Frank Anderson
Plumbers in Denver, CO

2011000, Jan 13, 2011

Oct 3, 2006

11/538409

Frank E. Anderson - Golden CO, US
Kevin R. McNerney - Lakewood CO, US
Steven M. Brazil - Benton AZ, US

CoorsTek, Inc. - Golden CO

C04B 35/565, C04B 35/563

501 91, 501 87

A reaction bonded ceramic body that has 50% to 60%, by weight, boron carbide, and 20% to 30%, by weight, silicon carbide. The reaction bonded ceramic body has least a portion of the boron carbide reacted with silicon to become siliconized boron carbide. Also, a method of making a reaction bonded ceramic material. The method may include the steps of forming a green body from a mixture of boron carbide, carbon, and an organic binder, and contacting the green body with a liquid infiltrant comprising silicon. The infiltrant has a temperature of about 1625° C. to about 1700° C. Furthermore, a method of making a reaction bonded boron carbide ceramic body. The method includes the steps of forming a green body from a mixture of boron carbide, carbon, and an organic binder. The weight ratio of boron carbide to carbon in the green body may be about 5:5 to 1 or more. The method also includes siliconizing a first portion of the boron carbide to siliconized boron carbide by contacting the green body with a molten silicon infiltrant, where the infiltrant has a temperature of about 1625° C. to about 1700° C. The method may further include dissolving a second portion of the boron carbide in the silicon infiltrant, where at least some of the dissolved boron carbide is reprecipated as smooth particulates.

2012029, Nov 29, 2012

May 23, 2011

13/113201

Alessandro G. Borsa - Evergreen CO, US
Jason Blush - Lakewood CO, US
Barry Fitzpatrick - Lakewood CO, US
Frank Anderson - Golden CO, US

C03B 37/095, C03B 37/08

65495

A bushing system includes a bushing having a bottom plate with a plurality of holes from which filaments are drawn. At least one elongated support extends through the bushing generally along a longitudinal axis to hold and stabilize the bushing. To handle the harsh conditions under which the bushing is subjected, the support comprises an alumina-based ceramic that generally resists sagging or excessive expansion and contraction during heating and cooling.

6872676, Mar 29, 2005

Apr 25, 2003

10/424569

Matthew W. Schaefer - Arvada CO, US
Frank E. Anderson - Golden CO, US
Brian Seegmiller - Arvada CO, US

CoorsTek, Inc. - Golden CO

C04B035/488

501105, 501127, 501153

The present invention provides a semiconductive zirconia sintering material comprising more than 2% by weight of aluminum oxide and sintered zirconia material derived therefrom as well as a method of producing the sintered material. The sintered semiconductive zirconia materials of the present invention have a better physical and mechanical properties than conventional sintered semiconductive zirconia materials.

2004009, May 13, 2004

Jul 1, 2003

10/612280

Frank Anderson - Golden CO, US
Steven Landin - Conifer CO, US

CoorsTek, Inc. - Golden CO

C04B035/10

501/127000, 501/153000

A method for making an aluminum oxide (AlO) component utilizes an amount of aluminum oxide in particle form. The aluminum oxide initially has less than about 100 parts per million of sodium and less than about 600 parts per million of silica. The aluminum oxide is ground with media that comprise aluminum oxide ceramic pieces that have less than about 200 parts per million of sodium to deagglomerate and reduce the particle size of the aluminum oxide. The ground aluminum oxide is placed into a slurry, and a low sodium grade binder is added to the slurry. The slurry is dried to provide an aluminum oxide powder having a sodium content that is less than about 200 parts per million. The powder may then be formed into a certain shape and thermally treated to produce an aluminum oxide component having a low sodium and low silica content.

2013011, May 9, 2013

Oct 19, 2012

13/656463

Frank E. Anderson - Golden CO, US
Matthew Simpson - Evergreen CO, US

CoorsTek, Inc. - Golden CO

C23C 4/12, B32B 9/04, B32B 33/00

428141, 427446, 427452, 427454

Embodiments relate to a coated substrate and a method of making and using the same. A plasma-spray coated layer may be formed on a substrate, wherein the plasma-sprayed coated layer comprises a rare-earth oxide (e.g., yttrium oxide), a rare-earth fluoride (e.g. yttrium fluoride), or a rare-earth silicate (e.g. yttrium silicate). An exposed surface of the plasma-spray coated layer may be irradiated to form a treated portion of the layer, wherein the treated portion of the layer has a mean spacing of local peaks (S value) between about 100 and 200 microns. A second layer may be formed on the treated portion of the plasma-spray coated layer, wherein the second layer comprises a dielectric material.

5709724, Jan 20, 1998

Aug 4, 1994

8/286015

Robert E. Naugler - Arvada CO
Frank E. Anderson - Golden CO

Coors Ceramics Company - Golden CO

C03C 2702

65 594

A process for forming a hermetic glass-to-metal seal between a conductive pin and an outer body, wherein a corrosion-resistant noble metal (e. g. , gold) coating is applied to the conductive pin before the hermetic seal is formed. The process generally includes providing a noble metal-coated conductive pin, placing glass having a softening point less than about 650. degree. C. into a cavity of the outer body, inserting the coated conductive pin into a bore in the glass preform, heating the assembly to a temperature in excess of the softening point of the glass but less than about 700. degree. C. , and cooling the assembly. The coefficients of thermal expansion of the components of the assembly are preferably selected such that the resulting assembly is a hermetic compression seal.

6274252, Aug 14, 2001

Oct 14, 1997

8/950529

Robert E. Naugler - Arvada CO
Frank E. Anderson - Golden CO

Coors Ceramics Company - Golden CO

B32B 1504, H01B 1726, B60R 2116, C03C 2700

428621

A hermetic glass-to-metal seal between a conductive pin and an outer body, wherein a corrosion-resistant noble metal (e. g. , gold) coating is applied to the conductive pin before the hermetic seal is formed. The noble metal-coated conductive pin is located in glass having a softening point less than about 650. degree. C. and disposed in a cavity of the outer body. This is accomplished by inserting the coated conductive pin into a bore in a glass preform, heating the assembly to a temperature in excess of the softening point of the glass but less than about 700. degree. C. , and cooling the assembly. The coefficients of thermal expansion of the components of the assembly are preferably selected such that the resulting assembly is a hermetic compression seal.