DAVID BYARD TAYLOR
Pilots at 6 Ave, Spokane Valley, WA
License number
Washington A4198441
Issued Date
Jul 2016
Expiration Date
Jul 2018
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
19921 E 6Th Ave, Spokane Valley, WA 99016
Professional information
David Taylor - Spokane Valley, WA
Work:
Taylor made Construction - Spokane Valley, WA
Owner/Operator VPI - Spokane, WA
Production Manager Exteriors Unlimited - Spokane, WA
Vice President
Owner/Operator VPI - Spokane, WA
Production Manager Exteriors Unlimited - Spokane, WA
Vice President
Education:
Great Falls High - Great Falls, MT
High school diploma
High school diploma
Rfi Shielding Gasket
US Patent:
4889959, Dec 26, 1989
Filed:
Jul 15, 1988
Appl. No.:
7/219515
Inventors:
David B. Taylor - Greenacres WA
Steven C. Zemke - Post Falls ID
Steven C. Zemke - Post Falls ID
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
H05K 900
US Classification:
174 35GC
Abstract:
The connection and shielding system for modular RF circuits encases modular circuitboards (10) within five-sided enclosures (11). The sixth side of each enclosure is provided by the top ground plane of a base circuitboard (20) that supports and electrically interconnects the components of the modular circuitboards (10). Enclosures (11) are fixed to a grounded metal socket formed by fence strips (22) and metal inserts (23) which form upwardly open slots including yieldable longitudinal gaskets (50). Gaskets (50) yieldably grip the open end of enclosures (11) and seal them against escaping radiation. Further radiation shielding is provided about the base circuitboard (20) by the fact that the conductive signal traces provided in it are sandwiched between two continuous ground planes and run between plated-through vias joining the ground planes. The ends of each enclosure are provided with double wall baffles (17, 18) which provide airflow to the interior and RFI shielding through offset open apertures (13).
Double Wall Baffle For Airflow And Rfi Shielding
US Patent:
4872090, Oct 3, 1989
Filed:
Jul 15, 1988
Appl. No.:
7/219672
Inventors:
David B. Taylor - Greenacres WA
Steven C. Zemke - Post Falls ID
Steven C. Zemke - Post Falls ID
Assignee:
Hewlett Packard Company - Palo Alto CA
International Classification:
H05K 900
US Classification:
361424
Abstract:
The connection and shielding system for modular RF circuits encases modular circuitboards (10) with five-sided enclosures (11). The sixth side of each enclosure is provided by the top ground plane of a base circuitboard (20) that supports and electrically interconnects the components of the modular circuitboards (10). Enclosures (11) are fixed to a grounded metal socket formed by fence strips (22) and metal inserts (23) which form upwardly open slots including yieldable longitudinal gaskets (50). Gaskets (50) yieldably grip the open end of enclosures (11) and seal them against escaping radiation. Further radiation shielding is provided about the base circuitboard (20) by the fact that the conductive signal traces provided in it are sandwiched between two continuous ground planes and run between plated-through vias joining the ground planes. The ends of each enclosure are provided with double wall baffles (17, 18) which provide airflow to the interior and RFI shielding through offset open apertures (13).
Rf Interconnect And Shielding System
US Patent:
4868716, Sep 19, 1989
Filed:
Jul 15, 1988
Appl. No.:
7/220049
Inventors:
David B. Taylor - Greenacres WA
Steven C. Zemke - Post Falls ID
Steven C. Zemke - Post Falls ID
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
H05K 900
US Classification:
361424
Abstract:
The connection and shielding system for modular RF circuits encases modular circuitboards (10) within five-sided enclosures (11). The sixth side of each enclosure is provided by the top ground plane of a base circuitboard (20) that supports and electrically interconnects the components of the modular circuitboards (10). Enclosures (11) are fixed to a grounded metal socket formed by fence strips (22) and metal inserts (23) which form upwardly open slots including yieldable longitudinal gaskets (50). Gaskets (50) yieldably grip the open end of enclosures (11) and seal them against escaping radiation. Further radiation shielding is provided about the base circuitboard (20) by the fact that the conductive signal traces provided in it are sandwiched between two continuous ground planes and run between plated-through vias joining the ground planes. The ends of each enclosure are provided with double wall baffles (17, 18) which provide airflow to the interior and RFI shielding through offset open apertures (13).