FRANK JOSEPH ARDEZZONE
Pilots in Santa Clara, CA

6467827, Oct 22, 2002

Oct 30, 1999

09/431041

Frank J. Ardezzone - Santa Clara CA 95052-0242

B25J 1500

2941193, 294 991, 294907, 414941, 901 36, 901 39

Presented is an end-effector for grasping integrated circuit wafers with a talon-like device that effectively grips an arcuate peripheral “free zone” of the wafer-without effecting contact of the wafer in a manner to contaminate it. Structurally, in one aspect of the invention, the end-effector or talon-like device is formed by-confronting top and bottom plate members configured to form a “shell” within which is displaceably mounted a member which, when selectively displaced in one direction by the imposition-of-an-appropriate force, opens a normally-closed gripping member for receiving the arcuate peripheral “free zone” of the wafer and when selectively displaced in the opposite direction by the removal of the opening force tightly grips the arcuate peripheral “free zone” of the wafer to releasably retain it attached to the end-effector, from which it may selectively be released by the imposition of force in an opening direction that opposes and overcomes the force that effects gripping of the wafer. An indicator may be provided to signal the proper positioning of the wafer in relation to the end-effector, and a control system may be provided to effect opening and closing operation of the arcuate talon-like clamp.

4144536, Mar 13, 1979

Nov 21, 1977

5/853340

Frank J. Ardezzone - Santa Clara CA
Arthur P. Verhoeven - Mountain View CA

Probe-Rite, Inc. - Santa Clara CA

G01D 1516

346 33F

A inker network for use with a tester and a probing machine for marking semiconductor wafers and including a delay circuit for receiving clocking pulses and a first ink command pulse from the tester and for generating a delayed ink command pulse which is delayed an integer number of clock pulses, a direction detector for receiving first and second transport signals from the probing machine and for generating first and second direction signals dependent on the direction the wafer is being transported, and a steering circuit responsive to the delayed pulse in one mode and for generating a double pulse of adjustment width and amplitude on first or second output lines in response to the first and second direction signals, respectively, and in a second mode for generating the double pulse of adjustment width and amplitude on the first or second or both of the output lines in response to the first or second ink command pulse from the tester or both pulses simultaneously, respectively.

4588241, May 13, 1986

Sep 23, 1983

6/535244

Frank J. Ardezzone - Santa Clara CA

Probe-Rite, Inc. - San Jose CA

H01R 1100

339 59M

A surface mating coaxial connector for use in transmitting signals to an electronic device. The connector has a contact pin electrically and mechanically connected to a central conductor of a small coaxial cable through an axially-moveable connection means. The shielding of the coaxial cable is extended from the cable over the length of the connector including the contact pin by a shield extension means which minimizes interference from adjacent contact pins. An insulation means electrically isolates the shield extension means from the contact pin and the axially-moveable connection means and is configured such that the impedance of the coaxial cable is maintained to the point of contact of the contact pin. The contact pin and a shield collar which surrounds the contact pin are independently and automatically adjustable in the axial direction to compensate for height variations of the surface on which contact is made.

4636722, Jan 13, 1987

May 21, 1984

6/612440

Frank J. Ardezzone - Santa Clara CA

Probe-Rite, Inc. - San Jose CA

G01R 106, G01R 3102

324158P

A test probe head assembly having a probe assembly comprising a plurality of probe arms with terminal probe-points mounted on a support member with means for transmitting electrical signals between an external signal source and the probe's arms. The probe-points are resiliently mounted on the probe assembly which is itself capable of deflection.

4055805, Oct 25, 1977

Jun 28, 1976

5/700489

Frank J. Ardezzone - Santa Clara CA

Probe Rite, Inc. - Santa Clara CA

G01R 3102, G01R 106

324158P

A multi-point probe head assembly for providing electro-mechanical interface contact with miniature electronic devices and including a rigid support member, a plurality of probe tips each attached to a probe arm, and adjustment means for adjusting the relative position of each probe tip in three orthogonal planes.