DAVID AUSTIN SAUER, MD
Medical Practice at Sam Jackson Park Rd, Portland, OR
License number
Oregon MD22840
Category
Medical Practice
Type
Anatomic Pathology & Clinical Pathology
Address
Address
3181 SW Sam Jackson Park Rd, Portland, OR 97239
Phone
(503) 494-8276
(503) 494-2025 (Fax)
(503) 494-2025 (Fax)
Personal information
See more information about DAVID AUSTIN SAUER at radaris.comName
Address
Phone
411 SW Bancroft St, Portland, OR 97239
253 Connecticut Ave SE, Salem, OR 97317
6455 SW Nyberg Ln APT B105, Tualatin, OR 97062
82385 Weiss Rd, Creswell, OR 97426
13141 SW Bouneff St, Portland, OR 97223
Professional information
See more information about DAVID AUSTIN SAUER at trustoria.com
Owner At Timeless Properties,Llc
Owner At Timeless Properties,Llc
Position:
Owner at Sauer Pacific Investments
Location:
Portland, Oregon Area
Industry:
Real Estate
Work:
Sauer Pacific Investments
- Eastbay CA. since Jul 1998
-
Owner
Education:
Buena High School, United Brotherhood of Carpenters 1984 - 1986
yes, Carpentry, Construction Management
yes, Carpentry, Construction Management
Skills:
Residential Homes, REO, Foreclosures, Renovation, Construction, Property, Investments, Contractors, Real Estate, Investment Properties
David Austin Sauer, Portland OR
David Austin Sauer, Portland OR
Specialties:
Pathology, Anatomic Pathology & Clinical Pathology, Cytopathology
Work:
Oregon Health & Science University
3181 SW Sam Jackson Park Rd, Portland, OR 97239
3181 SW Sam Jackson Park Rd, Portland, OR 97239
Education:
Oregon Health & Science University (1996)
Dr. David A Sauer, Portland OR - MD (Doctor of Medicine)
Dr. David A Sauer, Portland OR - MD (Doctor of Medicine)
Specialties:
Cytopathology
Address:
OREGON HEALTH AND SCIENCE UNIVERSITY
3181 SW Sam Jackson Park Rd, Portland 97239
(503) 494-8311 (Phone), (503) 494-4997 (Fax)
OREGON HEALTH AND SCIENCE UNIVERSITY
3181 SW Sam Jackson Park Rd, Portland 97239
(503) 494-8311 (Phone), (503) 494-3092 (Fax)
3181 SW Sam Jackson Park Rd, Portland 97239
(503) 494-8311 (Phone), (503) 494-4997 (Fax)
OREGON HEALTH AND SCIENCE UNIVERSITY
3181 SW Sam Jackson Park Rd, Portland 97239
(503) 494-8311 (Phone), (503) 494-3092 (Fax)
Certifications:
Anatomic & Clinical Pathology, 2001, Cytopathology, 2003
Awards:
Healthgrades Honor Roll
Languages:
English
Hospitals:
OREGON HEALTH AND SCIENCE UNIVERSITY
3181 SW Sam Jackson Park Rd, Portland 97239
OREGON HEALTH AND SCIENCE UNIVERSITY
3181 SW Sam Jackson Park Rd, Portland 97239
OHSU Hospital
3181 West Sam Jackson Park Rd, Portland 97239
3181 SW Sam Jackson Park Rd, Portland 97239
OREGON HEALTH AND SCIENCE UNIVERSITY
3181 SW Sam Jackson Park Rd, Portland 97239
OHSU Hospital
3181 West Sam Jackson Park Rd, Portland 97239
Education:
Medical School
Oregon Health Sciences University
Graduated: 1995
Or Health Science University Hospital
Oregon Health Sciences University
Graduated: 1995
Or Health Science University Hospital
Anode And Anode Chamber For Copper Electroplating
Anode And Anode Chamber For Copper Electroplating
US Patent:
6821407, Nov 23, 2004
Filed:
Aug 27, 2002
Appl. No.:
10/231147
Inventors:
Jonathan D. Reid - Sherwood OR
Timothy Mark Archer - Lake Oswego OR
Thomas Tan Vu - San Jose CA
Seshasayee Varadarajan - Wilsonville OR
Jon Henri - West Linn OR
Steven T. Mayer - Lake Oswego OR
David Sauer - Tigard OR
Anita Kang - Portland OR
Gerald Feldewerth - Beaverton OR
Timothy Mark Archer - Lake Oswego OR
Thomas Tan Vu - San Jose CA
Seshasayee Varadarajan - Wilsonville OR
Jon Henri - West Linn OR
Steven T. Mayer - Lake Oswego OR
David Sauer - Tigard OR
Anita Kang - Portland OR
Gerald Feldewerth - Beaverton OR
Assignee:
Novellus Systems, Inc. - San Jose CA
International Classification:
C25D 338
US Classification:
205292, 204252, 204282, 204237, 204238
Abstract:
An electroplating system includes (a) a phosphorized anode having an average grain size of at least about 50 micrometers and (b) plating apparatus that separates the anode from the cathode and prevents most particles generated at the anode from passing to the cathode. The separation may be accomplished by interposing a microporous chemical transport barrier between the anode and cathode. The relatively few particles that are generated at the large grain phosphorized copper anode are prevented from passing into the cathode (wafer) chamber area and thereby causing a defect in the part.