FRANK JONES, ATC
Athletic Trainer at Dobson Rd, Chandler, AZ
License number
Arizona 0736
Category
Restorative Service Providers
Type
Athletic Trainer
Address
Address
655 S Dobson Rd BLDG B, Chandler, AZ 85224
Phone
(480) 732-0099
(480) 732-7457 (Fax)
(480) 732-7457 (Fax)
Professional information
Frank Jones, Chandler AZ - ATC
Specialties:
Athletic Training
Address:
655 S Dobson Rd STE B, Chandler 85224
(480) 732-0099 (Phone), (480) 732-7457 (Fax)
(480) 732-0099 (Phone), (480) 732-7457 (Fax)
Languages:
English
Microelectronic Package Including A Polymer Encapsulated Die
US Patent:
6093972, Jul 25, 2000
Filed:
May 3, 1999
Appl. No.:
9/304152
Inventors:
Francis J. Carney - Gilbert AZ
George Amos Carson - Elk Grove Village IL
Phillip C. Celaya - Chandler AZ
Harry Fuerhaupter - Lombard IL
Frank Tim Jones - Chandler AZ
Donald H. Klosterman - Gilbert AZ
Cynthia M. Melton - Bolingbrook IL
James Howard Knapp - Chandler AZ
Keith E. Nelson - Tempe AZ
George Amos Carson - Elk Grove Village IL
Phillip C. Celaya - Chandler AZ
Harry Fuerhaupter - Lombard IL
Frank Tim Jones - Chandler AZ
Donald H. Klosterman - Gilbert AZ
Cynthia M. Melton - Bolingbrook IL
James Howard Knapp - Chandler AZ
Keith E. Nelson - Tempe AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 2331
US Classification:
257790
Abstract:
A microelectronic package (10) is formed and includes an integrated circuit die (12) attached to a substrate (14) by a plurality of solder bump interconnections (16) to form a preassembly (18). The integrated circuit die (12) has an active face (20) that faces the substrate (14) and is spaced apart therefrom by a gap (22). The integrated circuit die (12) also includes a back face (24) opposite the active face (20). The substrate (14) includes a die attach region (26) and a surrounding region (28) about the integrated circuit die (12). The solder bump interconnections (16) extend across the gap (22) and connect the integrated circuit die (12) and the substrate (14). A mold (30) is disposed about the preassembly (18) such that the mold (30) cooperates with the substrate (14) to define a mold cavity (32) that encloses the integrated circuit die (12). The mold (30) has a molding surface (34) that includes the surrounding region (28) and a mold surface (34) that faces the back face (24) and is spaced apart therefrom. A polymeric precursor (36) is dispensed into the mold cavity (32) and is formed against the molding surface (34) and the back face (24).
Microelectronic Package Including A Polymer Encapsulated Die, And Method For Forming Same
US Patent:
5895229, Apr 20, 1999
Filed:
May 19, 1997
Appl. No.:
8/858756
Inventors:
Francis J. Carney - Gilbert AZ
George Amos Carson - Elk Grove Village IL
Phillip C. Celaya - Chandler AZ
Harry Fuerhaupter - Lombard IL
Frank Tim Jones - Chandler AZ
Donald H. Klosterman - Gilbert AZ
Cynthia M. Melton - Bolingbrook IL
James Howard Knapp - Chandler AZ
Keith E. Nelson - Tempe AZ
George Amos Carson - Elk Grove Village IL
Phillip C. Celaya - Chandler AZ
Harry Fuerhaupter - Lombard IL
Frank Tim Jones - Chandler AZ
Donald H. Klosterman - Gilbert AZ
Cynthia M. Melton - Bolingbrook IL
James Howard Knapp - Chandler AZ
Keith E. Nelson - Tempe AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 2144, H01L 2148
US Classification:
438106
Abstract:
A microelectronic package (10) is formed and includes an integrated circuit die (12) attached to a substrate (14) by a plurality of solder bump interconnections (16) to form a preassembly (18). The integrated circuit die (12) has an active face (20) that faces the substrate (14) and is spaced apart therefrom by a gap (22). The integrated circuit die (12) also includes a back face (24) opposite the active face (20). The substrate (14) includes a die attach region (26) and a surrounding region (28) about the integrated circuit die (12). The solder bump interconnections (16) extend across the gap (22) and connect the integrated circuit die (12) and the substrate (14). A mold (30) is disposed about the preassembly (18) such that the mold (30) cooperates with the substrate (14) to define a mold cavity (32) that encloses the integrated circuit die (12). The mold (30) has a molding surface (34) that includes the surrounding region (28) and a mold surface (34) that faces the back face (24) and is spaced apart therefrom. A polymeric precursor (36) is dispensed into the mold cavity (32) and is formed against the molding surface (34) and the back face (24).