Inventors:
Michael John Wieckowski - Ann Arbor MI, US
David Theodore Blaauw - Ann Arbor MI, US
Dennis Michael Chen Sylvester - Ann Arbor MI, US
Assignee:
The Regents of the University of Michigan - The Ann Arbor MI
International Classification:
G11C 11/34, G11C 16/04
US Classification:
3651851, 36518526, 36518515
Abstract:
A memory cell structure for a memory device includes a read transistor having a floating gate node, a tunnelling capacitor, and a coupling capacitor stack. The tunnelling capacitor is connected to the floating gate node and has a first programming terminal, and the coupling capacitor stack is connected to the floating gate node and has a second programming terminal. The coupling capacitor stack includes at least two coupling capacitors arranged in series between the floating gate node and the second programming terminal, with the coupling capacitor stack having a larger capacitance than the tunnelling capacitor. Such a memory cell structure is efficient in terms of area, and can be manufactured using standard CMOS logic manufacturing processes, thereby avoiding some of the complexities involved in the production of conventional EEPROM and Flash memory devices.