DAVID LOREN DE LONG
Pilots at Evergreen Vly Rd, Olympia, WA
License number
Washington C1035461
Category
Airmen
Address
Address
9629 Evergreen Valley Rd SE, Olympia, WA 98513
Professional information
High Capacity Air-Cooling Systems For Electronic Apparatus And Associated Methods
US Patent:
6813149, Nov 2, 2004
Filed:
Jun 29, 2001
Appl. No.:
09/896869
Inventors:
Barrett M. Faneuf - Lakewood WA
William E. Berry - Tacoma WA
Ven R. Holalkere - Dublin CA
David S. De Lorenzo - Olympia WA
William E. Berry - Tacoma WA
Ven R. Holalkere - Dublin CA
David S. De Lorenzo - Olympia WA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
G06F 116
US Classification:
361687, 361694, 622592, 415176
Abstract:
An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.
Chassis-Level Thermal Interface Component For Transfer Of Heat From An Electronic Component Of A Computer System
US Patent:
6643132, Nov 4, 2003
Filed:
Jan 4, 2002
Appl. No.:
10/039003
Inventors:
Barrett M. Faneuf - Lakewood WA
David S. De Lorenzo - Olympia WA
David S. De Lorenzo - Olympia WA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 720
US Classification:
361700, 16510433, 165 804, 174 152, 257715, 361695, 361704, 361699, 361831, 361687
Abstract:
A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
Computer System Which Locks A Server Unit Subassembly In A Selected Position In A Support Frame
US Patent:
6700785, Mar 2, 2004
Filed:
Jan 4, 2002
Appl. No.:
10/039109
Inventors:
William E. Berry - Tacoma WA
David S. De Lorenzo - Olympia WA
Stephen W. Montgomery - Federal Way WA
Barrett M. Faneuf - Lakewood WA
David S. De Lorenzo - Olympia WA
Stephen W. Montgomery - Federal Way WA
Barrett M. Faneuf - Lakewood WA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
G06F 116
US Classification:
361726, 361754, 361759, 3122231, 3122232
Abstract:
A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
Pcb-To-Chassis Mounting Schemes
US Patent:
6493233, Dec 10, 2002
Filed:
Aug 21, 2001
Appl. No.:
09/934871
Inventors:
David S. De Lorenzo - Olympia WA
Casey R. Winkel - Olympia WA
Casey R. Winkel - Olympia WA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 714
US Classification:
361752, 361758, 361759, 361742, 361736, 174138 G
Abstract:
A method and assembly for mounting printed circuit boards (PCBs) to a chassis. In one embodiment, a plurality of internally-threaded mounting posts are secured (e. g. , press-fit) to the chassis and the PCB includes a plurality of holes into which the mounting posts extend. Each hole includes a pair of keepout pads to isolate internal PCB circuitry (other than ground planes) from electric contact with the assembly components. A threaded faster is used to secure the assembly. In another embodiment, a collar is added to the assembly and the extending portion of the post is elongated such that it extends into the collar, providing additional thread engagement for thinner PCBs. In a third embodiment, hat-section components are secured (e. g. , via wave soldering) over respective holes in the PCB. The hat-section component includes a counterbore through which the threaded fastener passes and is sized to receive a portion of a threaded standoff.
Computer System Having A Chassis-Level Thermal Interface Component And A Frame-Level Thermal Interface Component That Are Thermally Engageable With And Disengageable From One Another
US Patent:
6693797, Feb 17, 2004
Filed:
Jan 4, 2002
Appl. No.:
10/039148
Inventors:
Barrett M. Faneuf - Lakewood WA
David S. De Lorenzo - Olympia WA
Stephen W. Montgomery - Federal Way WA
David S. De Lorenzo - Olympia WA
Stephen W. Montgomery - Federal Way WA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 720
US Classification:
361689, 165 803, 16510433, 174 151, 174 152, 257714, 361700, 361715, 361831, 361690
Abstract:
A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
Frame-Level Thermal Interface Component For Transfer Of Heat From An Electronic Component Of A Computer System
US Patent:
7233491, Jun 19, 2007
Filed:
May 1, 2006
Appl. No.:
11/415559
Inventors:
Barrett M. Faneuf - Lakewood WA, US
David S. De Lorenzo - Olympia WA, US
David S. De Lorenzo - Olympia WA, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 7/20
US Classification:
361689, 165 804, 361690, 361699, 361701, 361703
Abstract:
A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
Frame-Level Thermal Interface Component For Transfer Of Heat From An Electronic Component Of A Computer System
US Patent:
7133283, Nov 7, 2006
Filed:
Jan 4, 2002
Appl. No.:
10/039110
Inventors:
Barrett M. Faneuf - Lakewood WA, US
David S. De Lorenzo - Olympia WA, US
David S. De Lorenzo - Olympia WA, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 7/20
US Classification:
361689, 165 804, 361690, 361699
Abstract:
A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
Increasing Thermal Conductivity Of Thermal Interface Using Carbon Nanotubes And Cvd
US Patent:
6891724, May 10, 2005
Filed:
Jun 12, 2002
Appl. No.:
10/170313
Inventors:
David S. De Lorenzo - Olympia WA, US
Stephen W. Montgomery - Federal Way WA, US
Robert J. Fite - Olympia WA, US
Stephen W. Montgomery - Federal Way WA, US
Robert J. Fite - Olympia WA, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K007/20
US Classification:
361704, 165 802, 165185, 174 163, 361707, 361708, 361718, 361719, 361722, 428216, 428408
Abstract:
The invention relates to a structure of and a process of forming an integrated circuit package that utilizes a thermal interface material layer having an aligned array of carbon nanotubes affixed to a surface of the layer. The thermal interface material is diamond deposited by chemical vapor deposition. The carbon nanotubes are formed by a plasma discharge process on the surface of the CVDD and also may be formed on the surface of the die.
Method And Apparatus For Memory Bandwidth Thermal Budgetting
US Patent:
7269481, Sep 11, 2007
Filed:
Jun 25, 2003
Appl. No.:
10/606514
Inventors:
David S. De Lorenzo - Olympia WA, US
Stephen W. Montgomery - Federal Way WA, US
Warren R. Morrow - Steilacoom WA, US
Robin Steinbrecher - Olympia WA, US
Stephen W. Montgomery - Federal Way WA, US
Warren R. Morrow - Steilacoom WA, US
Robin Steinbrecher - Olympia WA, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
G05D 23/00, G05B 11/01, G05B 13/02, G06F 12/00, G06F 15/00
US Classification:
700299, 700 21, 700 29, 700 31, 700 46, 700 52, 700306, 711154, 702132, 713300
Abstract:
An electronic system includes a device and a controller to the device. The controller is adapted to calculate a temperature estimate of the device and to control access to the device in accordance with the calculated temperature estimate.