. In either embodiment, a chuck is rotated with respect to a line-flame burner which introduces a vaporized mixture of organometallic material into the line-flame burner for depositing a thin film of from about 5 to 6. 5 microns of doped glass on the wafer substrate.