Inventors:
Sriranga S. Boyapati - Austin TX, US
Frank W. Smith - Austin TX, US
Assignee:
SPANSION LLC - Sunnyvale CA
International Classification:
C25D 5/00
Abstract:
A process of forming an electronic device can include placing a seed layer into an electroplating solution within an electroplating tool. The electroplating tool can include a first electrode and a second electrode, wherein the first electrode is electrically connected to the seed layer. The process can also include depositing a first portion of a conductive layer using a first signal of a first type (e.g., direct current) between the first electrode and a second electrode, and depositing a second portion of the conductive layer over the first portion of the conductive layer, using a second signal of a second type (e.g., alternating current) between the first electrode and the second electrode of the electroplating tool.