ERIC V BROWN
Architects in Cambridge, MA
License number
Massachusetts 10826
Issued Date
Oct 18, 2000
Expiration Date
Aug 31, 2017
Type
Architect
Address
Address
Cambridge, MA 02139
Personal information
See more information about ERIC V BROWN at radaris.comName
Address
Phone
48 Virginia St #1, Dorchester, MA 02125
47 Lantern Ln, Acushnet, MA 02743
Professional information
See more information about ERIC V BROWN at trustoria.com
Submicron Gap Thermophotovoltaic Structure And Method
Submicron Gap Thermophotovoltaic Structure And Method
US Patent:
2013009, Apr 18, 2013
Filed:
Nov 30, 2012
Appl. No.:
13/691104
Inventors:
Robert Dimatteo - Belmont MA, US
Eric Brown - Cambridge MA, US
Christopher Leitz - Watertown MA, US
Eric Brown - Cambridge MA, US
Christopher Leitz - Watertown MA, US
Assignee:
MTPV Power Corporation - Austin TX
International Classification:
H01L 31/04
US Classification:
136246, 136253
Abstract:
An improved submicron gap thermophotovoltaic structure and method comprising an emitter substrate with a first surface for receiving heat energy and a second surface for emitting infrared radiation across an evacuated submicron gap to a juxtaposed first surface of an infrared radiation-transparent window substrate having a high refractive index. A second surface of the infrared radiation-transparent substrate opposite the first surface is affixed to a photovoltaic cell substrate by an infrared-transparent compliant adhesive layer. Relying on the high refractive index of the infrared radiation-transparent window substrate, the low refractive index of the submicron gap and Snell's law, the infrared radiation received by the first surface of the infrared radiation-transparent window substrate is focused onto a more perpendicular path to the surface of the photovoltaic cell substrate. This results in increased electrical power output and improved efficiency by the thermophotovoltaic structure.
Method And Structure For Providing A Uniform Micron/Sub-Micron Gap Separation Within Micro-Gap Thermophotovoltaic Devices For The Generation Of Electrical Power
Method And Structure For Providing A Uniform Micron/Sub-Micron Gap Separation Within Micro-Gap Thermophotovoltaic Devices For The Generation Of Electrical Power
US Patent:
8450598, May 28, 2013
Filed:
Nov 16, 2011
Appl. No.:
13/297535
Inventors:
Paul Greiff - Wayland MA, US
Robert DiMatteo - Belmont MA, US
Eric Brown - Cambridge MA, US
Christopher Leitz - Watertown MA, US
Robert DiMatteo - Belmont MA, US
Eric Brown - Cambridge MA, US
Christopher Leitz - Watertown MA, US
Assignee:
MTPV Power Corporation - Austin TX
International Classification:
H01L 31/00, H01L 35/00, H01L 37/00, H01L 35/34
US Classification:
136253, 136200, 136201
Abstract:
A near-field energy conversion method, utilizing a sub-micrometer “near-field” gap between juxtaposed infrared radiation receiver and emitter surfaces, wherein compliant membrane structures, preferably fluid-filled, are interposed in the structure for maintaining uniform gap separation. Thermally resistant gap spacers are also used to maintain uniform gap separation. Means are provided for cooling a receiver substrate structure and for conducting heat to an emitter substrate structure. The gap may also be evacuated for more effective operation.
Method And Structure, Using Flexible Membrane Surfaces, For Setting And/Or Maintaining A Uniform Micron/Sub-Micron Gap Separation Between Juxtaposed Photosensitive And Heat-Supplying Surfaces Of Photovoltaic Chips And The Like For The Generation Of Electrical Power
Method And Structure, Using Flexible Membrane Surfaces, For Setting And/Or Maintaining A Uniform Micron/Sub-Micron Gap Separation Between Juxtaposed Photosensitive And Heat-Supplying Surfaces Of Photovoltaic Chips And The Like For The Generation Of Electrical Power
US Patent:
8076569, Dec 13, 2011
Filed:
May 12, 2008
Appl. No.:
12/152196
Inventors:
Paul Greiff - Wayland MA, US
Robert DiMatteo - Belmont MA, US
Eric Brown - Cambridge MA, US
Christopher Leitz - Watertown MA, US
Robert DiMatteo - Belmont MA, US
Eric Brown - Cambridge MA, US
Christopher Leitz - Watertown MA, US
Assignee:
MTPV, LLC - Austin TX
International Classification:
H01L 31/00, H01L 35/00, H01L 37/00, H01L 35/34
US Classification:
136253, 136200, 136201
Abstract:
A near-field energy conversion structure and method of assembling the same, utilizing a sub-micrometer “near field” gap between juxtaposed photocell infrared radiation receiver and heat emitter surfaces, wherein compliant membrane structures, preferably fluid-filled, are interposed in the structure.
Micro-Gap Thermal Photovoltaic Large Scale Sub-Micron Gap Method And Apparatus
Micro-Gap Thermal Photovoltaic Large Scale Sub-Micron Gap Method And Apparatus
US Patent:
2011031, Dec 29, 2011
Filed:
Feb 28, 2011
Appl. No.:
13/037214
Inventors:
Eric L. Brown - Cambridge MA, US
Robert S. DiMatteo - Cambridge MA, US
Bruno A. Nardelli - Watertown MA, US
Bin Peng - Wuhan, CN
Xiao Li - Wuhan, CN
Robert S. DiMatteo - Cambridge MA, US
Bruno A. Nardelli - Watertown MA, US
Bin Peng - Wuhan, CN
Xiao Li - Wuhan, CN
Assignee:
MTPV Corporation - Austin TX
International Classification:
H01L 31/052
US Classification:
136246
Abstract:
The present invention relates to micron-gap thermal photovoltaic (MTPV) technology for the solid-state conversion of heat to electricity. The problem is forming and then maintaining the close spacing between two bodies at a sub-micron gap in order to maintain enhanced performance. While it is possible to obtain the sub-micron gap spacing, the thermal effects on the hot and cold surfaces induce cupping, warping, or deformation of the elements resulting in variations in gap spacing thereby resulting in uncontrollable variances in the power output. A major aspect of the design is to allow for intimate contact of the emitter chips to the shell inside surface, so that there is good heat transfer. The photovoltaic cells are pushed outward against the emitter chips in order to press them against the inner wall. A high temperature thermal interface material improves the heat transfer between the shell inner surface and the emitter chip.
Sub-Micrometer Gap Thermophotovoltaic Structure (Mtpv) And Fabrication Method Therefor
Sub-Micrometer Gap Thermophotovoltaic Structure (Mtpv) And Fabrication Method Therefor
US Patent:
8633373, Jan 21, 2014
Filed:
May 12, 2008
Appl. No.:
12/152195
Inventors:
Paul Greiff - Wayland MA, US
Robert DiMatteo - Belmont MA, US
Eric Brown - Cambridge MA, US
Christopher Leitz - Watertown MA, US
Robert DiMatteo - Belmont MA, US
Eric Brown - Cambridge MA, US
Christopher Leitz - Watertown MA, US
Assignee:
MTPV Power Corporation - Austin TX
International Classification:
H01L 31/058
US Classification:
136253, 136244, 438 57, 438 80
Abstract:
An MTPV thermophotovoltaic chip comprising a photovoltaic cell substrate, micron/sub-micron gap-spaced from a juxtaposed heat or infrared radiation-emitting substrate, with a radiation-transparent intermediate window substrate preferably compliantly adhered to the photovoltaic cell substrate and bounding the gap space therewith.
Nucleic Acid And Amino Acid Sequences Relating To Helicobacter Pylori For Diagnostics And Therapeutics
Nucleic Acid And Amino Acid Sequences Relating To Helicobacter Pylori For Diagnostics And Therapeutics
US Patent:
2004005, Mar 18, 2004
Filed:
Dec 30, 2002
Appl. No.:
10/335977
Inventors:
Douglas Smith - Gloucester MA, US
Richard Alm - Ashland MA, US
O. Berglindh - Uppsala, SE
Bjorn Mellgard - Goteborg, SE
Steven Thomas - Mission, CA
Eric Brown - Cambridge MA, US
Donald Moir - Lexington MA, US
Lo Ling - Arlington MA, US
Gilles Carmel - Waltham MA, US
Braydon Guild - Concord MA, US
Peter Doig - Acton MA, US
Zita Kabok - Natick MA, US
Lillian Castriotta - Newton MA, US
Richard Alm - Ashland MA, US
O. Berglindh - Uppsala, SE
Bjorn Mellgard - Goteborg, SE
Steven Thomas - Mission, CA
Eric Brown - Cambridge MA, US
Donald Moir - Lexington MA, US
Lo Ling - Arlington MA, US
Gilles Carmel - Waltham MA, US
Braydon Guild - Concord MA, US
Peter Doig - Acton MA, US
Zita Kabok - Natick MA, US
Lillian Castriotta - Newton MA, US
Assignee:
Astra Aktiebolag
International Classification:
A61K039/00, A61K039/38
US Classification:
424/184100
Abstract:
Recombinant or substantially pure preparations of polypeptides are described. The nucleic acids encoding the polypeptides also are described. The polypeptides are useful for diagnostics and vaccine compositions.