DAVID SEAN MC QUADE
Pilots at San Martine Way, San Diego, CA

License number

California A4115238

Issued Date

Jun 2013

Expiration Date

Jun 2014

Professional information

Inkjet Printhead Assembly Having Planarized Mounting Layer For Printhead Dies

US Patent:

6543880, Apr 8, 2003

Filed:

Aug 25, 2000

Appl. No.:

09/648567

Inventors:

Mohammad Akhavain - Escondido CA
Robert-Scott Melendrino Lopez - Escondido CA
Brian J. Keefe - La Jolla CA
Janis Horvath - San Diego CA
Joseph E. Scheffelin - Poway CA
David K. Mc Elfresh - San Diego CA

Assignee:

Hewlett-Packard Company - Fort Collins CO

International Classification:

B41J 2155

US Classification:

347 42, 347 13

Abstract:

A method of forming an inkjet printhead assembly includes providing a substrate, disposing a planarization layer on a face of the substrate such that a first surface of the planarization layer contacts the face of the substrate, mechanically planarizing a second surface of the planarization layer opposite the first surface, including reducing a thickness of at least a portion of the first planarization layer, and mounting a plurality of printhead dies on the second surface of the planarization layer.

Surface Deformation Of Carrier For Printhead Dies

US Patent:

6679581, Jan 20, 2004

Filed:

Oct 25, 2001

Appl. No.:

10/046459

Inventors:

Janis Horvath - San Diego CA
Lawrence E Gibson - San Diego CA
Byron K Davis - San Diego CA
David K Mc Elfresh - San Diego CA
Gerald V Rapp - Escondido CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B41J 2145

US Classification:

347 40

Abstract:

A printhead assembly includes a carrier including a substrate and a substructure joined to a first surface of the substrate, and a plurality of printhead dies each mounted on a second surface of the substrate. The first surface of the substrate includes a surface deformation and the substructure is joined to the first surface by an adhesive. As such, the adhesive conforms to the surface deformation.

Reference Datums For Inkjet Printhead Assembly

US Patent:

6428141, Aug 6, 2002

Filed:

Apr 23, 2001

Appl. No.:

09/840785

Inventors:

David K. Mc Elfresh - San Diego CA
Mohammad Akhavain - Escondido CA
Joseph E. Scheffelin - Poway CA

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

B41J 215

US Classification:

347 40, 347 42, 347 49, 347 13

Abstract:

A carrier adapted to support at least one printhead die includes a substrate having at least one surface and at least one datum attached to the at least one surface of the substrate. The substrate includes a first material and the at least one datum is formed from a blank including a second material. As such, the at least one datum is adapted to position the carrier in at least one dimension.