Gary Douglas Johnson
Pharmacy at Elliot Rd, Tempe, AZ

5729185, Mar 17, 1998

Apr 29, 1996

8/639673

Gary Carl Johnson - Tempe AZ
David Patrick Stumbo - Scottsdale AZ
Steven Richard Young - Gilbert AZ
Michael Anderson - Phoenix AZ

Motorola Inc. - Schaumburg IL

H03H 964, H01L 4100

333193

A method for packaging an acoustic wave filter (102). The method includes a step of providing a first wafer (100). The first wafer (100) supports acoustic wave transduction and propagation. The method also includes steps of processing the wafer (100) to provide transducer patterns (18, 18') thereon and disposing a seal ring (25) on the wafer (100). The seal ring (25) completely encloses active areas allowing portions of each bond pad to extend outside of the seal ring. The method further includes steps of disposing a second wafer (40) atop the seal ring (25) and the first wafer (100), sealing the second wafer (40) to the first wafer (100), dicing the second wafer (40) with a saw that provides a first kerf width, whereby portions of the second wafer (40) overlying bonding pads (20) of the transducer patterns (18, 18') are removed and dicing the first wafer (100) with a saw that provides a second kerf width narrower than the first kerf width to provide a packaged SAW die.

5587883, Dec 24, 1996

Nov 13, 1995

8/557667

Timothy L. Olson - Phoenix AZ
Lauriann T. Carney - Gilbert AZ
Gary C. Johnson - Tempe AZ
William M. Strom - Chandler AZ

Motorola, Inc. - Schaumburg IL

H05K 720

361723

A lead frame package for housing an integrated circuit. A lead frame (11) having a plurality of leads (13) extending from at least three sides of the package. Lead frame (11) is formed having a first region (18), a transition region (19), and a second region (21). A distance between a heat sink (12) and the lead frame (11) may vary. The offset is chosen to compensate for a predetermined distance between the heat sink (12) and the lead frame (11) such that the lead frame (11) aligns to lead frame handling equipment. A single lead frame manufacturing setup can then be used. A slot (22) is formed in the lead frame (11) extending through the second region (21) and the transition region (19) into first area (18) providing a path for injecting an encapsulation material into a mold.

5969461, Oct 19, 1999

Apr 8, 1998

9/057144

Michael J. Anderson - Phoenix AZ
Gregory Kennison - Mesa AZ
Jeffrey E. Christensen - Scottsdale AZ
Gary C. Johnson - Tempe AZ
Jon G. Aday - Gilbert AZ

CTS Corporation - Elkhart IN

H01L 4108, H03H 925

310313R

A method for packaging an acoustic wave device (10) without contaminating an active area (12) disposed on a face (14) thereof, including steps of: providing a substrate with a top (30) having conductive pads (18), bonding stud bumps (20) to a periphery (22) of the face (14) of the acoustic wave device, disposing a dam (26) onto the top (30) of the substrate and inside of the location of the conductive pads (18), aligning and connecting the stud bumps (20) to the conductive pads (18) on the top of the substrate to form electrically conductive interconnections between the acoustic wave device (10) and the substrate (16), flowing an underfill material (28) at the periphery (22) of the acoustic wave device and around the interconnections such that the underfill material (28) stops at a boundary (32) defined by the dam (26), and curing the underfill material (28) to mechanically reinforce and protectively encapsulate the interconnections.

5928598, Jul 27, 1999

May 9, 1997

8/854239

Michael John Anderson - Phoenix AZ
Gary Carl Johnson - Tempe AZ
Mark Phillip Popovich - Gilbert AZ
Jeffrey Eames Christensen - Scottsdale IL

Motorola, Inc. - Schaumburg IL

B29C 4514, B29C 7070

264446

A method (38) for packaging a microelectronic device (10) and a device (10) packaged by the method (38). The method (38) includes a step of providing (42) a first material (16) on an active surface of the microelectronic device (10). The first material (16) has a first temperature coefficient of expansion. The method (38) also includes steps of heating (46) the microelectronic device (10) and the first material (16) to a predetermined first temperature and molding (48) a second material (20) about the microelectronic device (10) and the first material (16). The second material (20) has a second temperature coefficient of expansion less than that of the first material (16). A final step of cooling (50) the first material (16), the second material (20) and the microelectronic device (10) provides a packaged microelectronic device (30).

5702775, Dec 30, 1997

Dec 26, 1995

8/578801

Michael John Anderson - Phoenix AZ
Gary Carl Johnson - Tempe AZ
Mark Phillip Popovich - Gilbert AZ
Jeffrey Eames Christensen - Scottsdale IL

Motorola, Inc. - Schaumburg IL

B32B 300

428 1

A method (38) for packaging a microelectronic device (10) and a device (10) packaged by the method (38). The method (38) includes a step of providing (42) a first material (16) on an active surface of the microelectronic device (10). The first material (16) has a first temperature coefficient of expansion. The method (38) also includes steps of heating (46) the microelectronic device (10) and the first material (16) to a predetermined first temperature and molding (48) a second material (20) about the microelectronic device (10) and the first material (16). The second material (20) has a second temperature coefficient of expansion less than that of the first material (16). A final step of cooling (50) the first material (16), the second material (20) and the microelectronic device (10) provides a packaged microelectronic device (30).

6967390, Nov 22, 2005

Feb 13, 2003

10/367344

Gary Johnson - Tempe AZ, US

Freescale Semiconductor, Inc. - Austin TX

H01L023/552

257659, 257660, 257699, 257676

An electronic component includes an electronic chip () and a chip carrier portion () having sidewalls () and a bottom portion (). The electronic chip is mounted over the bottom portion of the chip carrier portion, and the chip carrier portion shields the electronic chip from radiation outside of the electronic component.

5892417, Apr 6, 1999

Dec 27, 1996

8/775074

Gary Carl Johnson - Tempe AZ
Michael J. Anderson - Phoenix AZ
Gregory Jon Kennison - Mesa AZ
Jeffrey Eanes Christensen - Scottsdale AZ
Mark Phillip Popovich - Gilbert AZ

Motorola Inc. - Schaumburg IL

H03H 905, H01L 41053

333193

A method for packaging an acoustic wave filter die, and an acoustic wave filter die packaged by the method. The method includes steps of providing an acoustic wave filter die having an active area disposed on a first surface thereof, providing a leadframe including a die flag and sealing the first surface to the die flag. The method also includes steps of molding a plastic package body about the die and the die flag and singulating the plastic body, the die and the die flag. The molding step desirably includes substeps of placing the acoustic wave filter die sealed to the leadframe in a mold, applying a thermosetting plastic material at a suitable temperature less than the glass transition temperature and at a suitable pressure to the acoustic wave filter die sealed to the leadframe in the mold and maintaining the suitable temperature for a suitable period of time.