DONALD BOKENFOHR KEARNS, M.D.
Medical Practice at Childrens Way, San Diego, CA

7835153, Nov 16, 2010

Dec 30, 2008

12/345801

Donald A. Kearns - San Diego CA, US

Oracle America, Inc. - Redwood City CA

H05K 7/20, F28F 7/00, H01L 23/34

361719, 165 802, 165185, 257719, 361704

A computer adapted for force-air cooling of a processor. The computer includes a board supporting the processor and a heat sink mounted such with its base plate contacting the processor. A primary mount supports the heat sink near the processor, and a portion of the heat sink base plate extends outward a distance or overhang length from the primary mount to an edge. The apparatus includes a secondary heat sink mounting assembly supported upon the processor board that includes a damping element with an resilient body positioned proximate to the edge of the base plate, whereby the body abuts the base plate during movement of the base plate toward the board, e. g. , upon application of a dynamic or shock load that causes the overhanging portions of the base plate of the heat sink to vibrate or oscillate about the support locations of the primary mount.

7323363, Jan 29, 2008

Feb 2, 2004

10/770192

Donald A. Kearns - San Diego CA, US
George C. Zacharisen - Santa Clara CA, US
David K. McElfresh - San Diego CA, US

Sun Microsystems, Inc. - Santa Clara CA

H01L 21/00

438109, 438121, 257686, 257726, 257727, 257785

A integrated circuit housing includes a first clamping hardware, a second clamping hardware operatively connected to the first clamping hardware, and an integrated circuit stack comprising a top portion and a bottom portion, wherein the first clamping hardware contacts the top portion and the second clamping hardware contacts the bottom portion, and wherein a first shim is interposed between the bottom portion and the second clamping hardware.

7920986, Apr 5, 2011

Mar 10, 2008

12/045418

Dan Vacar - San Diego CA, US
David K. McElfresh - San Diego CA, US
Anton Bougaev - La Jolla CA, US
Donald A. Kearns - San Diego CA, US
Charles E. Kinney - San Diego CA, US

Oracle America, Inc. - Redwood City CA

G01B 5/18, G01N 21/86

702166, 25055924

A method of quantifying a shape of a surface includes measuring an elevation (z) of the surface at a plurality of locations in an x-y plane of the surface. The measurement data is fit to a series expansion in terms of one or more base functions that include a series expansion fit. A vector of shape coefficients are calculated from the series expansion fit. A vector of shape coefficients are output.

7928996, Apr 19, 2011

Oct 5, 2007

11/868035

Donald A. Kearns - San Diego CA, US
Christopher R. Ritchie - San Diego CA, US

Oracle America, Inc. - Redwood City CA

G09G 5/00

345629, 345440

A method for improving load balance involves obtaining a graphical representation of a load distribution for contacts in an integrated circuit stack, analyzing the graphical representation of the load distribution to determine contact loads, where a contact load corresponds to a contact, and designing at least one component of the integrated circuit stack, based on the contact loads.

2007028, Dec 13, 2007

Aug 24, 2007

11/844935

Donald Kearns - San Diego CA, US
George Zacharisen - Santa Clara CA, US
David McElfresh - San Diego CA, US

SUN MICROSYSTEMS, INC. - Santa Clara CA

G06F 1/16, G01B 21/02, G06K 9/36, G01G 19/00

361687000, 361683000, 382276000, 702158000, 702173000

A integrated circuit housing includes a first clamping hardware, a second clamping hardware operatively connected to the first clamping hardware, and an integrated circuit stack comprising a top portion and a bottom portion, wherein the first clamping hardware contacts the top portion and the second clamping hardware contacts the bottom portion, and wherein a first shim is interposed between the bottom portion and the second clamping hardware.