Inventors:
Huawei Device Co., Ltd. - Shenzhen, CN
David Lu - Plano TX, US
Assignee:
Huawei Device Co., Ltd. - Shenzhen
International Classification:
H05K 13/04, H05K 1/18
Abstract:
The present invention relates to processing of PCBA, and provides a method for enhancing reliability of a welding spot of a chip, a printed circuit board and an electronic device. The method for enhancing reliability of the welding spot of the chip includes: dipping an epoxy flux on a weld leg of a chip or coating, with epoxy flux, a bonding pad corresponding to the weld leg of the chip, and mounting the chip to the bonding pad; and performing reflow processing on the bonding pad mounted with the chip, and finishing curing the epoxy flux. By applying the present invention, an Underfill process is not required, thereby reducing the cost of the device and improving the manufacturing efficiency.