Inventors:
Donald J. Butterworth - Glen Mills PA
Assignee:
Bell of Pennsylvania - Philadelphia PA
International Classification:
H05K 114
Abstract:
An RF shielded and electrically insulated circuit board structure comprises a first layer of shrink wrap tubing wrapped on a circuit board substrate, and a layer of an electrically conductive RF shielding material on the tubing. A second layer of shrink wrap tubing retains the electrically conductive material to the circuit board. Edge portions of the electrically conductive layer and heat shrink tubing are folded inward to prevent RF energy from the circuit board from leaking from the edges of the structure. The structure is made by wrapping a first heat shrink tubing on the circuit board to insulate and seal any wiring patterns and components thereon and shrinking the tubing by applying heat. The electrically conductive layer is located on the heat shrink tubing, and the second heat shrink tubing is wrapped on the electrically conductive layer and first tubing. Heat is applied to shrink the second tubing, and, with circuit wiring extending outward, the edge portions of the structure are folded inward to complete the structure.