GARY CHEN, M.D.
Radiology at Euclid Ave, Cleveland, OH

6758263, Jul 6, 2004

Dec 13, 2001

10/015459

Daniel W. Krassowski - Columbia Township OH
Gary G. Chen - Parma OH

Advanced Energy Technology Inc. - Wilmington DE

F28F 700

165185, 165 803, 165905, 361704, 361697, 257720

A thermal management system provides a heat dissipating component using a high thermal conductivity insert. The heat dissipating component may be a spreader or heat sink, and includes a planar graphite member having high thermal conductivity along the plane of the member and having a relatively low thermal conductivity through the thickness of the member. A cavity is formed through the thickness of the member and the high conductivity insert is received in the cavity. The insert may be an isotropic high thermal conductivity material such as copper or an anisotropic material such as graphite oriented to have high conductivity in the direction of the thickness of the planar element.

2003017, Sep 18, 2003

Mar 13, 2002

10/098132

Daniel Krassowski - Columbia Township OH, US
Gary Chen - Parma OH, US

F28F007/00, F28F001/00, F24H003/02

165/080300, 165/121000

A heat sink apparatus is provided with a cooling channel which directs cooling air between groups of fins on either side of the cooling channel to a location adjacent that of an electronic device to be cooled. The increase in cooling efficiency achieved by providing cooling air to the critical location of the electronic device more than offsets any loss in cooling efficiency due to the elimination of fins required for creation of the cooling channel. Thus a heat sink apparatus can be designed providing increased cooling to selected locations without the use of heat pipes or the like.

7108055, Sep 19, 2006

Dec 22, 2003

10/744309

Daniel W. Krassowski - Columbia Station OH, US
Gary G. Chen - Parma OH, US

Advanced Energy Technology Inc. - Wilmington DE

F28F 7/00, H05K 7/20

165185, 165 803, 165905, 361703, 361704

An optimized design for a composite heat sink is provided utilizing a high thermal conducting base and low thermal conducting fins. The base preferably is constructed from anisotropic graphite material, and the fins are preferably constructed from a thermally conductive plastic material. In the case of a low profile heat sink having a fin height of no greater than about 3 times that of the base, the composite construction provides superior cooling yet lighter weight as compared to a conventional all-aluminum heat sink of the same dimensions.

2003018, Oct 2, 2003

Mar 29, 2002

10/113381

Daniel Krassowski - Columbia Station OH, US
Gary Chen - Parma OH, US

F28F007/00

165/185000, 165/905000

An optimized design for a composite heat sink is provided utilizing a high thermal conducting base and low thermal conducting fins. The base preferably is constructed from anisotropic graphite material, and the fins are preferably constructed from a thermally conductive plastic material. In the case of a low profile heat sink having a fin height of no greater than about 15 mm, the composite construction provides superior cooling yet lighter weight as compared to a conventional all-aluminum heat sink of the same dimensions.

2004011, Jun 24, 2004

Dec 23, 2002

10/328302

Daniel Krassowski - Columbia Station OH, US
Gary Chen - Parma OH, US
Thomas Burkett - Avon Lake OH, US
Brian Ford - Grayslake IL, US
Jing-Wen Tzeng - Irvine CA, US
Julian Norley - Chagrin Falls OH, US
Martin Smalc - Parma OH, US

Graftech, Inc. - Wilmington DE

F28D015/00

165/104260

The invention provides to thermal management devices constructed from flexible graphite. In one embodiment, the thermal management device includes a wick structure inside a shell. In certain preferred embodiments, the wick structure is composed of a mass of expanded graphite. In a another embodiment, the shell of the-device includes flexible graphite and an optional wick structure. In certain preferred embodiments, the flexible graphite shell is fluid impermeable. The invention further includes methods of making the aforementioned thermal management devices.

2006007, Apr 6, 2006

Sep 17, 2004

10/943338

Joseph Capp - Strongsville OH, US
Gary Chen - Parma OH, US

F28F 7/00

165080200

A heat riser for bridging the gap between a heat source and a heat dissipation device in an electronic component, the heat riser formed of a flexible graphite article having two operative surfaces, one of which is in operative contact with a surface of the heat source and the other of which is in operative contact with a surface of the heat dissipation device.