EDWARD H AIFER
Electrician in Arlington, VA
License number
Massachusetts 26309
Issued Date
Jan 25, 1982
Expiration Date
Jul 31, 1998
Type
Journeyman Electrician
Address
Address
Arlington, VA 22205
Personal information
See more information about EDWARD H AIFER at radaris.comName
Address
Phone
1008 Larrimore St, Arlington, VA 22205
4618 14Th St N, Arlington, VA 22207
1008 N Larrimore St, Arlington, VA 22205
Professional information
Etching Agent For Type Ii Inas/Gainsb Superlattice Epitaxial Materials
US Patent:
2013012, May 16, 2013
Filed:
Nov 6, 2012
Appl. No.:
13/669663
Inventors:
Edward H Aifer - Arlington VA, US
Sergey I. Maximenko - Alexandria VA, US
Sergey I. Maximenko - Alexandria VA, US
International Classification:
H01L 21/02
US Classification:
438745, 252 793
Abstract:
This disclosure involves a formula, mixing procedure, etching technique and application of an etchant for revealing defects in T2SL's grown lattice matched to (100) GaSb. The etching agent comprises a (2.5:4.5:16.5:280) solution by volume or (1%:2%:9%:88%) by weight, of HF:HO:HSO:HO. The etchant is made by mixing (49%) hydrofluoric aqueous solution with (30%) water-based peroxide, followed by sulfuric acid, and diluted with de-ionized H2O (DI-water).
Pressure-Bonded Heat Sink Method
US Patent:
6734043, May 11, 2004
Filed:
Jul 17, 2002
Appl. No.:
10/196147
Inventors:
William W. Bewley - Falls Church VA
Edward A. Aifer - Arlington VA
Christopher L. Felix - Washington DC
Igor Vurgaftman - Pikesville MD
Jerry R Meyer - Catonsville MD
John Glesener - Richardson TX
Edward A. Aifer - Arlington VA
Christopher L. Felix - Washington DC
Igor Vurgaftman - Pikesville MD
Jerry R Meyer - Catonsville MD
John Glesener - Richardson TX
Assignee:
The United States of America as represented by the Secretary of the Navy - Washington DC
International Classification:
H01L 2336
US Classification:
438122, 438 26
Abstract:
This invention pertains to a method for removing heat from a heat source device and to a heat sink system characterized by a pressure bond having thermal resistance of less than about 5 K/kW-cm. The method is characterized by the steps of removing heat from a heat source device comprising the steps of placing a heat source device in contact with a heat source and applying a sufficient force to form a pressure bond between the heat source device and the heat sink wherein thermal resistance at the interface between the heat source device and the heat sink after the thermal bond is established is less than about 5 K/kW-cm. The heat sink system includes a heat source device and a heat sink in contact with the heat source device with thermal resistance at the interface of the heat source device and said heat sink is less than about 5 K/kW-cm.
Pressure-Bonded Heat-Sink System
US Patent:
6448642, Sep 10, 2002
Filed:
Jan 27, 2000
Appl. No.:
09/492068
Inventors:
William W. Bewley - Falls Church VA 22041
Edward A. Aifer - Arlington VA 22207
Christopher L. Felix - Washington DC 20002
Igor Vurgaftman - Pikesville MD 21208
Jerry R. Meyer - Catonsville MD 21228
John Glesener - Richardson TX 75008
Edward A. Aifer - Arlington VA 22207
Christopher L. Felix - Washington DC 20002
Igor Vurgaftman - Pikesville MD 21208
Jerry R. Meyer - Catonsville MD 21228
John Glesener - Richardson TX 75008
International Classification:
H01L 2340
US Classification:
257719, 257 99
Abstract:
This invention pertains to a method for removing heat from a heat source device and to a heat sink system characterized by a pressure bond having thermal resistance of less than about 5 K/kW-cm. The method is characterized by the steps of removing heat from a heat source device comprising the steps of placing a heat source device in contact with a heat source and applying a sufficient force to form a pressure bond between the heat source device and the heat sink wherein thermal resistance at the interface between the heat source device and the heat sink after the thermal bond is established is less than about 5 K/kW-cm. The heat sink system includes a heat source device and a heat sink in contact with the heat source device with thermal resistance at the interface of the heat source device and said heat sink is less than about 5 K/kW-cm.
Heat Sink Pressure Clip
US Patent:
6282761, Sep 4, 2001
Filed:
Jan 27, 2000
Appl. No.:
9/492069
Inventors:
William W. Bewley - Falls Church VA
Edward A. Aifer - Arlington VA
Christopher L. Felix - Washington DC
Igor Vurgaftman - Pikesville MD
Jerry R. Meyer - Catonsville MD
John Glesener - Richardson TX
Edward A. Aifer - Arlington VA
Christopher L. Felix - Washington DC
Igor Vurgaftman - Pikesville MD
Jerry R. Meyer - Catonsville MD
John Glesener - Richardson TX
Assignee:
The United States of America as represented by the Secretary of the Navy - Washington DC
International Classification:
A44B 2100, H01L 2334
US Classification:
24569
Abstract:
A pressure clip for contacting a heat sink device to a heat sink by means of a pressure bond having thermal resistance of less than about 5 K/kW/cm. sup. 2. The pressure clip includes a mounting block, a clamp block; a spacer disposed between the mounting block and the clamp block forming a channel therebetween, support shoulders in the channel for supporting a heat sink, means for securing the clamp block and the spacer to the mounting block, pressure arm disposed above the mounting block, flexible joint for flexibly attaching the pressure arm to the mounting block, pressure screw disposed between the pressure arm and the mounting block for applying pressure to the pressure arm, and a plunger projecting into the channel between the mounting block and the clamp block for transmitting pressure from the pressure arm.