DAVID J FIELD
Engineering in South Attleboro, MA
License number
Massachusetts 45025
Issued Date
Oct 24, 2002
Expiration Date
Jun 30, 2018
Type
Civil Engineer
Address
Address
South Attleboro, MA 02703
Personal information
See more information about DAVID J FIELD at radaris.comName
Address
Phone
43 Moon Ct, Dracut, MA 01826
87 Matawanakee Trl, Littleton, MA 01460
4 Putnam Rd, Foxboro, MA 02035
34 Fairway, Lee, MA 01238
34 Fairway Dr, Becket, MA 01223
Professional information
David Field - Attleboro, MA
Work:
Sensata Technologies
Design Engineer Sensata Technologies - Attleboro, MA
Process Engineer Sensata Technologies - Attleboro, MA
Contract Manufacturing Engineer PRC, Inc - Dahlgren, VA
Systems Engineer
Design Engineer Sensata Technologies - Attleboro, MA
Process Engineer Sensata Technologies - Attleboro, MA
Contract Manufacturing Engineer PRC, Inc - Dahlgren, VA
Systems Engineer
Education:
Virginia Polytechnic Institute and State University - Blacksburg, VA
Bachelor of Science in Aerospace Engineering
Bachelor of Science in Aerospace Engineering
Skills:
Design Costing, Design for Manufacturing, Customer Management, Material Types, Component Fabrication, Supplier Sourcing, Design of Experiments, Multi Tasking, Failure Analysis, Lean Manufacturing, ISO9000, TS16949
Hermetic Pressure Sensing Device
US Patent:
7197937, Apr 3, 2007
Filed:
Jan 17, 2006
Appl. No.:
11/333637
Inventors:
Alan G. Amore - Cumberland RI, US
Eric J. Giasson - Somerset MA, US
James I. Ogilvie - Cranston RI, US
Stephen P. Greene - Harmony RI, US
David J. Field - Attleboro MA, US
Andrew F. Willner - Attleboro MA, US
Vanvisa Attaset - Randallstown MD, US
Eric J. Giasson - Somerset MA, US
James I. Ogilvie - Cranston RI, US
Stephen P. Greene - Harmony RI, US
David J. Field - Attleboro MA, US
Andrew F. Willner - Attleboro MA, US
Vanvisa Attaset - Randallstown MD, US
Assignee:
Sensata Technologies, Inc. - Attleboro MA
International Classification:
G01L 7/08
US Classification:
73715, 73718, 73724
Abstract:
A pressure sensing device () is shown having a ceramic capacitive sensing element () received in a chamber formed in a hexport housing (). The hexport housing has a fluid passageway () communicating with a recessed chamber () formed in a bottom wall circumscribed by an annular platform shoulder (). A thin flexible metal diaphragm () is hermetically attached to the bottom wall along the platform shoulder. A curable adhesive resin having a thermal coefficient of expansion and modulus of elasticity appropriately matching that of sensing element (), such as polyurethane, is cast between the sensing element () and the metal diaphragm () forming, when cured, a layer bonded to both members resulting in a sensor that is effective in monitoring negative as well as positive fluid pressures. In one embodiment a ring is used to define layer laterally and in a second embodiment an insulator sleeve () and shield sleeve () which receives pressure sensing element () each have an open end with an inwardly extending lip () that define layer laterally.