DAVID A KAISAKI, MD
Marriage and Family Therapists at Johnson St, Minneapolis, MN

License number
Minnesota 47689
Category
Osteopathic Medicine
Type
Family Medicine
Address
Address
2849 Johnson St NE, Minneapolis, MN 55418
Phone
(612) 706-4500
National Provider ID: 1730271669
LicenseFiles verified this license of Nov 7, 2017 at the National Plan and Provider Enumeration System.

Personal information

See more information about DAVID A KAISAKI at radaris.com
Name
Address
Phone
David Kaisaki
3034 Garfield St NE, Minneapolis, MN 55418
David Kaisaki
749 Mount Curve Blvd, Saint Paul, MN 55116

Professional information

David A Kaisaki Photo 1

David A Kaisaki, Minneapolis MN
Specialties:
Family Physician
Address:
2849 Johnson St Ne, Minneapolis, MN 55418
1575 Beam Ave, Maplewood, MN 55109
Board certifications:
American Board of Family Medicine Certification in Family Medicine

David Kaisaki Photo 2

Compositions And Methods For Modifying A Surface Suited For Semiconductor Fabrication

US Patent:
2012009, Apr 19, 2012
Filed:
Dec 7, 2011
Appl. No.:
13/313529
Inventors:
Heather K. Kranz - North Oaks MN, US
Thomas E. Wood - Stillwater MN, US
David A. Kaisaki - Minneapolis MN, US
John J. Gagliardi - Hudson WI, US
John C. Clark - White Bear Lake MN, US
Patricia M. Savu - Maplewood MN, US
Phillip G. Clark - Eden Prairie MN, US
International Classification:
H01L 21/306
US Classification:
438692, 257E2123
Abstract:
The method of the present invention comprises providing a wafer including a first, second and third material; contacting the third material in the presence of a working liquid with abrasive composites fixed to an abrasive article; and moving the wafer until an exposed surface of the wafer is substantially planar and comprises at least one area of exposed third material and one area of exposed second material. The components of the working liquid include an aqueous solvent; a pH buffer exhibiting a pKgreater than 7 and comprising a basic pH adjusting agent and a multidentate acidic complexing agent; and a non-ionic surfactant. The nonionic surfactant exhibits a hydrophile-lipophile balance of at least about 4. The working liquid is substantially free of loose abrasive particles and exhibits a pH of about 7-12.

David Kaisaki Photo 3

Compositions And Methods For Modifying A Surface Suited For Semiconductor Fabrication

US Patent:
8092707, Jan 10, 2012
Filed:
Aug 15, 2007
Appl. No.:
11/839329
Inventors:
L. Charles Hardy - St. Paul MN, US
Heather K. Kranz - North Oaks MN, US
Thomas E. Wood - Stillwater MN, US
David A. Kaisaki - Minneapolis MN, US
John J. Gagliardi - Hudson WI, US
John C. Clark - White Bear Lake MN, US
Patricia M. Savu - Maplewood MN, US
Philip G. Clark - Eden Prairie MN, US
Assignee:
3M Innovative Properties Company - St. Paul MN
International Classification:
C09K 13/00
US Classification:
252 791, 252 792, 252 793, 252 794, 438689, 438690, 438691, 438692
Abstract:
The disclosure pertains to compositions and methods for modifying or refining the surface of a wafer suited for semiconductor fabrication. The compositions include working liquids useful in modifying a surface of a wafer suited for fabrication of a semiconductor device. In some embodiments, the working liquids are aqueous solutions of initial components substantially free of loose abrasive particles, the components including water, a surfactant, and a pH buffer exhibiting at least one pKgreater than 7. In certain embodiments, the pH buffer includes a basic pH adjusting agent and an acidic complexing agent, and the working liquid exhibits a pH from about 7 to about 12. In further embodiments, the disclosure provides a fixed abrasive article comprising a surfactant suitable for modifying the surface of a wafer, and a method of making the fixed abrasive article. Additional embodiments describe methods that may be used to modify a wafer surface.

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