DAVID COURTLAND CHILDERS, MD
Osteopathic Medicine at Hoyt St, Portland, OR

License number

Oregon MD150643

Personal information

See more information about DAVID COURTLAND CHILDERS at radaris.com

Name

Address

Phone

David Childers, age 72

5200 NE 92Nd Ave UNIT 24, Portland, OR 97220

David Childers, age 47

364 SE Pearce Rd, Roseburg, OR 97470

David Childers, age 44

4342 SW Lobelia St, Portland, OR 97219

David Childers, age 69

4113 Wolf Berry Ct, Lake Oswego, OR 97035

(503) 975-1282

David Childers, age 60

9824 SW 60Th Ave, Portland, OR 97219

Professional information

See more information about DAVID COURTLAND CHILDERS at trustoria.com

David Childers

Position:

Chief Executive Officer at Compli, Board Director at Swan Island Networks, Board Director at Attensa, Inc., Principal at CP Kinder Investments, LLC, Executive Chairman of the Board at Technology Association of Oregon, OCEG Fellow at Open Compliance & Ethics Group (OCEG)

Location:

Portland, Oregon Area

Industry:

Information Technology and Services

Work:

Compli - Portland, Oregon Area since Jan 2012 - Chief Executive Officer Swan Island Networks - Portland, Oregon Area since May 2012 - Board Director Attensa, Inc. - Portland, Oregon Area since Apr 2012 - Board Director CP Kinder Investments, LLC - Portland, Oregon Area since Feb 2012 - Principal Technology Association of Oregon - Portland, Oregon Area since Jun 2011 - Executive Chairman of the Board Open Compliance & Ethics Group (OCEG) since 2010 - OCEG Fellow

Skills:

SaaS, Enterprise Software, Start-ups, Strategic Planning, Cloud Computing, Strategic Partnerships, Business Development, Team Building, Project Management, Entrepreneurship, Product Marketing, Process Improvement, Technology Management, Cross-functional Team Leadership, Business Strategy, Interpersonal Leadership, Management, Recruiting, Contract Negotiation, Leadership, Training, Public Speaking, Program Management

Awards:

2013 GRC Technology Innovation Award Winner
GRC 20/20 Research
GRC 20/20 looked through all of the submissions, asked for clarification where needed, and selected the 12 recipients to receive this honor. Some of these recognitions go to established vendors — others go to up-and-comers. Some have mature offerings, others still need some polish — all are advancing GRC into new areas. The current award recipients show thought leadership and innovative solutions. Compli Portfolio was recognized for its seamless integration of internal and external experts in an elegant user experience to illustrate and manage an organization’s compliance and risk profile.
Leader in Innovation Award
GDS International
Compli was recognized by GDS International's 2012 HR Summit as the Leader in Innovation. The Human Resources Summit US is designed to assist forward-thinking Chief HR Officers as they meet the demands of transformation and prepare for the impact their role will have on the overall success of an organization's sustainability and bottom-line.

Dr. David C Childers, Portland OR - MD (Doctor of Medicine)

Specialties:

Internal Medicine

Age:

Address:

PROVIDENCE MEDICAL GROUP NORTHEAST
5050 NE Hoyt St SUITE 540, Portland 97213
(503) 215-6600 (Phone), (503) 215-6857 (Fax)
Providence Med Grp Northeast
5050 NE Hoyt St SUITE 540, Portland 97213
(503) 215-6600 (Phone)

Certifications:

Internal Medicine, 2010

Awards:

Healthgrades Honor Roll

Languages:

English

Education:

Medical School
Rosalind Franklin University of Medicine and Science / Chicago Medical School
Graduated: 2007

David C Childers, Portland OR

Specialties:

Internist

Address:

5050 Ne Hoyt St, Portland, OR 97213

Education:

Doctor of Medicine

Board certifications:

American Board of Internal Medicine Certification in Internal Medicine

David Courtland Childers, Portland OR

Specialties:

Internal Medicine

Work:

PMG Northeast
5050 NE Hoyt St, Portland, OR 97213

Education:

Rosalind Franklin University (2007)

On-The-Fly Manipulation Of Spot Size And Cutting Speed For Real-Time Control Of Trench Depth And Width In Laser Operations

US Patent:

2012014, Jun 14, 2012

Filed:

Feb 17, 2012

Appl. No.:

13/399856

Inventors:

Mehmet E. ALPAY - Portland OR, US
Brian JOHANSEN - Hillsboro OR, US
David CHILDERS - Portland OR, US

Assignee:

Electro Scientific Industries, Inc. - Portland OR

International Classification:

B23K 26/06

US Classification:

21912167

Abstract:

Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.

Process And System For Quality Management And Analysis Of Via Drilling

US Patent:

7544304, Jun 9, 2009

Filed:

Jul 11, 2006

Appl. No.:

11/484531

Inventors:

Hisashi Matsumoto - Hillsboro OR, US
Mark Singer - Tualatin OR, US
Leo Baldwin - Portland OR, US
Jeffrey E. Howerton - Portland OR, US
David V. Childers - Portland OR, US

Assignee:

Electro Scientific Industries, Inc. - Portland OR

International Classification:

H01B 13/00

US Classification:

216 13, 216 12, 216 17, 257739

Abstract:

A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value (such as area and/or volume) within a predetermined distance from a drilling location with respect to a blind via geometry value (such as area and/or volume) to be formed at the drilling location. The process can include setting at least one laser operating parameter based on the evaluation in order to obtain a desired capture pad appearance after blind via formation. The process can include imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate, quantifying at least one appearance value for the imaged capture pad area, and determining an acceptability of the imaged capture pad areas based on the quantified appearance value.

Process And System For Quality Management And Analysis Of Via Drilling

US Patent:

8501021, Aug 6, 2013

Filed:

Mar 27, 2009

Appl. No.:

12/412853

Inventors:

Hisashi Matsumoto - Hillsboro OR, US
Mark Singer - Tualatin OR, US
Leo Baldwin - Portland OR, US
Jeffrey E. Howerton - Portland OR, US
David V. Childers - Portland OR, US

Assignee:

Electro Scientific Industries, Inc. - Portland OR

International Classification:

H01B 13/00

US Classification:

216 13, 216 15, 216 18, 257739, 438612

Abstract:

Method For Defining Safe Zones In Laser Machining Systems

US Patent:

8024060, Sep 20, 2011

Filed:

Sep 30, 2008

Appl. No.:

12/241413

Inventors:

Mehmet E. Alpay - Portland OR, US
Heny Sadikin - Portland OR, US
David Childers - Portland OR, US

Assignee:

Electro Scientific Industries, Inc. - Portland OR

International Classification:

G06F 19/00, G06K 9/00

US Classification:

700177, 382152, 700166, 700182, 700184, 700185, 700186

Abstract:

A method for defining machine cutting path safety zones for use in laser machining devices. The method includes indentifying safety zone positional coordinates in a computer aided design model, using a machine vision system to image the modeled physical machining device, determining the positional difference between the design model safety zone points and the imaged points and converting the design model safety zone coordinates into machine specific coordinates for input into a machining cutting path program.

Method And Apparatus For Laser Drilling Holes With Gaussian Pulses

US Patent:

2012026, Oct 25, 2012

Filed:

Jul 2, 2012

Appl. No.:

13/539991

Inventors:

Jeff Howerton - Portland OR, US
David Childers - Portland OR, US
Brian Johansen - Hillsboro OR, US
Mehmet Emin Alpay - Portland OR, US

Assignee:

ELECTRO SCIENTIFIC INDUSTRIES, INC - Portland OR

International Classification:

B23K 26/00

US Classification:

21912171

Abstract:

An improved method and apparatus for drilling tapered holes in workpieces with laser pulses is presented which uses defocused laser pulses to machine the holes with specified taper and surface finish while maintaining specified exit diameters and improved system throughput. A system is described which can also drill holes with the desired taper and surface finish without requiring defocused laser pulses.