Eric E Benson
Dentist at Un St, San Francisco, CA
License number
Colorado 10024
Issued Date
Aug 12, 2009
Renew Date
Mar 1, 2016
Expiration Date
Feb 28, 2018
Type
Dentist
Address
Address
1648 Union St, San Francisco, CA 94123
Organization information
See more information about Eric E Benson at bizstanding.comEric E Benson DDS
1648 Un St STE 202, San Francisco, CA 94123
Categories:
Dentists
Site:
Phone:
(415) 474-1555 (Phone)
Specialties:
Cosmetic Dentistry
Products:
Bonding, Schools
Professional information
Sr. Display Engineer At Apple Inc.
Position:
Sr. Display Engineer at Apple Inc.
Location:
San Francisco Bay Area
Industry:
Renewables & Environment
Work:
Apple Inc.
since Jan 2011
-
Sr. Display Engineer
Applied Materials
Oct 2008 - Feb 2011
-
Engineering Project Manager
Lockheed Martin Space Systems Company
May 2007 - Aug 2010
-
Product Design / Product Team Lead
Lockheed Martin Space Systems Company
Jan 2004 - May 2007
-
Certified Principle Engineer / Product Team Lead
Delphi Automotive Systems
1998 - 2000
-
Engineering Co-op
Education:
Stanford University 2005 - 2008
Masters, Mechanical Engineering University of Illinois at Urbana-Champaign 1996 - 2001
B.S., Mechanical Engineering
Masters, Mechanical Engineering University of Illinois at Urbana-Champaign 1996 - 2001
B.S., Mechanical Engineering
Honor & Awards:
Caterpillar Award from University of Illinois for outstanding senior in automotive design (2001)
Manager Of Operations At Erg Aerospace
Position:
Manager of Operations at ERG Aerospace, Explosive Ordnance Disposal Officer at U.S. Navy Reserve, OIC Ordnance Clearance Platoon at U.S. Navy Reserves
Location:
San Francisco Bay Area
Industry:
Defense & Space
Work:
ERG Aerospace
-
Manager of Operations
U.S. Navy Reserve
since Mar 2006
-
Explosive Ordnance Disposal Officer
U.S. Navy Reserves
since 1999
-
OIC Ordnance Clearance Platoon
US Navy
Jun 1999 - Mar 2006
-
Officer-In-Charge
Education:
University of Redlands 2001 - 2004
Masters, Management Oregon State University 1993 - 1999
BS, Engineering
Masters, Management Oregon State University 1993 - 1999
BS, Engineering
Interests:
Climbing, Mountaineering, Snowboarding, K-9
Sales At Nexus
Position:
sales at nexus
Location:
San Francisco Bay Area
Industry:
Computer Networking
Work:
nexus
-
sales
SBC
2000 - 2006
-
DataComm Sales
Education:
California State University-Chico
Restaurant Manager
Position:
Assistant Manager at Blue Barn Gourmet
Location:
San Francisco Bay Area
Industry:
Hospitality
Work:
Blue Barn Gourmet
- Corte Madera since Aug 2012
-
Assistant Manager
Education:
San Francisco State University 2008 - 2010
Recreation Parks and Tourism, Commercial Recreation and Tourism
Recreation Parks and Tourism, Commercial Recreation and Tourism
Hardware Specialist At Sega Of America
Position:
Hardware Specialist at Sega of America
Location:
San Francisco Bay Area
Industry:
Computer Games
Work:
Sega of America
-
Hardware Specialist
Solder Bonding And Inspection Method And Apparatus
US Patent:
2011028, Nov 24, 2011
Filed:
May 20, 2010
Appl. No.:
12/783668
Inventors:
Eric Benson - San Francisco CA, US
Danny Cam Lu - San Francisco CA, US
Jeffrey S. Sullivan - Castro Valley CA, US
Matthias Wendt - Dreden, DE
Paul-Emmanuel Eyme - Aschaffenburg, DE
Danny Cam Lu - San Francisco CA, US
Jeffrey S. Sullivan - Castro Valley CA, US
Matthias Wendt - Dreden, DE
Paul-Emmanuel Eyme - Aschaffenburg, DE
Assignee:
APPLIED MATERIALS, INC. - Santa Clara CA
International Classification:
H04N 7/18, G06K 9/00
US Classification:
348 87, 382150, 348E07085
Abstract:
The present invention relates to an automated electrical connection module for automatically attaching a junction box to a composite solar cell structure. The electrical connection module includes a thermode assembly having heating elements for forming a soldered connection between the junction box and the composite solar cell structure and a temperature sensing device in thermal communication with the heating elements for detecting a temperature profile during the connection process. The heating elements and temperature sensing device are linked to a controller configured to monitor and compare the energy input into the heating elements with the temperature near the tip of the heating elements throughout the connection process. The electrical connection module further provides a vision system configured to capture images of the soldered connection between the junction box and the composite solar cell structure. The vision system is linked to the controller configured to analyze and compare the captured images to those of properly formed bonds to verify whether a quality bond is achieved.
Solder Bonding Method And Apparatus
US Patent:
8227723, Jul 24, 2012
Filed:
Oct 19, 2009
Appl. No.:
12/581728
Inventors:
Eric Benson - San Francisco CA, US
Danny Cam Lu - San Francisco CA, US
Jeffrey S. Sullivan - Castro Valley CA, US
Danny Cam Lu - San Francisco CA, US
Jeffrey S. Sullivan - Castro Valley CA, US
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
B23K 1/00
US Classification:
219 8522, 219 79
Abstract:
The present invention generally relates to a module and process for automatically attaching a junction box to a composite solar cell structure during the fabrication of a completed solar cell device. The electrical connection module further provides a thermode assembly including heating elements for forming a soldered connection between the junction box and the composite solar cell structure and a temperature sensing device in thermal communication with the heating elements for detecting a temperature profile during the connection process. The heating elements and temperature sensing device are linked to a controller configured to monitor and compare the energy input into the heating elements with the temperature near the tip of the heating elements throughout the connection process. The controller is further configured to compare the actual energy versus temperature profile to an expected profile throughout the connection process and verify whether a quality bond is achieved.
Thin Film Solar Junction Box Pottant Vacuum Fill Process
US Patent:
2011027, Nov 10, 2011
Filed:
May 5, 2010
Appl. No.:
12/774391
Inventors:
Eric Benson - San Francisco CA, US
Danny Cam Toan Lu - San Francisco CA, US
Jeffrey S. Sullivan - Castro Valley CA, US
Danny Cam Toan Lu - San Francisco CA, US
Jeffrey S. Sullivan - Castro Valley CA, US
Assignee:
APPLIED MATERIALS, INC. - Santa Clara CA
International Classification:
B65B 31/00, B29C 70/72
US Classification:
141 59, 156285
Abstract:
A method for vacuum filling a junction box and a junction box attachment module are provided. According to one embodiment of the invention, a junction box attachment module includes a dispense nozzle, an enclosure and a vacuum source. The enclosure is disposed around and extended from the dispense nozzle, wherein the enclosure has a sealing portion located at its open end. The vacuum source is connected to the enclosure, wherein the vacuum source is configured to establish a vacuum within the enclosure enclosing an open region of a junction box attached to a solar cell device, thereby facilitating injecting a potting material into the open region of the junction box via the dispense nozzle.
Student At University Of Pittsburgh
Location:
San Francisco Bay Area
Industry:
Mental Health Care
Education:
University of Pittsburgh 1987 - 1993