David M. Mendez
Engineering at Malaga Dr, Austin, TX

License number
Louisiana EI.0007931
Issued Date
Jan 1, 1900
Category
Civil Engineer
Address
Address
4306 Malaga Dr, Austin, TX 78759

Professional information

David Mendez Photo 1

Chief Technologist At Flextronics

Position:
Chief Technologist at Flextronics
Location:
Austin, Texas Area
Industry:
Consumer Electronics
Work:
Flextronics since Sep 2007 - Chief Technologist Solectron Corporation 1996 - 2007 - Chief Technologist Texas Instruments Jun 1981 - Apr 1996 - Senior Member Technical Staff
Education:
Tulane University 1977 - 1981
BSME, Mechanical Engineering


David Mendez Photo 2

Partner At Bickerstaff Heath Delgado Acosta Llp

Position:
Partner at Bickerstaff Heath Delgado Acosta LLP
Location:
Austin, Texas Area
Industry:
Law Practice
Work:
Bickerstaff Heath Delgado Acosta LLP - Austin, Texas since Jun 1986 - Partner
Education:
The University of Texas at Austin 1977 - 1980
JD, Law
St. Mary's University 1975 - 1977
Bachelor of Business Administration (B.B.A.), Accounting
Skills:
Appeals, Legal Research, Civil Litigation, Litigation, Commercial Litigation, Public Finance, Administrative Law, Legal Writing


David Mendez Photo 3

David Mendez, Austin TX - Lawyer

Address:
Bickerstaff Heath Delgado Acosta LLP
3711 S Mo Pac Expy BLDG 1, Austin 78746
(512) 472-8021
Licenses:
Texas - Eligible To Practice In Texas 1980
Education:
University of Texas School of LawDegree Doctor of Jurisprudence/Juris Doctor (J.D.)Graduated 1980
The University of Texas At AustinDegree JDGraduated 1980
St. Mary's UniversityDegree Bachelor of Business Administration (B.B.A.)Graduated 1977
Specialties:
Public Finance / Tax Exempt Finance - 100%
Languages:
Spanish


David Mendez Photo 4

Customer Service Rep. At Rb Auction

Position:
Customer Service Rep. at RB Auction
Location:
Austin, Texas Area
Industry:
Business Supplies and Equipment
Work:
RB Auction - Customer Service Rep.


David  Mendez Photo 5

David Mendez, Austin TX - Lawyer

Address:
816 Congress Ave, Austin, TX 78701
Experience:
46 years
Specialties:
Gov & Administrative Law, Municipal Law
Jurisdiction:
Texas (1980)
Law School:
University Of Texas
Languages:
Spanish
Memberships:
Texas State Bar (1980)


David Mendez Photo 6

Metal Constrained Circuit Board Side To Side Interconnection Technique

US Patent:
5819401, Oct 13, 1998
Filed:
Apr 24, 1997
Appl. No.:
8/847978
Inventors:
William R. Johannes - Albuquerque NM
Patrick H. O'Neill - Austin TX
David M. Mendez - Austin TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H05K 336
US Classification:
29830
Abstract:
A method of constructing a printed circuit board module and the module which comprises providing a substrate core having a first aperture extending therethrough and a pair of printed circuit boards, each board having at least one electrically conductive layer, secured to the substrate core and having a second aperture therethrough aligned with the first aperture. An electrically conductive member having an electrically insulating member is disposed around the electrically conductive member. The electrically conductive member having an electrically insulating member disposed therearound is positioned so that the electrically insulating member is disposed in the first aperture and the electrically conductive member extends into the second aperture of each of the printed circuit boards. The printed circuit boards are secured to the substrate core to lock the electrically insulating member in the first aperture. Solder is disposed within each of the second apertures electrically connecting the electrically conductive member to at least one electrically conductive layer of each of the pair of printed circuit boards or solder is disposed over at least one electrically conductive layer of each printed circuit board electrically connecting the electrically conductive member to at least one electrically conductive member.


David Mendez Photo 7

David Mendez

Location:
Austin, Texas Area
Industry:
Electrical/Electronic Manufacturing