DAVID D LEE, MD
Anesthesiologist Assistant at George Mason Dr, Arlington, VA

License number
Virginia 0101045262
Category
Osteopathic Medicine
Type
Anesthesiology
Address
Address 2
1701 N George Mason Dr #2D, Arlington, VA 22205
255 W Michigan Ave, Jackson, MI 49201
Phone
(703) 558-5000
(517) 787-6440
(517) 787-4146 (Fax)

Professional information

David Lee Photo 1

Human Resource Manager . At Us Army

Position:
Human Resources Manager at USSOCOM
Location:
Washington D.C. Metro Area
Industry:
Human Resources
Work:
USSOCOM - Crystal City VA since Mar 2013 - Human Resources Manager US Army 75th Ranger Regiment - Fort Benning GA Sep 2008 - Mar 2013 - Human Resource Spec. Muscogee County School District Feb 2008 - Jul 2008 - Teacher Dalton agency Aug 2007 - Oct 2007 - intern
Education:
Troy University 2010 - 2011
Master of Business Administration (M.B.A.), Human Resources Management and Services
Jacksonville University 2001 - 2007
Bachelor of Arts (B.A.), Communication, Public Relations
Skills:
Human Resources, Marketing, Public Relations, Event Planning, Personnel Management, Athletics, Government, Sports, Press Releases, Policy, Military Operations, Military, Army


David Lee Photo 2

David Lee - Arlington, VA

Work:
Lee Strategy Group
President
Agilex Technologies
Senior Application Developer
Booz Allen Hamilton
Lead Developer and Operations Lead
Accenture
SAP Portal Analyst
General Motors
Controls Integration Engineer
Keithley Instruments
Co-op Engineer
Education:
Carnegie Mellon University - Pittsburgh, PA
BS in Electrical and Computer Engineering


David D Lee Photo 3

David D Lee, Arlington VA

Specialties:
Anesthesiologist
Address:
1701 N George Mason Dr, Arlington, VA 22205
Education:
University of Virginia, School of Medicine - Doctor of Medicine
Hospital of the University of Pennsylvania - Residency - Anesthesiology
Board certifications:
American Board of Anesthesiology Certification in Anesthesiology


David Lee Photo 4

David Lee - Arlington, VA

Work:
RUTGERS DOMESTIC VIOLENCE CLINIC - Camden, NJ
Legal Intern
LAW OFFICE OF GREGORY SCHINELLA, LLC - Philadelphia, PA
Legal Intern
NEW JERSEY OFFICE OF THE PUBLIC DEFENDER - Trenton, NJ
Legal Intern, Appellate Division
LAW OFFICE OF STEPHANIE J. BROWN, LLC - Philadelphia, PA
Legal Assistant
NEW JERSEY OFFICE OF THE PUBLIC DEFENDER - Trenton, NJ
Investigative Intern, Special Hearings Unit
Education:
RUTGERS SCHOOL OF LAW
J.D.
BOSTON UNIVERSITY
B.A. in English Literature


David D Lee Photo 5

Dr. David D Lee, Fairfax VA - MD (Doctor of Medicine)

Specialties:
Diagnostic Radiology
Address:
2722 Merrilee Dr STE 230, Fairfax 22031
(703) 698-4444 (Phone), (703) 698-2176 (Fax)
Languages:
English
Hospitals:
2722 Merrilee Dr STE 230, Fairfax 22031
Virginia Hospital Center - Arlington
1701 North George Mason Dr, Arlington 22205
Education:
Medical School
University of Virginia / Main Campus
Graduated: 2004
University Of Pennsylvania
Graduated: 1990


David D Lee Photo 6

Dr. David D Lee, Arlington VA - MD (Doctor of Medicine)

Specialties:
Anesthesiology
Address:
Dominion Anesthesiology PLLC
1701 N George Mason Dr STE 2D, Arlington 22205
(703) 558-5000 (Phone)
Certifications:
Anesthesiology, 1991
Awards:
Healthgrades Honor Roll
Languages:
English
Education:
Medical School
University of Virginia / Main Campus
Graduated: 1985
University Of Pennsylvania


David Lee Photo 7

System And Method For Multi-Chip Module Die Extraction And Replacement

US Patent:
8067829, Nov 29, 2011
Filed:
Apr 29, 2009
Appl. No.:
12/432672
Inventors:
John A. Hughes - Falls Church VA, US
Thomas E. Love - Gainesville VA, US
Eugene Lemoine - Manassas VA, US
David H. Lee - Arlington VA, US
Christopher Ebel - Manassas VA, US
Assignee:
BAE Systems Information and Electronic Systems Integration Inc. - Nashua NH
International Classification:
H01L 23/02
US Classification:
257686, 257777, 257E25006, 257E25013
Abstract:
A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.


David Lee Photo 8

Processing Cellulosic Biomass

US Patent:
2012004, Feb 16, 2012
Filed:
Jun 22, 2009
Appl. No.:
12/999590
Inventors:
Stephen R. Decker - Golden CO, US
Michael J. Selig - Golden CO, US
Roman Brunecky - Golden CO, US
Todd Vinzant - Golden CO, US
Michael E. Himmell - Golden CO, US
David Lee - Arlington VA, US
Michael Blaylock - Purcellville VA, US
International Classification:
C12P 19/14, C12P 19/00, C12P 19/02, C13K 1/02
US Classification:
435 99, 127 37, 435 72, 435105
Abstract:
Improved systems and methods for reducing costs and increasing yields of cellulosic ethanol are disclosed herein, along with plants genetically transformed for increased biomass, expression of lignocellulolytic enzyme polypeptides, and/or simplification of harvesting and downstream processing. Methods for processing biomass from these transgenic plants that involve less severe and/or less expensive pre-treatment protocols than are typically employed are also disclosed.


David Lee Photo 9

System And Method For Multi-Chip Module Die Extraction And Replacement

US Patent:
8338230, Dec 25, 2012
Filed:
Sep 27, 2011
Appl. No.:
13/245909
Inventors:
John A. Hughes - Falls Church VA, US
Thomas E. Love - Gainesville VA, US
Eugene Lemoine - Manassas VA, US
David H. Lee - Arlington VA, US
Christopher Ebel - Manassas VA, US
Assignee:
BAE Systems Information and Electronic Systems Integration Inc. - Nashua NH
International Classification:
H01L 21/44, H01L 21/48, H01L 21/50
US Classification:
438106, 438109, 257E21499
Abstract:
A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.


David Lee Photo 10

Plant Gene Regulatory Elements

US Patent:
2012007, Mar 29, 2012
Filed:
Jun 1, 2010
Appl. No.:
13/375128
Inventors:
Srinivas Gampala - Manhattan KS, US
Prasanna Kankanala - Manhattan KS, US
David Lee - Arlington VA, US
Emily Puckett - Arlington VA, US
Ramesh Nair - Manhattan KS, US
Forrest Chumley - Manhattan KS, US
Assignee:
EDENSPACE SYSTEMS CORPORATION - Manhattan KS
International Classification:
A01H 5/00, A01H 5/10, C12N 15/82, C12N 15/113, C12N 15/63
US Classification:
800300, 536 241, 4353201, 800298, 800303, 800301, 800302, 800320, 8003201, 8003202, 8003203, 800314, 800306, 8003172, 800312, 800322, 8003173, 8003174
Abstract:
Nucleic acids, vectors, and expression vectors comprising novel plant gene regulatory elements from poplar that can drive heterologous gene expression in plants. Novel transgenic plants expressing heterologous genes under the control of novel gene regulatory elements.