MISS DUNG THU NGUYEN, PHARMD.
Pharmacy at Brookhurst St, Santa Ana, CA

6094115, Jul 25, 2000

Feb 12, 1999

9/249523

Dung T. Nguyen - Fountain Valley CA
Claudio S. Howard - Hawthorne CA
Clifton Quan - Arcadia CA

Raytheon Company - Lexington MA

H01P 100

333260

An interconnect structure defining an interconnect transmission line for RF signal interconnection between two substrates. The interconnect structure includes an outer shield member forming an electrically conductive outer shield structure. A solid conductor pin is sized to form an inner conductor, the pin having a first pin diameter, and a head region of a second pin diameter greater than the first pin diameter, said head region formed intermediate a first pin end and a second pin end. A first dielectric tube member has an outer diameter sized in relation to an opening dimension of the shield member to fit tightly therein, and an inner tube diameter sized to receive tightly therein a first region of the pin of the first pin diameter, the first tube member having a first tube first end and a first tube second end. A second dielectric tube member has an outer diameter sized to fit tightly in the outer shield, and an inner tube diameter sized to receive tightly therein a second region of the pin. The tubes fit within the shield to capture the pin head region.

2004001, Jan 29, 2004

Jul 25, 2002

10/202820

Harrison Doan - Huntington Beach CA, US
Dung Nguyen - Irvine CA, US
Ramya Dissanayake - Tustin CA, US

ADC DSL Systems, Inc.

H04B001/38

375/222000

An apparatus and method are described that allows for improved wander jitter reduction in communication devices and associated communication links, in particular on HDSL communication devices and links. The improved device apparatus and method detects the current data rate offset of the HDSL data rate being utilized and the data rate of the datastream being transmitted through the HDSL communication link and allows for the transmitting HDSL communication device to adjust the HDSL data rate to avoid high wander jitter “sweet spots”. The improved device apparatus and method also allows for the profiling of communication devices for their specific high wander jitter sweet spot maximum points by sweeping the input data rate being transmitted at differing HDSL data rates.

5508666, Apr 16, 1996

Nov 28, 1994

8/345270

Dung T. Nguyen - Fountain Valley CA

Hughes Aircraft Company - Los Angeles CA

H03H 738, H01P 104

333 33

The present invention provides an improved rf feedthrough connector having a first section (12) in which a inner conductor (18) is spaced from a co-axial outer conductive shield (16) by a cylindrical insulating dielectric layer (22). A second section (14) has a second inner conductor (28) which is electrically coupled to the first inner conductor (18). A second outer shield (34) is spaced from the second inner conductor by a semi-cylindrical insulating dielectric layer (30). The inner radius (R1) of the first outer shield (16) is different from the inner radius (R3) of the second outer shield (26). Given the properties of the material forming the first and second dielectric layers, (22) and (30), these radii are selected so as to provide a uniform impedance in both the first (12) and second (14) sections of the feedthrough connector (10).