DARREN LLOYD STOUT
Pilots at 6 Pl, Oklahoma City, OK
License number
Oklahoma A2971619
Issued Date
Mar 2017
Expiration Date
Mar 2019
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
1217 NW 6Th Pl, Oklahoma City, OK 73170
Professional information
Emi/Emc/Tempest Engineer And Eme Team Lead At Boeing
Position:
Martial Arts Instructor at FBC - Moore, OK, EMI/EMC/TEMPEST Engineer and EME Team Lead at Boeing
Location:
Oklahoma City, Oklahoma Area
Industry:
Aviation & Aerospace
Work:
FBC - Moore, OK
- Moore, OK since Nov 2008
-
Martial Arts Instructor
Boeing
- Oklahoma City, Oklahoma Area since Jul 2001
-
EMI/EMC/TEMPEST Engineer and EME Team Lead
Oklahoma State University
1996 - 2002
-
Adjunct - Electrical Engineering Technology
Bell Labs Lucent Technologies
1996 - 2001
-
Member of Technical Staff
BancTec
1993 - 1996
-
Product Safety Engineer
United States Air Force
1992 - 1993
-
552 OSS Section Commander
United States Air Force
1989 - 1992
-
B-52 Radar Navigator
Education:
TEMPEST School - Lackland AFB 2003 - 2006
CTP Level 2, TEMPEST Specialized Undergraduate Navigator Training - SUNT 1987 - 1988
Rated Navigator, Aeronautical Navigation University of Michigan 1983 - 1987
BSEE, Electrical Engineering Western High School 1979 - 1983
High School Degree, Electronics emphasis
CTP Level 2, TEMPEST Specialized Undergraduate Navigator Training - SUNT 1987 - 1988
Rated Navigator, Aeronautical Navigation University of Michigan 1983 - 1987
BSEE, Electrical Engineering Western High School 1979 - 1983
High School Degree, Electronics emphasis
Skills:
Electromagnetic Compatibility, TEMPEST, Technical Leadership, Public Speaking, Lightning, Graphics, Martial Arts, EMI/EMC, Music, Electromagnetic Effects, Electromagnetics, Engineering Management, Antennas
Interests:
playing music (anything with strings, keyboards, drums, and flutes), martial arts (ninjustu, tae kwan do, and tai chi), and technical gadgets.
Very Low Magnetic Field Integrated Circuit
US Patent:
6414383, Jul 2, 2002
Filed:
Jul 16, 1999
Appl. No.:
09/354657
Inventors:
Darren Lloyd Stout - Moore OK
Assignee:
Agere Systems Guardian Corp. - Miami Lakes FL
International Classification:
H01L 2320
US Classification:
257682, 257630
Abstract:
An integrated electronic device package includes an enclosing structure and a substrate secured within the enclosing structure. At least one first electrical connector protrudes through a first face of the enclosing structure. At least one integrated circuit chip is included within the enclosing structure. The at least one integrated circuit chip is mechanically connected to the substrate and electrically connected to the at least one first electrical connector. Radio-frequency signals are emitted from the at least one integrated circuit chip. A first radiation absorbing device is disposed within the enclosing structure and between the at least one integrated circuit chip and a second face of the enclosing structure.