Eric J Nelson
Nursing at Mohawk Dr, Boise, ID

6801048, Oct 5, 2004

Mar 25, 2003

10/396163

Warren M. Farnworth - Nampa ID
James M. Wark - Boise ID
Eric S. Nelson - Boise ID
Kevin G. Duesman - Boise ID

Micron Technology, Inc. - Boise ID

G01R 3128

324763, 365200, 365201, 326 38, 714718

An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCMs substrate connects each dies test mode enable bond pad to one of the MCMs no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCMs ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging. A method for performing such testing once the test mode has been initiated and for repairing any failing elements found during testing includes providing test signals to the dice, receiving response signals from the dice, evaluating the response signals to identify any failing elements in the dice, programming the failing elements addresses into anti-fuses in the dice with a programming voltage, confirming that the addresses are programmed by determining the resistance of the anti-fuses, re-testing the dice, receiving response signals from the re-tested dice, and evaluating the response signals to confirm all repairs.

7519881, Apr 14, 2009

Mar 27, 2006

11/389874

Warren M. Farnworth - Nampa ID, US
James M. Wark - Boise ID, US
Eric S. Nelson - Boise ID, US
Kevin G. Duesman - Boise ID, US

Micron Technology, Inc. - Boise ID

G01R 31/28

714724, 324763, 365200, 365201, 326 38

An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.

8024423, Sep 20, 2011

Apr 29, 2009

12/432339

Brett Donahue - Eagle ID, US
Eric Lewis Nelson - Boise ID, US

iAnywhere Solutions, Inc. - Dublin CA

G06F 15/16, G06F 15/177, G06F 15/173

709217, 709220, 709223

A system, method, and computer-readable medium having computer-executable instructions for maintaining connections between a mobile device and a server are described herein. In an embodiment, the method operates by receiving a data request from the mobile device, the data request identifying at least a timeout interval. The method comprises sending the data request to a data server and then determining whether the timeout interval has passed. The method also comprises sending a keep alive message to the mobile device indicating that the request has timed out if it is determined that the timeout interval has passed. The method then receives a re post request from the mobile device, the re post request identifying a timeout interval. The method further comprises receiving a response from the data server, the response including at least data requested by the mobile device and then sends the response to the mobile device.

7034560, Apr 25, 2006

Mar 16, 2004

10/801254

Warren M. Farnworth - Nampa ID, US
James M. Wark - Boise ID, US
Eric S. Nelson - Boise ID, US
Kevin G. Duesman - Boise ID, US

Micron Technology, Inc. - Boise ID

G01R 31/28

324763, 714724, 365200, 365201, 326 38, 257E21526

An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.

7730372, Jun 1, 2010

Sep 18, 2008

12/233334

Warren M. Farnworth - Nampa ID, US
James M. Wark - Boise ID, US
Eric S. Nelson - Boise ID, US
Kevin G. Duesman - Boise ID, US

Micron Technology, Inc. - Boise ID

G01R 31/28

714724, 324763, 326 38, 365200, 365201

An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.

5937198, Aug 10, 1999

Aug 12, 1998

9/132846

Eric L. Nelson - Boise ID
Michael L. Evans - Boise ID
Lance N. Shelton - Boise ID
Jared C. Roundy - Meridian ID

Extended Systems, Inc. - Boise ID

G06F 906

395712

An apparatus and method for downloading firmware upgrades to a targeted remote field configurable embedded computer system over a computer network. The targeted device need not be disconnected from the network and requires no human intervention at the remote site. The entire firmware, including the downloading mechanism, can be updated in an efficient manner.

2007029, Dec 20, 2007

Aug 4, 2006

11/498830

Joe Owen - Suwanee GA, US
Senthil Krishnapillai - Eagle ID, US
Eric Nelson - Boise ID, US
Bryan Whitmarsh - Meridian ID, US

iAnywhere Solutions, Inc. - Dublin CA

G06F 15/173

709226

A relay server is located outside a firewall and provides access to a server inside the firewall. Both the server and a client (the client is outside the firewall) initiate a connection with the relay server. The relay server then sets up a connection between the server and client, to thereby enable the server and client to communicate. Such communication is enabled without needing an inbound port in the firewall, thereby enhancing security.