David William Peters
Engineers at Ashmount Dr, Fort Collins, CO

License number
Colorado 30602
Issued Date
Jul 7, 1995
Renew Date
Nov 1, 2015
Expiration Date
Oct 31, 2017
Type
Professional Engineer
Address
Address
3731 Ashmount Dr, Fort Collins, CO 80525

Professional information

David Peters Photo 1

Integrated Circuit Device Package Including Multiple Stacked Components

US Patent:
6477058, Nov 5, 2002
Filed:
Jun 28, 2001
Appl. No.:
09/894923
Inventors:
Richard J Luebs - Windsor CO
Jonathan W Craig - Fort Collins CO
Jeffrey L. Deeney - Fort Collins CO
David W. Peters - Fort Collins CO
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
H05K 111
US Classification:
361784, 361792, 361790, 361764, 361777, 174250, 174255, 439 66
Abstract:
An integrated circuit device package in accordance with the invention comprises a first land grid array (LGA) interposer socket positioned between, and in communication with, an LGA integrated circuit device and a first side of a first circuit board; a second LGA interposer socket positioned between, and in communication with, a second circuit board and a second side of the first circuit board, wherein the second side of the first circuit board is opposite to and parallel with the first side of the first circuit board; and a clamping mechanism for compressively urging together the LGA integrated circuit device, the first LGA interposer socket, the first circuit board, the second LGA interposer socket, and the second circuit board into electrical interconnection under a predetermined load.


David Peters Photo 2

Underfill Injection Mold

US Patent:
2006004, Mar 2, 2006
Filed:
Aug 27, 2004
Appl. No.:
10/928779
Inventors:
David Peters - Fort Collins CO, US
International Classification:
H01L 21/66
US Classification:
438014000
Abstract:
An underfill injection mold includes an inner surface defining a cavity to receive injected underfill substantially between a first substrate and a second substrate. The cavity includes convex, curvilinear sidewalls to define a concave, curvilinear underfill fillet of the injected underfill. In an example, dimensions of the inner surface that define the underfill fillet are based upon a finite element analysis of the underfill.